Encapsulation of acoustic resonator devices

Patent metadata

Field	Value
Publication number	US-10069474-B2
Application number	US-201615137662-A
Country	US
Kind code	B2
Filing date	Apr 25, 2016
Priority date	Nov 17, 2015
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

A device includes an acoustic resonator embedded within an encapsulating structure that at least partially encapsulates the acoustic resonator. The device includes an inductor electrically connected to the acoustic resonator. At least a portion of the inductor is embedded in the encapsulating structure.

First claim

What is claimed is:

1. A device comprising:
an acoustic resonator embedded within an encapsulating structure that at least partially encapsulates the acoustic resonator; and
an inductor electrically connected to the acoustic resonator, the inductor having at least one coil surrounding the acoustic resonator.

2. The device of claim 1 , further comprising a capacitor electrically connected to the acoustic resonator.

3. The device of claim 2 , wherein the capacitor comprises a metal-insulator-metal (MIM) capacitor including a first metal layer and a second metal layer.

4. The device of claim 3 , wherein the inductor includes an interconnect disposed proximate to the encapsulating structure, and wherein the first metal layer of the MIM capacitor includes the interconnect.

5. The device of claim 2 , comprising:
a first filter including the acoustic resonator; and
a second filter including the capacitor and the inductor.

6. The device of claim 5 , wherein the first filter corresponds to an acoustic bandpass filter.

7. The device of claim 1 , wherein at least a portion of the inductor is disposed in the encapsulating structure.

8. The device of claim 1 , wherein the acoustic resonator corresponds to a surface acoustic wave (SAW) resonator, a bulk acoustic wave (BAW) resonator, or a thin-film bulk acoustic resonator (FBAR).

9. The device of claim 1 , wherein the acoustic resonator includes a resonator structure and a capping layer between the resonator structure and the encapsulating structure, the capping layer defining a cavity in which the resonator structure is configured to vibrate.

10. The device of claim 9 , wherein the capping layer comprises silicon, and wherein the encapsulating structure comprises glass or a polymer.

11. The device of claim 1 , wherein the at least one coil includes four interconnects arranged in a substantially rectangular shape, wherein a first interconnect is disposed on a first surface of the encapsulating structure, wherein a second interconnect is disposed on a second surface of the encapsulating structure, and wherein the first surface is opposite the second surface of the encapsulating structure.

12. The device of claim 1 , wherein the at least one coil includes four interconnects arranged in a substantially rectangular shape, wherein a first interconnect comprises a first conductive via extending through the encapsulating structure, wherein a second interconnect comprises a second conductive via extending through the encapsulating structure, and wherein the first and second interconnects are disposed on opposite sides of the acoustic resonator.

13. The device of claim 1 , further comprising a communications device, a personal digital assistant (PDA), a mobile phone, a cellular phone, a navigation device, a computer, a portable computer, a desktop computer, a set top box, an entertainment unit, a fixed location data unit, a mobile location data unit, a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a video player, a digital video player, a digital video disc (DVD) player, a portable digital video player, or a combination thereof, in which the acoustic resonator and the inductor are disposed.

14. A device comprising:
an inductor including a plurality of coils defining an interior region; and
an acoustic resonator disposed within the interior region of the plurality of coils.

15. The device of claim 14 , further comprising a substrate, wherein the acoustic resonator is embedded within the substrate.

16. The device of claim 15 , wherein the substrate comprises a glass material, a polymer material, or both.

17. The device of claim 15 , wherein at least one coil of the plurality of coils includes four interconnects arranged in a substantially rectangular shape, wherein a first interconnect comprises a first conductive via extending through the substrate, wherein a second interconnect comprises a second conductive via extending through the substrate, and wherein the first and second interconnects are disposed on opposite sides of the acoustic resonator.

18. The device of claim 15 , wherein at least one coil of the plurality of coils includes a first conductive interconnect on a first surface of the substrate, a second conductive interconnect on a second surface of the substrate, and at least one conductive via embedded in the substrate.

19. The device of claim 14 , wherein the acoustic resonator corresponds to a surface acoustic wave (SAW) resonator, a bulk acoustic wave (BAW) resonator, or a thin-film bulk acoustic resonator (FBAR).

20. The device of claim 14 , further comprising an electronic device in which the inductor and the acoustic resonator are disposed.

21. The device of claim 14 , further comprising a communications device, a personal digital assistant (PDA), a mobile phone, a cellular phone, a navigation device, a computer, a portable computer, a desktop computer, a set top box, an entertainment unit, a fixed location data unit, a mobile location data unit, a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a video player, a digital video player, a digital video disc (DVD) player, a portable digital video player, or a combination thereof, in which the inductor and the acoustic resonator are disposed.

22. A method of fabricating a device using a glass molding process, the method comprising:
forming an encapsulating structure to enclose an acoustic resonator in a glass substrate;
forming at least a portion of an inductor on the encapsulating structure that encloses an acoustic resonator; and
electrically connecting the inductor to the acoustic resonator.

23. The method of claim 22 , further comprising forming a conductive layer on a capping layer, wherein the capping layer is disposed over the acoustic resonator, and wherein the inductor is electrically connected to the conductive layer by at least one conductive via.

24. The method of claim 22 , further comprising forming a capacitor electrically coupled to the inductor.

25. The method of claim 24 , wherein the capacitor is formed by:
forming a dielectric layer on at least a portion of the inductor; and
forming a conductive layer on the dielectric layer.

26. The method of claim 22 , wherein forming at least the portion of the inductor comprises:
forming a plurality of conductive vias through the encapsulating structure;
forming a plurality of first conductive interconnects on a first surface of the encapsulating structure; and
forming a plurality of second conductive interconnects on a second surface of the encapsulating structure, wherein the plurality of conductive vias, the plurality of first conductive interconnects, and the plurality of second conductive interconnects form the inductor.

27. The method of claim 26 , wherein the acoustic resonator is electrically connected to the inductor by at least one of the plurality of conductive vias.

28. A method of fabricating a device, the method comprising:
forming an encapsulating structure that at least partially encapsulates an acoustic resonator; and
forming at least one coil of a plurality of coils of an inductor, the at least one coil surrounding the acoustic resonator, the inductor electrically connected to the acoustic

Assignees

• Qualcomm Inc

Inventors

• Yun Changhan Hobie
• Zuo Chengjie
• Kim Daeik Daniel
• Velez Mario Francisco
• Mudakatte Niranjan Sunil
• Lan Je-Hsiung Jeffrey
• Berdy David Francis
• Ma Yunfei
• Mikulka Robert Paul
• Kim Jonghae

Classifications

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H01F2017/0026

  Multilayer LC-filter · CPC title

• H03H9/0561

  consisting of a multilayered structure · CPC title

• H03H9/1014

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device · CPC title