Angle mount mm-wave semiconductor package
US-2019200451-A1 · Jun 27, 2019 · US
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Aleksov Aleksandar patents
Aleksov Aleksandar holds 6 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 6 |
| Recent patents | 0 |
| First publication | Jan 12, 2016 |
| Latest publication | Jun 27, 2019 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Multi-chip package and method of providing die-to-die interconnects in same
US-9875969-B2 · Jan 23, 2018 · US
Flexible computing fabric
US-9526285-B2 · Dec 27, 2016 · US
Thermal matched composite die
US-9520378-B2 · Dec 13, 2016 · US
Organic thin film passivation of metal interconnections
US-9257276-B2 · Feb 9, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Angle mount mm-wave semiconductor package
US-2019200451-A1 · Jun 27, 2019 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-9875969-B2 · Jan 23, 2018 · US
Flexible computing fabric
US-9526285-B2 · Dec 27, 2016 · US
Thermal matched composite die
US-9520378-B2 · Dec 13, 2016 · US
Organic thin film passivation of metal interconnections
US-9257276-B2 · Feb 9, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/724 | 4 |
| H01L2224/16225 | 4 |
| H10W90/00 | 3 |
| H10W72/07236 | 3 |
| H10W72/247 | 3 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 6 |
| Human Necessities | 1 |
| Operations & Transport | 1 |
| Chemistry & Metallurgy | 1 |
| Physics | 1 |
| Cross-Sectional Technologies | 1 |