Two-dimensional structure to form an embedded three-dimensional structure
US-10490348-B2 · Nov 26, 2019 · US
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Mikulka Robert Paul patents
Mikulka Robert Paul is listed as an inventor on 43 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mikulka Robert Paul |
| Total patents | 43 |
| First publication | Jan 15, 2015 |
| Latest publication | Nov 26, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Varying thickness inductor
US-10354795-B2 · Jul 16, 2019 · US
Substrate comprising an embedded inductor and a thin film magnetic core
US-10290414-B2 · May 14, 2019 · US
Tunable matching network
US-10187031-B2 · Jan 22, 2019 · US
Double-sided circuit
US-10103703-B2 · Oct 16, 2018 · US
Wafer level package (WLP) ball support using cavity structure
US-10074625-B2 · Sep 11, 2018 · US
Encapsulation of acoustic resonator devices
US-10069474-B2 · Sep 4, 2018 · US
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications
US-9966426-B2 · May 8, 2018 · US
Frequency multiplexer
US-9906318-B2 · Feb 27, 2018 · US
LC filter layer stacking by layer transfer to make 3D multiplexer structures
US-9876513-B2 · Jan 23, 2018 · US
Recent patents
Latest publications not already listed above.
Two-dimensional structure to form an embedded three-dimensional structure
US-2017372831-A1 · Dec 28, 2017 · US
Double-sided circuit
US-2017338788-A1 · Nov 23, 2017 · US
Tunable matching network
US-2017331445-A1 · Nov 16, 2017 · US
Lc filter layer stacking by layer transfer to make 3d multiplexer structures
US-2017288707-A1 · Oct 5, 2017 · US
Superposed structure 3D orthogonal through substrate inductor
US-9666362-B2 · May 30, 2017 · US
Varactor device with backside contact
US-9660110-B2 · May 23, 2017 · US
Acoustic resonator devices
US-2017141756-A1 · May 18, 2017 · US
Wafer level package (wlp) ball support using cavity structure
US-2017084565-A1 · Mar 23, 2017 · US
Augmented capacitor structure for high quality (q)-factor radio frequency (rf) applications
US-2017077214-A1 · Mar 16, 2017 · US
Substrate comprising an embedded inductor and a thin film magnetic core
US-2017062120-A1 · Mar 2, 2017 · US
Face-up substrate integration with solder ball connection in semiconductor package
US-2016381809-A1 · Dec 29, 2016 · US
Varying thickness inductor
US-2016358709-A1 · Dec 8, 2016 · US
Face-up substrate integration with solder ball connection in semiconductor package
US-9468098-B2 · Oct 11, 2016 · US
Varying thickness inductor
US-9449753-B2 · Sep 20, 2016 · US
High pass filters and low pass filters using through glass via technology
US-9425761-B2 · Aug 23, 2016 · US
Metal-insulator-metal (mim) capacitors arranged in a pattern to reduce inductance, and related methods
US-2016181233-A1 · Jun 23, 2016 · US
Superposed structure 3d orthogonal through substrate inductor
US-2016163450-A1 · Jun 9, 2016 · US
Stress mitigation structure for wafer warpage reduction
US-9343403-B2 · May 17, 2016 · US
Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology
US-9343399-B2 · May 17, 2016 · US
Composite dilation mode resonators
US-9331666-B2 · May 3, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 41 |
| Qualcomm Mems Technologies Inc | 3 |
| Lo Chi Shun | 1 |
| Lan Je-Hsiung Jeffrey | 1 |
| Velez Mario Francisco | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01F17/0013 | 14 |
| H01F27/2804 | 12 |
| H01F41/041 | 12 |
| H10W20/497 | 9 |
| H10D1/20 | 9 |