High-speed interconnects for printed circuit boards
US-2018332720-A1 · Nov 15, 2018 · US
by the use of a coupling agent, e.g. silane
by the use of a coupling agent, e.g. silane · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/389 |
| Official title | {by the use of a coupling agent, e.g. silane} |
| Display label | by the use of a coupling agent, e.g. silane |
| Total patents | 194 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 18 |
| 2017 | 12 |
| 2018 | 19 |
| 2019 | 16 |
| 2020 | 25 |
| 2021 | 17 |
| 2022 | 24 |
| 2023 | 20 |
| 2024 | 17 |
| 2025 | 13 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device
US-2018288881-A1 · Oct 4, 2018 · US
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device
US-2018288884-A1 · Oct 4, 2018 · US
Multilayer printed wiring board and method of manufacturing the same
US-2018279486-A1 · Sep 27, 2018 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2018279482-A1 · Sep 27, 2018 · US
Surface-treated copper foil
US-10070521-B2 · Sep 4, 2018 · US
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US-2018242450-A1 · Aug 23, 2018 · US
High-speed interconnects for printed circuit boards
US-10051746-B2 · Aug 14, 2018 · US
Conductive pattern, electric circuit, electromagnetic wave shield, and method for producing conductive pattern
US-2018206368-A1 · Jul 19, 2018 · US
Method for producing printed circuit board, and resin composition
US-2018163048-A1 · Jun 14, 2018 · US
Coating metal foil with n-heterocyclic carbene compounds containing organic functionalities for improving metal-to-resin adhesion
US-2018168051-A1 · Jun 14, 2018 · US
Production method for copper-clad laminate plate
US-2018139848-A1 · May 17, 2018 · US
Coating metal foil with N-heterocyclic carbene compounds containing organic functionalities for improving metal-to-resin adhesion
US-9974193-B2 · May 15, 2018 · US
Rapid PCB prototyping by selective adhesion
US-9955571-B2 · Apr 24, 2018 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-9955583-B2 · Apr 24, 2018 · US
Flexible printed circuit board
US-9942979-B2 · Apr 10, 2018 · US
Non-planar on-package via capacitor
US-2018098428-A1 · Apr 5, 2018 · US
Adhesion promoting agents for metallization of substrate surfaces
US-9920432-B2 · Mar 20, 2018 · US
Method for plating on surface of non-conductive substrate
US-2018030600-A1 · Feb 1, 2018 · US
Rapid pcb prototyping by selective adhesion
US-2017374741-A1 · Dec 28, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/389?
- CPC H05K3/389 is the Cooperative Patent Classification code for “by the use of a coupling agent, e.g. silane.”
- How many patents are filed under CPC H05K3/389 (by the use of a coupling agent, e.g. silane)?
- Our database includes 194 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/389 growing?
- Publication counts under this code: 17 in 2024 vs 13 in 2025 (latest complete years).