Two-dimensional structure to form an embedded three-dimensional structure

Patent metadata

Field	Value
Publication number	US-2017372831-A1
Application number	US-201615192802-A
Country	US
Kind code	A1
Filing date	Jun 24, 2016
Priority date	Jun 24, 2016
Publication date	Dec 28, 2017
Grant date	—

Abstract

Disclosed is an apparatus including a plurality of vias each having a defined shape, wherein each of the plurality of vias includes a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape, a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer. The apparatus further includes a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

First claim

What is claimed is:

1 . An apparatus, comprising:
a plurality of vias each having a defined shape, wherein each of the plurality of vias comprises:
a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape,
a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and
a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer; and
a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

2 . The apparatus of claim 1 , wherein the apparatus comprises an inductor device.

3 . The apparatus of claim 2 , wherein the defined shape is a curved shape.

4 . The apparatus of claim 3 , further comprising a magnetic core of the inductor device within an aperture defined by the curved shape of the plurality of vias.

5 . The apparatus of claim 3 , wherein a length of the plurality of interconnects is less than a length of a second plurality of interconnects conductively coupling a second plurality of vias of a second inductor device, wherein the second plurality of vias do not have the curved shape.

6 . The apparatus of claim 2 , wherein the defined shape is an “I” shape.

7 . The apparatus of claim 6 , wherein a quality factor of the inductor device is greater than a second quality factor of a second inductor device, wherein a second plurality of vias of the second inductor device are drilled or cut vias.

8 . The apparatus of claim 1 , wherein the defined shape is a “C” shape.

9 . The apparatus of claim 1 , wherein the defined shape is a semicircle shape.

10 . The apparatus of claim 1 , wherein the apparatus comprises an embedded three-dimensional (3D) coil.

11 . A method for forming an embedded three-dimensional (3D) coil, comprising:
forming a plurality of vias on a substrate, wherein forming each of the plurality of vias comprises:
plating a first two-dimensional conductive layer on a first side of the substrate, the first two-dimensional conductive layer having a defined shape,
plating a second two-dimensional conductive layer on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and
forming a via through the substrate to conductively couple the first two-dimensional conductive layer to the second two-dimensional conductive layer; and
forming a plurality of interconnects to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

12 . The method of claim 11 , further comprising:
dicing the substrate into a plurality of slivers, each of the plurality of slivers including at least one pair of vias of the plurality of vias; and attaching the plurality of slivers to a molding compound to form the embedded 3D coil, wherein the subset of the plurality of slivers form a row of pairs of vias of the plurality of vias.

13 . The method of claim 12 , wherein the plurality of interconnects conductively couples the pairs of vias of the plurality of vias.

14 . The method of claim 11 , further comprising forming a magnetic core of the embedded 3D coil within an aperture defined by the pairs of vias of the plurality of vias.

15 . The method of claim 11 , wherein the embedded 3D coil comprises an inductor device.

16 . The method of claim 15 , wherein the defined shape is a curved shape.

17 . The method of claim 16 , wherein a length of the plurality of interconnects is less than a length of a second plurality of interconnects conductively coupling a second plurality of vias of a second inductor device, wherein the second plurality of vias do not have the curved shape.

18 . The method of claim 15 , wherein the defined shape is an “I” shape.

19 . The method of claim 18 , wherein a quality factor of the inductor device is greater than a second quality factor of a second inductor device, wherein a second plurality of vias of the second inductor device are drilled or cut vias.

20 . The method of claim 11 , wherein the defined shape is a “C” shape.

21 . The method of claim 11 , wherein the defined shape is a semicircle shape.

22 . An apparatus, comprising:
a plurality of vias each having a defined shape, wherein each of the plurality of vias comprises:
a first two-dimensional conductive means plated on a first side of a substrate, the first two-dimensional conductive means having the defined shape,
a second two-dimensional conductive means plated on a second side of the substrate, the second two-dimensional conductive means having the defined shape, and
means for conductively coupling the first two-dimensional conductive means to the second two-dimensional conductive means; and
a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive means and the second two-dimensional conductive means of each of the plurality of vias are perpendicular to the plurality of interconnects.

23 . The apparatus of claim 22 , wherein the apparatus comprises an inductor device.

24 . The apparatus of claim 23 , wherein the defined shape is a curved shape.

25 . The apparatus of claim 24 , further comprising a magnetic core of the inductor device within an aperture defined by the curved shape of the plurality of vias.

26 . The apparatus of claim 23 , wherein the defined shape is an “I” shape.

27 . The apparatus of claim 26 , wherein a quality factor of the inductor device is greater than a second quality factor of a second inductor device, wherein a second plurality of vias of the second inductor device are drilled or cut vias.

28 . The apparatus of claim 22 , wherein the defined shape is a “C” shape.

29 . The apparatus of claim 22 , wherein the apparatus comprises an embedded three-dimensional (3D) coil.

30 . A non-transitory computer-readable medium storing computer executable code, the code comprising code to:
cause a machine to form a plurality of vias on a substrate, wherein code to cause a machine to form each of the plurality of vias comprises code to:
cause a machine to plate a first two-dimensional conductive layer on a first side of the substrate, the first two-dimensional conductive layer having a defined shape,
cause a machine to plate a second two-dimensional conductive layer on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and
cause a machine to form a via through the substrate to conductively couple the first two-dimensional conductive layer to the second two-dimensional conductive layer; and
cause a machine to form a plurality of interconnects to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

Assignees

• Qualcomm Inc

Inventors

• Velez Mario Francisco
• Kim Daeik Daniel
• Mudakatte Niranjan Sunil
• Berdy David Francis
• Yun Changhan Hobie
• Kim Jonghae
• Zuo Chengjie
• Ma Yunfei
• Mikulka Robert Paul

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W72/0198

  batch processes · CPC title