High pass filters and low pass filters using through glass via technology

Patent metadata

Field	Value
Publication number	US-9425761-B2
Application number	US-201314055707-A
Country	US
Kind code	B2
Filing date	Oct 16, 2013
Priority date	May 31, 2013
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

A filter includes a glass substrate having through substrate vias. The filter also includes capacitors supported by the glass substrate. The capacitors may have a width and/or thickness less than a printing resolution. The filter also includes a 3D inductor within the substrate. The 3D inductor includes a first set of traces on a first surface of the glass substrate coupled to the through substrate vias. The 3D inductor also includes a second set of traces on a second surface of the glass substrate coupled to opposite ends of the through substrate vias. The second surface of the glass substrate is opposite the first surface of the glass substrate. The through substrate vias and traces operate as the 3D inductor. The first set of traces and the second set of traces may also have a width and/or thickness less than the printing resolution.

First claim

What is claimed is:

1. A filter fabricated using a semiconductor process, comprising:
a glass substrate having a plurality of through substrate vias;
a plurality of capacitors supported by the glass substrate, a width of at least one of the plurality of capacitors being less than ten micrometers and a thickness of the at least one capacitor being less than one micrometer, the width and thickness of the at least one capacitor being less than a width and thickness of a capacitor fabricated using a printing process; and
at least one 3D inductor within the glass substrate having an inductor spacing of less than a printing resolution spacing of ten micrometers, the at least one 3D inductor comprising:
a first plurality of traces on a first surface of the glass substrate, coupled to the plurality of through substrate vias; and
a second plurality of traces on a second surface of the glass substrate, opposite the first surface, coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias and traces surrounding a solid glass core of the glass substrate and operating as the at least one 3D inductor, the first plurality of traces and the second plurality of traces having a width and/or thickness less than the printing resolution in which at least one of the plurality of capacitors is coupled to a trace of the at least one 3D inductor.

2. The filter of claim 1 , in the filter comprises a low pass filter.

3. The filter of claim 1 , in which the filter comprises a high pass filter.

4. The filter of claim 1 , in which the glass substrate comprises glass, air, quartz, sapphire or high-resistivity silicon.

5. The filter of claim 1 , integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

6. A low pass filter, comprising:
a glass substrate having a plurality of through substrate vias;
a plurality of capacitors supported by the glass substrate, at least one of the plurality of capacitors having a width and/or thickness less than a printing resolution;
at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
a first plurality of traces on a first surface of the glass substrate, coupled to the plurality of through substrate vias, and
a second plurality of traces on a second surface of the glass substrate, opposite the first surface, coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias and traces operating as the at least one 3D inductor, the first plurality of traces and the second plurality of traces having a width and/or thickness less than the printing resolution;

a first of the 3D inductors coupled in series to a first of the plurality of capacitors, between a filter input and a ground terminal;
a second of the 3D inductors coupled between the filter input and a filter output and coupled in parallel to a second of the plurality of capacitors; and
a third of the 3D inductors coupled to the filter output and to a third of the plurality of capacitors that is coupled to the ground terminal.

7. A low pass filter, comprising:
a glass substrate having a plurality of through substrate vias;
a plurality of capacitors supported by the glass substrate, at least one of the plurality of capacitors having a width and/or thickness less than a printing resolution;
at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
a first plurality of traces on a first surface of the glass substrate, coupled to the plurality of through substrate vias, and
a second plurality of traces on a second surface of the glass substrate, opposite the first surface, coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias and traces operating as the at least one 3D inductor, the first plurality of traces and the second plurality of traces having a width and/or thickness less than the printing resolution;

a first of the plurality of capacitors coupled in series to a first of the 3D inductors, between a filter input and a ground terminal;
a second of the plurality of capacitors coupled between the filter input and a filter output and coupled in parallel to a second of the 3D inductors; and
a third of the plurality of capacitors is coupled to the filter output and to a third of a third of the 3D inductors that is coupled to the ground terminal.

8. A high pass filter, comprising:
a glass substrate having a plurality of through substrate vias;
a plurality of capacitors supported by the glass substrate, at least one of the plurality of capacitors having a width and/or thickness less than a printing resolution;
at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
a first plurality of traces on a first surface of the glass substrate, coupled to the plurality of through substrate vias, and
a second plurality of traces on a second surface of the glass substrate, opposite the first surface, coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias and traces operating as the at least one 3D inductor, the first plurality of traces and the second plurality of traces having a width and/or thickness less than the printing resolution;

a first of the plurality of capacitors coupled in series with a third of the plurality of capacitors, between a filter input and a ground terminal; and
the at least one 3D inductor coupled in series with a second of the plurality of capacitors between the first of the plurality of capacitors and the third of the plurality of capacitors and the ground terminal.

9. A high pass filter, comprising:
a glass substrate having a plurality of through substrate vias;
a plurality of capacitors supported by the glass substrate, at least one of the plurality of capacitors having a width and/or thickness less than a printing resolution;
at least one 3D inductor within the glass substrate, the at least one 3D inductor comprising:
a first plurality of traces on a first surface of the glass substrate, coupled to the plurality of through substrate vias, and
a second plurality of traces on a second surface of the glass substrate, opposite the first surface, coupled to opposite ends of the plurality of through substrate vias, the plurality of through substrate vias and traces operating as the at least one 3D inductor, the first plurality of traces and the second plurality of traces having a width and/or thickness less than the printing resolution;

a first of the plurality of capacitors coupled in series with a second of the plurality of capacitors, between a filter input and a ground terminal; and
the at least one 3D inductor coupled between the first of the plurality of capacitors and the second of the plurality of capacitors and the ground terminal.

10. A method of fabricating a filter, comprising:
forming a plurality of through substrate vias in a glass substrate;
depositing a first plurality of traces on a first surface of the glass substrate;
depositing a second plurality of traces on a second surface of the glass substrate, the first plurality of traces and the second plurality of traces having a width and/or thickness less than a printing resolution;
coupling the first plurality of traces to first sides of the plurality of through substrate vias;
coupling the second plurality of traces to second sides of the plurality of through substrate vias, the plurality of through substrate vias and traces surrounding a solid gl

Assignees

• Qualcomm Inc

Inventors

• Zuo Chengjie
• Kim Jonghae
• Yun Changhan Hobie
• Kim Daeik Daniel
• Velez Mario Francisco
• Lan Je-Hsiung
• Mikulka Robert Paul
• Nowak Matthew Michael

Classifications

• H03H7/0138 Primary

  Electrical filters or coupling circuits · CPC title

• H03H7/0115 Primary

  comprising only inductors and capacitors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence) · CPC title

• Y10T29/417

  Cross-Sectional Technologies · mapped topic