High density organic bridge device and method

Patent metadata

Field	Value
Publication number	US-2017125349-A1
Application number	US-201615350393-A
Country	US
Kind code	A1
Filing date	Nov 14, 2016
Priority date	Dec 20, 2012
Publication date	May 4, 2017
Grant date	—

Abstract

Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

First claim

1 . (canceled)

2 . A microelectronic package comprising:
an organic polymer substrate exhibiting a first set of design rules having a first wire width first wire spacing; an organic polymer bridge embedded in the substrate, exhibiting a second set of design rules in at least portion of the organic polymer bridge, the second set of design rules having a second wire width and a second wire spacing, wherein the first wire width is larger than the second wire width and the first wire spacing is larger than the second wire spacing: at least one portion of the organic polymer bridge includes set of design rules exhibiting a third wire width and third wire spacing; wherein the organic polymer bridge includes a plurality of metal routing layers and a metal pad layer; a first interconnect structure at a first location of the organic polymer bridge and a second interconnect structure at a second location of the organic polymer bridge; and an electrically conductive path in the organic polymer bridge connecting the first interconnect structure to the second interconnect structure.

3 . The microelectronic package of claim 2 , wherein the first set of design rules includes the first wire width of about 40 μm and the first wire spacing of about 40 μm.

4 . The microelectronic package of claim 2 , wherein the second set of design rules includes the second wire width of about 3 μm and the second wire spacing of about 3 μm.

5 . The microelectronic package of claim 2 , wherein the third set of design rules includes the third wire width of about 10 μm and the third wire spacing of about 10 μm.

6 . The microelectronic package of claim 2 , wherein the organic polymer bridge is less than about 30 μm thick.

7 . The microelectronic package of claim 2 , wherein the organic polymer bridge has a total thickness of less than about 20 μm thick.

8 . The microelectronic package of claim 2 , wherein the organic polymer bridge has a total thickness of about 15 μm thick.

9 . The microelectronic package of claim 2 wherein the organic polymer substrate contains a recess and the organic polymer bridge is embedded into the recess using an organic polymer.

10 . The microelectronic package of claim 9 wherein the organic polymer substrate and the organic polymer bridge are made from the same organic polymer.

11 . The microelectronic package of claim 9 wherein the organic polymer substrate and the organic polymer bridge are made from different organic polymers.

12 . The microelectronic package of claim 9 wherein the organic polymer used to bond the organic polymer bridge to the organic polymer substrate is a die bonding film or an epoxy.

13 . An organic bridge adapted to interconnect a plurality of die, the organic bridge comprising:
a plurality of metal routing layers; a metal pad layer including connection points at two interconnect locations each toward opposite ends of the organic bridge; at least a portion of the plurality of metal routing layers or at least a portion of the metal pad layer or at least a portion of both adhering to a set of design rules having a wire width of about 3 μm and wire spacing of about 3 μm, and another set of design rules includes a wire width of about 10 μm and a wire spacing of about 10 μm; interleaved organic polymer dielectric layers between each metal routing layer and the metal pad layer; and wherein there is no layer made substantially of silicon.

14 . The organic bridge of claim 13 wherein all layers have a combined thickness of about 15 μm.

15 . The organic bridge of claim 13 wherein the metal pad layer includes a first of the plurality of interconnect structures and a second plurality of interconnect structures, wherein the first plurality of interconnect structures is adapted to connect to a first die, and wherein the second plurality of interconnect structures is adapted to connect to a second die.

16 . The organic bridge of claim 13 wherein the organic polymer bridge has a thickness of about 15 μm to about 20 μm.

17 . A microelectronic package comprising:
an organic polymer package substrate created using a first set of design rules having a first wire width of about 40 μm and first wire spacing of about 40 μm: an organic polymer bridge created using a second set of design rules in at least a portion of the organic bridge having a second wire width of about 3 μm and a second wire spacing of about 3 μm, the organic polymer bridge comprising a metal pad layer, a metal routing layer and interleaved dielectric layers, the organic polymer bridge being embedded in the organic polymer package substrate, wherein the organic polymer bridge has a thickness of about 15 μm to about 20 μm, and wherein the organic polymer bridge comprises a third set of design rules in at least one other portion of the organic bridge, the third set of design rules having third wire width of about 10 μm and a third wire spacing of about 10 μm.

18 . The microelectronic package of claim 17 wherein the organic polymer substrate contains a recess and the organic polymer bridge is embedded into the recess using an organic polymer.

19 . The microelectronic package of claim 17 wherein the organic polymer substrate and the organic polymer bridge are made from the same organic polymer.

20 . The microelectronic package of claim 17 wherein the organic polymer substrate and the organic polymer bridge are made from different organic polymers.

21 . The microelectronic package of claim 17 wherein the organic polymer used to bond the organic polymer bridge to the organic polymer substrate is a die bonding film or an epoxy.

Assignees

• Intel Corp

Inventors

• Roy Mihir K
• Lotz Stefanie M
• Jen Wei-Lun Kane

Classifications

• H10W70/618

  the bridge chips being embedded in the package substrates, interposers or redistribution layers · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title