Semiconductor structure and integrated assembly
US-2026076169-A1 · Mar 12, 2026 · US
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Bai Shijie patents
Bai Shijie is listed as an inventor on 40 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bai Shijie |
| Total patents | 40 |
| First publication | Dec 16, 2021 |
| Latest publication | Mar 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor structure
US-2026075799-A1 · Mar 12, 2026 · US
Fabrication method for semiconductor structure and semiconductor structure
US-2025380400-A1 · Dec 11, 2025 · US
Semiconductor structure and method for forming same
US-12495536-B2 · Dec 9, 2025 · US
Semiconductor structure and method for manufacturing same
US-12432940-B2 · Sep 30, 2025 · US
Method for fabricating semiconductor device and semiconductor device
US-12402295-B2 · Aug 26, 2025 · US
Method of manufacturing semiconductor structure and semiconductor structure
US-12363882-B2 · Jul 15, 2025 · US
Preparation method for semiconductor structure and same
US-12341010-B2 · Jun 24, 2025 · US
Memory device, and manufacturing method and driving method thereof
US-12317503-B2 · May 27, 2025 · US
Preparation method of semiconductor device
US-12278106-B2 · Apr 15, 2025 · US
Recent patents
Latest publications not already listed above.
Manufacturing method of semiconductor structure and semiconductor structure
US-12218220-B2 · Feb 4, 2025 · US
Manufacturing method of semiconductor structure with epitaxial layer forming extension portion
US-12213305-B2 · Jan 28, 2025 · US
Memory device capacitor contact structure and method for preparing same
US-12185519-B2 · Dec 31, 2024 · US
Method for manufacturing semiconductor structure and semiconductor structure
US-12165879-B2 · Dec 10, 2024 · US
Method for manufacturing semiconductor structure and same
US-12150294-B2 · Nov 19, 2024 · US
Semiconductor device manufacturing method comprising first conductive layer with increased roughness in array region
US-12108594-B2 · Oct 1, 2024 · US
Method for manufacturing semiconductor structure
US-12068160-B2 · Aug 20, 2024 · US
Formation method of semiconductor structure
US-11984352-B2 · May 14, 2024 · US
Laminated capacitor and method for manufacturing the same
US-11869929-B2 · Jan 9, 2024 · US
Semiconductor structure and method for forming semiconductor structure
US-2023386892-A1 · Nov 30, 2023 · US
Preparation method for semiconductor structure and same
US-2023282479-A1 · Sep 7, 2023 · US
Manufacturing method of semiconductor structure and semiconductor structure
US-2023231036-A1 · Jul 20, 2023 · US
Memory device, and manufacturing method and driving method thereof
US-2023232635-A1 · Jul 20, 2023 · US
Method of manufacturing semiconductor structure and semiconductor structure
US-2023187482-A1 · Jun 15, 2023 · US
Method for preparing semiconductor structure, semiconductor structure and semiconductor memory
US-2023164983-A1 · May 25, 2023 · US
Semiconductor structure and method for manufacturing same
US-2023133297-A1 · May 4, 2023 · US
Method for fabricating semiconductor device and semiconductor device
US-2023038593-A1 · Feb 9, 2023 · US
Semiconductor structure and method for forming same
US-2022392902-A1 · Dec 8, 2022 · US
Manufacturing method of semiconductor structure and semiconductor structure
US-2022336466-A1 · Oct 20, 2022 · US
Memory device capacitor contact structure and method for preparing same
US-2022310623-A1 · Sep 29, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Changxin Memory Tech Inc | 37 |
| Cxmt Corp | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B12/0335 | 14 |
| H10B12/09 | 10 |
| H10P76/4085 | 10 |
| H10B12/315 | 10 |
| H10D1/716 | 9 |