Differential contrast plating for advanced packaging applications
US-12559853-B2 · Feb 24, 2026 · US
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Mayer Steven T patents
Mayer Steven T is listed as an inventor on 156 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mayer Steven T |
| Total patents | 156 |
| First publication | Feb 12, 2015 |
| Latest publication | Feb 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Tsv process window and fill performance enhancement by long pulsing and ramping
US-2025263862-A1 · Aug 21, 2025 · US
Byproduct removal from electroplating solutions
US-12392047-B2 · Aug 19, 2025 · US
TSV process window and fill performance enhancement by long pulsing and ramping
US-12305307-B2 · May 20, 2025 · US
Gold through silicon mask plating
US-12293943-B2 · May 6, 2025 · US
Wafer shielding for prevention of lipseal plate-out
US-12241173-B2 · Mar 4, 2025 · US
Micro inert anode array for die level electrodeposition thickness distribution control
US-2024279839-A1 · Aug 22, 2024 · US
Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrate
US-2024141541-A1 · May 2, 2024 · US
Electrochemical assembly for forming semiconductor features
US-2024084473-A1 · Mar 14, 2024 · US
Process kit de-bubbling
US-2023407514-A1 · Dec 21, 2023 · US
Recent patents
Latest publications not already listed above.
Electrohydrodynamic ejection printing and electroplating for photoresist-free formation of metal features
US-2023340686-A1 · Oct 26, 2023 · US
Electro-oxidative metal removal accompanied by particle contamination mitigation in semiconductor processing
US-2023230847-A1 · Jul 20, 2023 · US
Surface pretreatment for electroplating nanotwinned copper
US-2023212773-A1 · Jul 6, 2023 · US
Electro-oxidative metal removal in through mask interconnect fabrication
US-11610782-B2 · Mar 21, 2023 · US
High-speed 3d metal printing of semiconductor metal interconnects
US-2023035849-A1 · Feb 2, 2023 · US
Tsv process window and fill performance enhancement by long pulsing and ramping
US-2023026818-A1 · Jan 26, 2023 · US
Electroplating apparatus for tailored uniformity profile
US-11549192-B2 · Jan 10, 2023 · US
Cleaning electroplating substrate holders using reverse current deplating
US-11542630-B2 · Jan 3, 2023 · US
Wafer shielding for prevention of lipseal plate-out
US-2022396894-A1 · Dec 15, 2022 · US
Byproduct removal from electroplating solutions
US-2022307152-A1 · Sep 29, 2022 · US
Differential contrast plating for advanced packaging applications
US-2022275531-A1 · Sep 1, 2022 · US
Gold through silicon mask plating
US-2022216104-A1 · Jul 7, 2022 · US
Dynamic modulation of cross flow manifold during elecroplating
US-11047059-B2 · Jun 29, 2021 · US
Electroplating apparatus for tailored uniformity profile
US-2021148001-A1 · May 20, 2021 · US
Methods and apparatus for flow isolation and focusing during electroplating
US-11001934-B2 · May 11, 2021 · US
Apparatus for measuring condition of electroplating cell components and associated methods
US-10989747-B2 · Apr 27, 2021 · US
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US-10982346-B2 · Apr 20, 2021 · US
Protecting anodes from passivation in alloy plating systems
US-10954605-B2 · Mar 23, 2021 · US
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US-10923340-B2 · Feb 16, 2021 · US
Electroplating apparatus for tailored uniformity profile
US-10920335-B2 · Feb 16, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Novellus Systems Inc | 79 |
| Lam Res Corp | 77 |
| Mayer Steven T | 6 |
| Porter David W | 2 |
| Varadarajan Seshasayee | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D17/001 | 130 |
| C25D7/123 | 101 |
| C25D21/12 | 90 |
| H10P14/47 | 68 |
| C25D3/38 | 48 |