Multi-chip package and method of providing die-to-die interconnects in same
US-2024429173-A1 · Dec 26, 2024 · US
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Lotz Stefanie M patents
Lotz Stefanie M is listed as an inventor on 33 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lotz Stefanie M |
| Total patents | 33 |
| First publication | Aug 25, 2015 |
| Latest publication | Dec 26, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Multi-chip package and method of providing die-to-die interconnects in same
US-12113026-B2 · Oct 8, 2024 · US
High density organic bridge device and method
US-2024321762-A1 · Sep 26, 2024 · US
High density organic bridge device and method
US-12002762-B2 · Jun 4, 2024 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-2024038671-A1 · Feb 1, 2024 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-11876053-B2 · Jan 16, 2024 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-11824008-B2 · Nov 21, 2023 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-2023016326-A1 · Jan 19, 2023 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-2021134726-A1 · May 6, 2021 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-10923429-B2 · Feb 16, 2021 · US
Recent patents
Latest publications not already listed above.
Multi-chip package and method of providing die-to-die interconnects in same
US-2020357747-A1 · Nov 12, 2020 · US
High density organic bridge device and method
US-2020294924-A1 · Sep 17, 2020 · US
Integrated circuit package substrate
US-10770387-B2 · Sep 8, 2020 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-10763216-B2 · Sep 1, 2020 · US
High density organic bridge device and method
US-10672713-B2 · Jun 2, 2020 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-2020075493-A1 · Mar 5, 2020 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-10510669-B2 · Dec 17, 2019 · US
Integrated circuit package substrate
US-2019304892-A1 · Oct 3, 2019 · US
Integrated circuit package substrate
US-10325843-B2 · Jun 18, 2019 · US
High density organic bridge device and method
US-2019019755-A1 · Jan 17, 2019 · US
High density organic bridge device and method
US-10103105-B2 · Oct 16, 2018 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-2018145031-A1 · May 24, 2018 · US
Integrated circuit package substrate
US-2018138118-A1 · May 17, 2018 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-9875969-B2 · Jan 23, 2018 · US
Integrated circuit package substrate
US-9831169-B2 · Nov 28, 2017 · US
High density organic bridge device and method
US-2017125349-A1 · May 4, 2017 · US
High density organic bridge device and method
US-9548264-B2 · Jan 17, 2017 · US
Integrated circuit package substrate
US-2016379923-A1 · Dec 29, 2016 · US
Integrated circuit package substrate
US-9508636-B2 · Nov 29, 2016 · US
High density organic bridge device and method
US-2016133552-A1 · May 12, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 33 |
| Lotz Stefanie M | 2 |
| Braunisch Henning | 1 |
| Chiu Chia-Pin | 1 |
| Aleksov Aleksandar | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/618 | 33 |
| H10W90/724 | 33 |
| H10W70/611 | 33 |
| H10W72/00 | 31 |
| H10W70/65 | 31 |