Semiconductor processing tool and methods of operation

Patent metadata

Field	Value
Publication number	US-2025364295-A1
Application number	US-202519292566-A
Country	US
Kind code	A1
Filing date	Aug 6, 2025
Priority date	May 3, 2022
Publication date	Nov 27, 2025
Grant date	—

Abstract

Some implementations described herein provide a deposition tool that includes a grounding component between an edge ring of a substrate stage and a pumping plate component. The grounding component includes a grounding strap having a deformation region. The deformation region includes a recessed edge to reduce a likelihood of the grounding strap rubbing against a surface of the pumping plate component during operation of the deposition tool. Material properties of the grounding strap may reduce a likelihood of plastic deformation of the grounding strap during repeated cycling. In this way, an amount of particulates dislodged from the surface of the pumping plate component may be decreased to improve a yield of semiconductor product fabricated using the deposition tool. Furthermore, a frequency of servicing the grounding component may be decreased to decrease a downtime of the deposition tool and increase a throughput of semiconductor product fabricated using the deposition tool.

First claim

What is claimed is:

1 . A deposition tool, comprising:
a pumping plate component,
wherein the pumping plate component comprises an overhang region extending towards a deposition region of the deposition tool;
a substrate stage configured to position a semiconductor substrate within the deposition region; an edge ring attached to the substrate stage,
wherein the edge ring comprises a protrusion extending outwards from an outer perimeter of the substrate stage; and
a grounding component between a top-side surface of the protrusion and an under-side surface of the overhang region,
wherein the grounding component comprises a grounding strap forming an approximate elliptical shape in a vertical plane between the edge ring and the pumping plate component, and
wherein the grounding strap comprises a deformation region having a width that is lesser relative to a width of one or more of a pair of attach regions at opposing ends of the grounding strap.

2 . The deposition tool of claim 1 , wherein a property of the grounding strap comprises or more of:
a tensile strength greater than approximately 200 megapascals, a modulus of elasticity greater than approximately 100 gigapascals, or a Brinell hardness number greater than approximately 100.

3 . The deposition tool of claim 1 , wherein a property of the grounding strap comprises:
an electrical conductivity greater than approximately 0.9×10 6 siemens per meter.

4 . The deposition tool of claim 1 , further comprising:
a controller configured to:
determine, using a machine-learning model, a need to service the grounding component, and
transmit, to a notification system, an indication of the need to service the grounding component.

5 . The deposition tool of claim 1 , wherein each of the pair of attach regions comprises:
a pair of alignment holes.

6 . The deposition tool of claim 5 , wherein the approximate elliptical shape is formed by overlapping, and attaching, the pair of alignment holes to the top-side surface of the protrusion using a coupling component.

7 . A deposition tool, comprising:
a substrate stage; an edge ring coupled to the substrate stage; and a grounding strap, coupled to the edge ring, comprising:
a first attach region at a first end of the grounding strap;
a second attach region at a second end of the grounding strap,
wherein the second end is opposite the first end; and

a deformation region between the first attach region and the second attach region,
wherein a first lead-in from a first edge of the first attach region and a second lead-in from a second edge of the second attach region create a recessed edge within the deformation region, and
wherein the first attach region and the second attach region are attached to the edge ring to create an elliptical portion of a grounding component that includes the recessed edge.

8 . The grounding strap of claim 7 , wherein a material of the grounding strap comprises:
a type 301 stainless steel material.

9 . The grounding strap of claim 7 , wherein dimensional properties of the grounding strap comprise:
a length that is included in a range of approximately 108.9 millimeters to approximately 133.1 millimeters.

10 . The grounding strap of claim 7 , wherein dimensional properties of the deformation region comprise:
a width that is lesser relative to a width of at least one of the first attach region or the second attach region.

11 . The grounding strap of claim 7 , wherein dimensional properties of the recessed edge comprise:
a depth that is included in a range of approximately 1.8 millimeters to approximately 2.2 millimeters.

12 . The grounding strap of claim 7 , wherein dimensional properties of the deformation region comprise:
a length that is included in a range of approximately 70.2 millimeters to approximately 85.8 millimeters.

13 . The grounding strap of claim 7 , wherein dimensional properties of the deformation region comprise:
a width that is included in a range of approximately 5.9 millimeters to approximately 7.3 millimeters.

14 . The grounding strap of claim 7 , wherein dimensional properties of the first attach region or the second attach region comprise:
a width that is included in a range of approximately 9.6 millimeters to approximately 11.3 millimeters.

15 . The grounding strap of claim 7 , wherein dimensional properties of the first attach region or the second attach region comprise:
a length that is included in a range of approximately 18.0 millimeters to approximately 22.0 millimeters.

16 . A deposition tool, comprising:
a substrate stage; an edge ring interfacing a perimeter of the substrate stage; a pumping plate comprising an overhang region above the edge ring; and a grounding strap, between the edge ring and the overhang region of the pumping plate and having an elliptical portion.

17 . The deposition tool of claim 16 , wherein the elliptical portion of the grounding strap is in contact with the overhang region of the pumping plate.

18 . The deposition tool of claim 16 , wherein the grounding strap further comprises:
a coupling component coupled to the elliptical portion.

19 . The deposition tool of claim 18 , wherein the coupling component is in contact with the edge ring.

20 . The deposition tool of claim 19 , wherein the coupling component is coupled to opposing ends of the elliptical portion.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Peng Hsuan-Ying
• Lee Chin-Szu
• Shih Chiang Hsien
• Wu Chih-Chang
• Tung Che-Wei

Classifications

• H10P72/7618 Primary

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• H10W20/035

  combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers · CPC title

• H10W20/425

  Barrier, adhesion or liner layers · CPC title

• H10W20/081

  by forming openings in the dielectric parts · CPC title