Electroplating apparatus for tailored uniformity profile

Patent metadata

Field	Value
Publication number	US-2021148001-A1
Application number	US-202117247991-A
Country	US
Kind code	A1
Filing date	Jan 4, 2021
Priority date	Nov 7, 2008
Publication date	May 20, 2021
Grant date	—

Abstract

An electroplating apparatus for electroplating metal on a substrate includes a plating chamber configured to contain an electrolyte, a substrate holder configured to hold and rotate the substrate during electroplating, an anode, and an azimuthally asymmetric auxiliary electrode configured to be biased both anodically and cathodically during electroplating. The azimuthally asymmetric auxiliary electrode (which may be, for example, C-shaped), can be used for controlling azimuthal uniformity of metal electrodeposition by donating and diverting ionic current at a selected azimuthal position. In another aspect, an electroplating apparatus for electroplating metal includes a plating chamber configured to contain an electrolyte, a substrate holder configured to hold and rotate the substrate during electroplating, an anode, a shield configured to shield current at the periphery of the substrate; and an azimuthally asymmetric auxiliary anode configured to donate current to the shielded periphery of the substrate at a selected azimuthal position on the substrate.

First claim

1 . An electroplating apparatus for electroplating a metal on a substrate, the apparatus comprising:
(a) a plating chamber configured to contain an electrolyte; (b) a substrate holder configured to hold and rotate the substrate during electroplating; (c) an anode; and (d) an azimuthally asymmetric auxiliary electrode configured to be biased both anodically and cathodically during electroplating.

2 . The apparatus of claim 1 , wherein the azimuthally asymmetric auxiliary electrode is C-shaped.

3 . The apparatus of claim 1 , wherein the azimuthally asymmetric auxiliary electrode is configured to divert plating current from a first azimuthal position on the substrate and to donate plating current to a second azimuthal position on the substrate.

4 . The apparatus of claim 1 , wherein the apparatus further comprises comprises a shield, shielding a periphery of the substrate at all azimuthal positions.

5 . The apparatus of claim 4 , wherein the auxiliary azimuthally asymmetric electrode is configured to be anodically biased at least during a portion of a time of a full rotation of the substrate, and is configured to donate current to a selected azimuthal position on the substrate.

6 . The apparatus of claim 1 , wherein the distance between the auxiliary azimuthally asymmetric electrode and the substrate is no greater than 20% of the radius of the substrate.

7 . The apparatus of claim 1 , wherein the auxiliary azimuthally asymmetric electrode is in an azimuthal current flow confinement structure.

8 . The apparatus of claim 1 , wherein the auxiliary azimuthally asymmetric electrode is housed in a separate chamber and the exposure of a plating current from the auxiliary electrode is through at least one channel that delivers the plating current into or diverts the plating current from a region of the plating chamber near a periphery of the substrate over an arc angle of less than 120 degrees.

9 . The apparatus of claim 1 , further comprising an ionically resistive ionically permeable element having a surface that is substantially parallel to and separated from a plating face of the substrate by a distance of 10 millimeters or less during electroplating.

10 . The apparatus of claim 1 further comprising a controller having program instructions for causing cathodic biasing and anodic biasing of the azimuthally asymmetric auxiliary electrode during electroplating on a single substrate.

11 . A method of electroplating a metal on a substrate, the method comprising:
(a) providing a substrate to an electroplating apparatus, wherein the electroplating apparatus comprises:
(i) a plating chamber configured to contain an electrolyte;
(ii) a substrate holder configured to hold and rotate the substrate during electroplating;
(iii) an anode; and
(iv) an azimuthally asymmetric auxiliary electrode configured to be biased both anodically and cathodically during electroplating; and
(b) cathodically biasing the substrate, while biasing the azimuthally asymmetric auxiliary electrode to electroplate the metal on the cathodically biased substrate.

12 . The method of claim 11 comprising both cathodically and anodically biasing the azimuthally asymmetric auxiliary electrode during electroplating on a single substrate.

13 . An electroplating apparatus for electroplating a metal on a substrate, the apparatus comprising:
(a) a plating chamber configured to contain an electrolyte; (b) a substrate holder configured to hold and rotate the substrate during electroplating; (c) an anode; (d) a shield configured to shield current at the periphery of the substrate; and (e) an azimuthally asymmetric auxiliary anode configured to donate current to the shielded periphery of the substrate at a selected azimuthal position on the substrate.

14 . The electroplating apparatus of claim 13 , wherein the apparatus is configured for rotating the substrate.

15 . The electroplating apparatus of claim 13 , wherein the apparatus further comprises an ionically resistive ionically permeable element positioned between the anode and the substrate holder.

16 . The electroplating apparatus of claim 13 , wherein the auxiliary anode is positioned such that a distance from the auxiliary anode to the substrate during electroplating is no more than 0.2 of a radius of the substrate.

17 . The electroplating apparatus of claim 13 , wherein the shield is an annular shield.

18 . The electroplating apparatus of claim 13 , wherein the auxiliary anode is a C-shaped anode.

19 . The electroplating apparatus of claim 13 , wherein the apparatus further comprises an ionically resistive ionically permeable element positioned between the anode and the substrate holder, and wherein the ionically resistive ionically permeable element is a plate comprising a plurality of through-channels.

20 . The electroplating apparatus of claim 13 , wherein the substrate is a semiconductor substrate and the electroplating apparatus is configured for electroplating metal to fill recessed features on the semiconductor substrate.

Assignees

• Novellus Systems Inc

Inventors

• Mayer Steven T
• Porter David W
• Buckalew Bryan L
• Rash Robert

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/043

  for electroplating · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• C25D5/04

  Electroplating with moving electrodes · CPC title