Shutter disc for a semiconductor processing tool

Patent metadata

Field	Value
Publication number	US-12215414-B2
Application number	US-202318447543-A
Country	US
Kind code	B2
Filing date	Aug 10, 2023
Priority date	Jul 22, 2021
Publication date	Feb 4, 2025
Grant date	Feb 4, 2025

Abstract

Some implementations described herein provide a shutter disc for use during a conditioning process within a processing chamber of a deposition tool. The shutter disc described herein includes a material having a wave-shaped section to reduce heat transfer to the shutter disc and to provide relief from thermal stresses. Furthermore, the shutter disc includes a deposition of a thin-film material on a backside of the shutter disc, where a diameter of the shutter disc causes a spacing between an inner edge of the thin-film material and an outer edge of a substrate support component. The spacing prevents an accumulation of material between the thin film material and the substrate support component, reduces tilting of the shutter disc due to a placement error, and reduces heat transfer to the shutter disc.

First claim

What is claimed is:

1. A shutter disc for use in a physical vapor deposition (PVD) processing chamber, comprising:
a body, comprising:
a portion having a cross-sectional wave-shape and comprising:
a plurality of concentric crest portions, and
a plurality of concentric trough portions,
wherein a top surface of at least one concentric trough portion, of the plurality of concentric trough portions, is at an equal height with or below a backside surface of at least one concentric crest portion of the plurality of concentric crest portions.

2. The shutter disc of claim 1 , wherein a peak-to-peak width of the plurality of concentric crest portions is in a range from approximately 30.0 mm to approximately 31.0 mm.

3. The shutter disc of claim 1 , wherein the body further comprises a planar section at an outer region of the body.

4. The shutter disc of claim 3 , wherein a thickness of the body in the planar section is greater than a thickness of the body in the portion having the cross-sectional wave-shape.

5. The shutter disc of claim 1 , wherein a thickness of the body is in a range of approximately 4.5 mm to approximately 5.5 mm.

6. The shutter disc of claim 1 , wherein the body further comprises a recess.

7. A deposition tool comprising:
a processing chamber;
a substrate support component included in the processing chamber; and
a shutter disc included on the substrate support component,
wherein the shutter disc comprises:
one or more wave-shaped sections, and
a thin-film material on an outer region of a backside surface of the shutter disc,
wherein a width of a spacing between an inner edge of the thin-film material and an outer edge of the substrate support component is included in a range of approximately 3 millimeters (mm) to approximately 5 mm.

8. The deposition tool of claim 7 , wherein the shutter disc further comprises a planar section.

9. The deposition tool of claim 7 , wherein the shutter disc further comprises the thin-film material on a top surface of the shutter disc.

10. The deposition tool of claim 9 , wherein the shutter disc further comprises:
a body,
wherein the thin-film material wraps around an edge of the body and onto the backside surface.

11. The deposition tool of claim 7 , wherein the one or more wave-shaped sections comprises a plurality of concentric wave shapes.

12. The deposition tool of claim 11 , wherein a peak-to-peak width of the plurality of concentric wave shapes is in a range from approximately 30.0 mm to approximately 31.0 mm.

13. The deposition tool of claim 7 , wherein the one or more wave-shaped sections comprises:
a plurality of concentric crest portions, and
a plurality of concentric trough portions.

14. A shutter disc for use in a physical vapor deposition (PVD) processing chamber, comprising:
a body, comprising:
a wave-shaped region comprising a cross-sectional wave shape, and
a planar region,
wherein a thickness of the body in the planar region is greater than a thickness of the body in the wave-shaped region.

15. The shutter disc of claim 14 , wherein a top surface of a trough portion in the wave-shaped region is below a backside surface of a crest in the wave-shaped region.

16. The shutter disc of claim 14 , wherein a top surface of a trough portion in the wave-shaped region is equal in height with a backside surface of a crest in the wave-shaped region.

17. The shutter disc of claim 14 , wherein a peak-to-peak width in the wave-shaped region is in a range from approximately 30.0 mm to approximately 31.0 mm.

18. The shutter disc of claim 14 , wherein the wave-shaped region comprises a plurality of concentric wave shapes.

19. The shutter disc of claim 14 , wherein a backside surface of the wave-shaped region comprises a plurality of concentric wave shapes.

20. The shutter disc of claim 14 , wherein a top surface of the wave-shaped region comprises the cross-sectional wave shape, and a backside surface of the wave-shaped region comprises another cross-sectional wave shape.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Wang Yi-Lin
• Lee Chin-Szu
• Chiu Hua-Sheng
• Chang Yi-Chao
• Mue Zih-Shou

Classifications

• H01J37/3447

  Collimators, shutters, apertures · CPC title

• H01J37/3441

  Dark space shields · CPC title

• B08B7/0035

  by radiant energy, e.g. UV, laser, light beam or the like · CPC title

• H01J2237/332

  Coating · CPC title

• C23C14/50

  Substrate holders · CPC title