Printed circuit board

Patent metadata

Field	Value
Publication number	US-11558961-B2
Application number	US-201916662094-A
Country	US
Kind code	B2
Filing date	Oct 24, 2019
Priority date	May 29, 2019
Publication date	Jan 17, 2023
Grant date	Jan 17, 2023

Abstract

A printed circuit board includes a first insulating layer having a through hole, and a via disposed to fill the through hole and to be extended to at least one surface of the first insulating layer, wherein the via includes a plating layer having an inner wall part disposed on an inner wall of the through hole and a land part extended from the inner wall part and disposed on the at least one surface of the first insulating layer, and a metal paste layer including metal particles, and filled in the rest of the through hole and disposed on the plating layer.

First claim

What is claimed is:

1. A printed circuit board comprising:
a first insulating layer comprising a through hole;
a via, disposed to fill the through hole and to be extended to at least one surface of the first insulating layer, the via comprising:
a plating layer comprising an inner wall part disposed on an inner wall of the through hole and a land part extended from the inner wall part and disposed on the at least one surface of the first insulating layer;
a metal paste layer comprising metal particles, and filled in the rest of the through hole and disposed on the plating layer and an upper surface of the land part; and
a metal layer disposed on an upper surface of the metal paste layer; and

a first circuit pattern, disposed on the first insulating layer, comprising the metal paste layer.

2. The printed circuit board of claim 1 , wherein the metal paste layer disposed on the first insulating layer comprises a flat surface, and the metal layer disposed thereon.

3. The printed circuit board of claim 2 , wherein a land of the via comprises the plating layer, the metal paste layer and the metal layer sequentially laminated.

4. The printed circuit board of claim 3 , wherein the first circuit pattern further comprises the plating layer, and the metal layer, and
wherein the plating layer, the metal paste layer, and the metal layer of the first circuit pattern are sequentially laminated.

5. The printed circuit board of claim 1 , wherein the land part in the plating layer is extended to one surface of the first insulating layer and the via further comprises a land plating layer disposed on the other surface of the first insulating layer to cover the metal paste layer.

6. The printed circuit board of claim 5 , wherein the metal paste layer protrudes on the land part on the one surface of the first insulating layer and is embedded by the land plating layer on the other surface of the first insulating layer.

7. The printed circuit board of claim 1 , further comprising a second insulating layer disposed on the first insulating layer and embedding the via; and
a second circuit pattern disposed on the second insulating layer.

8. The printed circuit board of claim 1 , further comprising an antenna disposed on a first surface of the at least one surface and connected by the via to an electronic component disposed on a second surface of the at least one surface opposite to the first surface.

9. The printed circuit board of claim 1 , wherein the land part comprises a first land part extending in a first direction on the at least one surface of the first insulating layer and a second land part extending in a second direction, different from the first direction, on the at least one surface of the first insulating layer.

10. The printed circuit board of claim 9 , wherein the metal layer extends over the first land part and the second land part.

11. A printed circuit board comprising:
a first insulating layer comprising a through hole;
a via, disposed to fill the through hole and to be extended to at least one surface of the first insulating layer, the via comprising;
a plating layer comprising an inner wall part disposed on an inner wall of the through hole and a land part extended from the inner wall part and disposed on the at least one surface of the first insulating layer;
a metal paste layer comprising metal particles, and filled in the rest of the through hole and disposed on the plating layer and an upper surface of the land part; and
a metal layer disposed on an upper surface of the metal paste layer,

wherein the plating layer is extended to both surfaces of the first insulating layer and further comprises a middle part extended from the inner wall part to block the through hole to divide the inner space of the through hole.

Assignees

• Samsung Electro Mech

Inventors

• Choi Jungwoo
• Min Tae-Hong

Classifications

• H05K3/246

  Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating · CPC title

• H05K3/361

  Assembling flexible printed circuits with other printed circuits · CPC title

• H05K3/0047

  Drilling of holes · CPC title

• H05K3/4623

  the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K3/462 takes precedence) · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title