Integrated circuit package and method
US-11935804-B2 · Mar 19, 2024 · US
Tsv process window and fill performance enhancement by long pulsing and ramping
US2025263862A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025263862-A1 |
| Application number | US-202519189931-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 25, 2025 |
| Priority date | Jan 10, 2020 |
| Publication date | Aug 21, 2025 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of current; reducing the current to a baseline current level; and optionally increasing the current in one or more steps until electroplating is complete.
First claim
Opening claim text (preview).
What is claimed is: 1 . A method of electroplating metal, the method comprising: contacting a substrate with an electroplating solution having ions of a metal, wherein the substrate has features providing an open area of at least about 0.9% on a face of the substrate; applying an electrofill current waveform to the substrate contacting the electroplating solution, wherein the electrofill current waveform comprises (i) a pulse having a magnitude of at least about 2 times a magnitude of a baseline current for a duration of from about 10 to about 200 seconds, and (ii) a substantially constant current step having, on average, the magnitude of the baseline current, wherein the substantially constant current step follows the pulse; and filling at least a portion of the features with the metal.
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Classifications
the interconnections being through-semiconductor vias · CPC title
comprising use of blind vias during the manufacture · CPC title
characterised by the filling method or the material of the conductive fill · CPC title
- H10W20/043Primary
for electroplating · CPC title
- H10P14/47Primary
Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title
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Frequently asked questions
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- What does patent US2025263862A1 cover?
- A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of current; reducing the current to a baseline current level; and optionally increasing the current in one or more steps until electroplating is complete.
- Who is the assignee on this patent?
- Lam Res Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W20/043. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Aug 21 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).