High density organic bridge device and method

Patent metadata

Field	Value
Publication number	US-2024321762-A1
Application number	US-202418678813-A
Country	US
Kind code	A1
Filing date	May 30, 2024
Priority date	Dec 20, 2012
Publication date	Sep 26, 2024
Grant date	—

Abstract

Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

First claim

What is claimed is:

1 . A microelectronic device comprising:
a package substrate, wherein the package substrate comprises first connection regions capable of connecting to an integrated circuit die; a bridge structure capable of interconnecting integrated circuit dies, wherein the bridge structure comprises second connection regions for integrated circuit dies and wires having a wire spacing that is 3 μm or less, and wherein the bridge structure is comprised of layers of organic polymer and the wires are in the layers of organic polymer.

2 . The microelectronic package of claim 1 additionally comprising an organic polymer adhesive between the package substrate and the bridge structure.

3 . The microelectronic package of claim 1 wherein the bridge structure is within a recess in the package substrate.

4 . The microelectronic package of claim 1 wherein the package substrate comprises an organic polymer.

5 . The microelectronic package of claim 1 wherein the package substrate comprises an organic polymer that comprises silica, calcium oxide, or magnesium oxide.

6 . The microelectronic package of claim 1 wherein the bridge structure is less than 30 μm thick.

7 . The microelectronic package of claim 1 wherein the organic polymer is an epoxy.

Assignees

• Intel Corp

Inventors

• Roy Mihir K
• Lotz Stefanie M
• Jen Wei-Lun Kane

Classifications

• H10W70/618

  the bridge chips being embedded in the package substrates, interposers or redistribution layers · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title