Electroplating apparatus and process for wafer level packaging
US-9404194-B2 · Aug 2, 2016 · US
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Mayer Steven T patents
Mayer Steven T holds 6 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 6 |
| Recent patents | 0 |
| First publication | Feb 24, 2015 |
| Latest publication | Aug 2, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Automated cleaning of wafer plating assembly
US-9221081-B1 · Dec 29, 2015 · US
Electrolyte concentration control system for high rate electroplating
US-9109295-B2 · Aug 18, 2015 · US
Control of electrolyte composition in a copper electroplating apparatus
US-9045841-B1 · Jun 2, 2015 · US
Through silicon via filling using an electrolyte with a dual state inhibitor
US-8992757-B2 · Mar 31, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Electroplating apparatus and process for wafer level packaging
US-9404194-B2 · Aug 2, 2016 · US
Automated cleaning of wafer plating assembly
US-9221081-B1 · Dec 29, 2015 · US
Electrolyte concentration control system for high rate electroplating
US-9109295-B2 · Aug 18, 2015 · US
Control of electrolyte composition in a copper electroplating apparatus
US-9045841-B1 · Jun 2, 2015 · US
Through silicon via filling using an electrolyte with a dual state inhibitor
US-8992757-B2 · Mar 31, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Chemistry & Metallurgy | 6 |
| Electricity | 3 |
| Operations & Transport | 1 |
| Physics | 1 |