Vacuum tip assembly for use in pick-and-place tool

Patent metadata

Field	Value
Publication number	US-2024335957-A1
Application number	US-202318131064-A
Country	US
Kind code	A1
Filing date	Apr 5, 2023
Priority date	Apr 5, 2023
Publication date	Oct 10, 2024
Grant date	—

Abstract

Embodiments of the present disclosure provide die pick and place tools with an improved vacuum tip that can perform attachment and detachment of an integrated circuit die without deforming dies. In one embodiment, a vacuum tip for transporting an integrated circuit die is provided. The vacuum tip includes a body having a top surface and a bottom surface, a plurality of grooves formed in the top surface and into the body, wherein the grooves extend radially outward from a center point of the body. The vacuum tip also includes a channel in the body, wherein the channel extends from a bottom of the grooves through the body to the bottom surface of the body, and the channel and the body are substantially co-axial.

First claim

1 . A vacuum tip for transporting an integrated circuit die, comprising:
a body having a top surface and a bottom surface; a plurality of grooves formed in the top surface and into the body, the grooves extending radially outward from a center point of the body; and a channel provided in the body and extending from a bottom of the grooves through the body to the bottom surface of the body, the channel and the body are substantially co-axial.

2 . The vacuum tip of claim 1 , wherein each of the plurality of the grooves has a first end connected to the channel at the center point and a second end terminated at or near a periphery of the body.

3 . The vacuum tip of claim 2 , wherein the second end of each groove has a semicircle-shaped edge, a square-shaped edge, or polygon-shaped edge.

4 . The vacuum tip of claim 1 , wherein the plurality of the grooves is equally spaced around a circumference of the body.

5 . The vacuum tip of claim 1 , wherein each of the plurality of the grooves has a first height and the channel has a second height greater than the first height.

6 . The vacuum tip of claim 1 , wherein the body is made of a metal, an alloy, a plastic, a rubber, a stainless steel, a ceramic, or a composite material.

7 . The vacuum tip of claim 1 , further comprising:
a mounting support coupling to the bottom surface of the body, wherein the mounting support has a vacuum port extending through the mounting support and in fluid communication with the channel.

8 . A vacuum tip for transporting an integrated circuit die, comprising:
an outer ring body; an inner ring body disposed radially inward of the outer ring body, the outer ring body and the inner ring body being co-axial; and a plurality of support members extending radially between and in contact with the outer ring body and the inner ring body, wherein the region within the inner ring body forms a first vacuum port, and the regions defined by the outer ring body, the inner ring body, and the support members form second vacuum ports.

9 . The vacuum tip of claim 8 , wherein top surfaces of the outer ring body, the inner ring body, and the support members are co-planar.

10 . The vacuum tip of claim 8 , further comprising:
a mounting support coupling to a bottom surface of the outer ring body, wherein the mounting support has a vacuum hole extending through the mounting support and in fluid communication with the first and second vacuum ports.

11 . The vacuum tip of claim 8 , wherein each of the plurality of the support members tapers distally and outwardly.

12 . The vacuum tip of claim 11 , wherein each of the support members has opposing sidewalls defining a taper angle in a range of about 15 degrees to about 30 degrees.

13 . The vacuum tip of claim 8 , wherein the plurality of support members is equally spaced around a circumference of the outer ring body.

14 . The vacuum tip of claim 13 , wherein the number of the plurality of the support members is three.

15 . The vacuum tip of claim 8 , wherein the outer ring body, the inner ring body, and the support members are made of a metal, an alloy, a plastic, a rubber, a stainless steel, a ceramic, or a composite material.

16 . A pick-and-place tool, comprising:
a flipper, comprising:
a vacuum tip operable to pick up an object, comprising:
a body having a top surface and a bottom surface;
a plurality of grooves formed in the top surface and into the body, the grooves extending radially outward from a center point of the body; and
a channel formed in the body and extending from a bottom of the grooves through the body to the bottom surface of the body; and

an arm coupled to the vacuum tip and operable to move back and forth between a first position and a second position; and
a vacuum head operable to pick up the object from the flipper and move the object between a third position and a fourth position.

17 . The pick-and-place tool of claim 16 , further comprising:
a mounting support coupled to the vacuum tip, wherein the mounting support has a vacuum hole aligned with and fluidly connected to the channel of the vacuum tip.

18 . The pick-and-place tool of claim 16 , wherein the plurality of the grooves is symmetric with respect to a vertical line extending through a center point of the body.

19 . The pick-and-place tool of claim 18 , wherein each of the plurality of the grooves has a first end connected to the channel at the center point and a second end terminated at or near a periphery of the body.

20 . The pick-and-place tool of claim 16 , wherein the body is cylindrical in shape.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Liu Ching Hsien
• Tseng Sheng-Po
• Chang Chen Liang
• Lee Chin-Szu
• Ho Yi Chen

Classifications

• B65G47/91

  incorporating pneumatic, e.g. suction, grippers · CPC title

• B25J15/0616 Primary

  with vacuum · CPC title