Two-dimensional structure to form an embedded three-dimensional structure

Patent metadata

Field	Value
Publication number	US-10490348-B2
Application number	US-201615192802-A
Country	US
Kind code	B2
Filing date	Jun 24, 2016
Priority date	Jun 24, 2016
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

Disclosed is an apparatus including a plurality of vias each having a defined shape, wherein each of the plurality of vias includes a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape, a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer. The apparatus further includes a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

First claim

What is claimed is:

1. An apparatus, comprising:
a plurality of vias each having a defined shape, wherein each of the plurality of vias comprises:
a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape,
a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and
a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer; and

a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

2. The apparatus of claim 1 , wherein the apparatus comprises an inductor device.

3. The apparatus of claim 2 , wherein the defined shape is a curved shape.

4. The apparatus of claim 3 , further comprising a magnetic core of the inductor device within an aperture defined by the curved shape of the plurality of vias.

5. The apparatus of claim 2 , wherein the defined shape is an “I” shape.

6. The apparatus of claim 1 , wherein the defined shape is a “C” shape.

7. The apparatus of claim 1 , wherein the defined shape is a semicircle shape.

8. The apparatus of claim 1 , wherein the apparatus comprises an embedded three-dimensional (3D) coil.

9. The apparatus of claim 1 , wherein the via directly couples the first two-dimensional conductive layer to the second two-dimensional conductive layer.

10. The apparatus of claim 1 , wherein the via substantially matches the defined shape.

11. The apparatus of claim 10 , wherein the defined shape is one of a “C” shape or a semicircle shape.

12. The apparatus of claim 1 , wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer are parallel to each other.

13. The apparatus of claim 12 , wherein a first portion of the first two-dimensional conductive layer is coplanar with a second portion of the second two-dimensional conductive layer.

14. The apparatus of claim 13 , wherein the first portion and the second portion are separated by the via.

15. An apparatus, comprising:
a plurality of vias each having a defined shape, wherein each of the plurality of vias comprises:
a first two-dimensional conductive means plated on a first side of a substrate, the first two-dimensional conductive means having the defined shape,
a second two-dimensional conductive means plated on a second side of the substrate, the second two-dimensional conductive means having the defined shape, and
means for conductively coupling the first two-dimensional conductive means to the second two-dimensional conductive means; and

a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive means and the second two-dimensional conductive means of each of the plurality of vias are perpendicular to the plurality of interconnects.

16. The apparatus of claim 15 , wherein the apparatus comprises an inductor device.

17. The apparatus of claim 16 , wherein the defined shape is a curved shape.

18. The apparatus of claim 17 , further comprising a magnetic core of the inductor device within an aperture defined by the curved shape of the plurality of vias.

19. The apparatus of claim 16 , wherein the defined shape is an “I” shape.

20. The apparatus of claim 15 , wherein the defined shape is a “C” shape.

21. The apparatus of claim 15 , wherein the apparatus comprises an embedded three-dimensional (3D) coil.

Assignees

• Qualcomm Inc

Inventors

• Velez Mario Francisco
• Kim Daeik Daniel
• Mudakatte Niranjan Sunil
• Berdy David Francis
• Yun Changhan Hobie
• Kim Jonghae
• Zuo Chengjie
• Ma Yunfei
• Mikulka Robert Paul

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W72/0198

  batch processes · CPC title