MRAM fabrication and device
US-12581863-B2 · Mar 17, 2026 · US
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Lee Chin-Szu patents
Lee Chin-Szu is listed as an inventor on 110 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Chin-Szu |
| Total patents | 110 |
| First publication | Mar 23, 2017 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor processing tool and methods of operation
US-12500106-B2 · Dec 16, 2025 · US
Semiconductor processing tool and methods of operation
US-2025364295-A1 · Nov 27, 2025 · US
Methods of forming bonding structures
US-2025357406-A1 · Nov 20, 2025 · US
Semiconductor tool for copper deposition
US-2025329521-A1 · Oct 23, 2025 · US
Methods to improve magnetic tunnel junction memory cells by treating native oxide
US-2025318436-A1 · Oct 9, 2025 · US
Diffusion layer for magnetic tunnel junctions
US-2025280734-A1 · Sep 4, 2025 · US
Semiconductor tool for copper deposition
US-12394611-B2 · Aug 19, 2025 · US
Methods to improve magnetic tunnel junction memory cells by treating native oxide
US-12364165-B2 · Jul 15, 2025 · US
Method of manufacturing mram device with enhanced etch control
US-2025212694-A1 · Jun 26, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor tool for copper deposition
US-12327715-B2 · Jun 10, 2025 · US
Method for improving surface of semiconductor device
US-12315720-B2 · May 27, 2025 · US
Diffusion barrier layer on interconnection vias for magnetic tunnel junctions
US-12310248-B2 · May 20, 2025 · US
Conductive feature of semiconductor device and method of forming same
US-12300540-B2 · May 13, 2025 · US
Shutter disc for a semiconductor processing tool
US-2025137114-A1 · May 1, 2025 · US
Method of manufacturing MRAM device with enhanced etch control
US-12274176-B2 · Apr 8, 2025 · US
Sealing article comprising metal coating, method of making and method of using the same
US-12227839-B2 · Feb 18, 2025 · US
Shutter disc for a semiconductor processing tool
US-12215414-B2 · Feb 4, 2025 · US
Method for Improving Deposition Process
US-2024387155-A1 · Nov 21, 2024 · US
Dual ampoule separator plate and method
US-2024384405-A1 · Nov 21, 2024 · US
Conductive feature of semiconductor device and method of forming same
US-2024379425-A1 · Nov 14, 2024 · US
Vacuum tip assembly for use in pick-and-place tool
US-2024335957-A1 · Oct 10, 2024 · US
Method for improving deposition process
US-12112930-B2 · Oct 8, 2024 · US
Method of manufacturing mram device with enhanced etch control
US-2024260479-A1 · Aug 1, 2024 · US
Method of forming memory device with physical vapor deposition system
US-12035538-B2 · Jul 9, 2024 · US
Methods of forming bonding structures
US-2024203923-A1 · Jun 20, 2024 · US
Method of manufacturing MRAM device with enhanced etch control
US-11985904-B2 · May 14, 2024 · US
System and method for performing semiconductor processes with coated bell jar
US-11939664-B2 · Mar 26, 2024 · US
Sealing article comprising metal coating, method of making and method of using the same
US-2024084447-A1 · Mar 14, 2024 · US
Sealing article comprising metal coating, method of making and method of using the same
US-11920238-B2 · Mar 5, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 115 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/056 | 40 |
| H10N50/01 | 35 |
| H10N50/80 | 32 |
| H10N50/10 | 32 |
| H10W20/425 | 28 |