Multilayer printed wiring board and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2018279486-A1
Application number	US-201815987182-A
Country	US
Kind code	A1
Filing date	May 23, 2018
Priority date	Nov 30, 2015
Publication date	Sep 27, 2018
Grant date	—

Abstract

A multilayer printed wiring board and a method of manufacturing the same are provided. A multilayer printed wiring board of the present embodiment includes: a core base material formed by laminating a first wiring layer and a first insulating layer in this order on an insulating substrate; and a built-up layer formed by laminating a second wiring layer and a second insulating layer in this order on the core base material. A primer layer is formed between the second wiring layer and the first insulating layer, the second wiring layer has a lower surface at least part of which is in contact with the primer layer, and the second wiring layer has an upper surface and a side surface on both of which a tin-plated layer and a silane coupling layer are formed in this order.

First claim

What is claimed is:

1 . A multilayer printed wiring board, comprising;
a core base material formed by laminating a first wiring layer and a first insulating layer in this order on an insulating substrate, and a built-up layer formed by laminating a second wiring layer and a second insulating layer in this order on the core base material, a primer layer formed between the second wiring layer and the first insulating layer; wherein the second wiring layer has a lower surface at least part of which is in contact with the primer layer; and wherein the second wiring layer has an upper surface and a side surface on both of which a tin-plated layer and a silane coupling layer are formed in this order.

2 . A multilayer printed wiring board, comprising:
a core base material formed by laminating a first wiring layer and a first insulating layer in this order on an insulating substrate, and a built-up layer formed by laminating a second wiring layer and a second insulating layer in this order on the core base material, and, a primer layer formed between the second wiring layer and the first insulating layer; and, wherein the second wiring layer has a lower surface at least part of which is in contact with the primer layer; and wherein the second wiring layer has an upper surface and a side surface on both of which a silane coupling layer is formed.

3 . The multilayer printed wiring board of claim 1 , wherein the primer layer contains an epoxy resin.

4 . The multilayer printed wiring board of claim 1 , wherein the primer layer contains a polyimide resin or a polyamide resin.

5 . The multilayer printed wiring board of claim 1 , wherein the lower surface of the second wiring layer is in contact with the primer layer and the first wiring layer.

6 . The multilayer printed wiring board of claim 1 , wherein the second wring layer includes a copper electroless-plated layer contacting the primer layer, and a copper electroplated layer formed on the copper electroless-plated layer.

7 . A multilayer printed wiring board formed by, comprising:
alternately lamination of at least one wiring layer and at least one insulating layer on an insulating substrate, a primer layer formed on at least one of the insulating layers; wherein the wiring layer is formed on at least one of the primer layers; wherein the wiring layer formed on the primer layer has a lower surface at least part of which is in contact with the primer layer; and wherein the wiring layer whose lower surface is in contact with the primer layer has an upper surface and a side surface on both of which a tin-plated layer and a silane coupling layer are formed in this order.

8 . A multilayer printed wiring board formed by alternately laminating at least one wiring layer and at least one insulating layer on an insulating substrate, characterized in that:
a primer layer is formed on at least one of the insulating layers; the wiring layer is formed on at least one of the primer layers; the wiring layer formed on the primer layer has a lower surface at least part of which is in contact with the primer layer; and the wiring layer whose lower surface is in contact with the primer layer has an upper surface and a side surface on both of which a silane coupling layer is formed.

9 . A method of manufacturing a multilayer printed wiring board by forming a plurality of layers on a laminate by lamination of an insulating substrate and a first wiring layer formed on the insulating substrate, comprising:
a first step of forming a first insulating layer on the laminate so as to cover the first wiring layer; a second step of forming a primer layer and a copper layer in this order on the first insulating layer, the primer layer increasing adhesion between the first insulating layer and the copper layer; a third step of forming via holes penetrating the copper layer, the primer layer, and the first insulating layer to expose a surface of the first wiring layer; a fourth step of performing desmear treatment for removing smears generated in the via holes; a fifth step of removing the copper layer and exposing a surface of the primer layer, following the fourth step; a sixth step of forming a copper electroless-plated layer on the surface of the primer layer and bottom surfaces and sidewall surfaces of the via holes, following the fifth step; a seventh step of forming a resist pattern on a surface of the copper electroless-plated layer in regions where a second wiring layer is not to be formed, the resist pattern serving as a plating mask; an eighth step of forming a copper electroplated layer on a surface of the copper electroless-plated layer in regions where the resist pattern has not been formed; a ninth step of peeling the resist pattern, following the eighth step; a tenth step of removing the copper electroless-plated layer in regions empty of the resist pattern, following the ninth step, to form a second wiring layer and expose the surface of the primer layer, the second wiring layer including the copper electroless-plated layer and the copper electroplated layer; an eleventh step of forming a tin-plated layer on a surface of the second wiring layer and then forming a silane coupling layer on a surface of the tin-plated layer; and a twelfth step of forming a second insulating layer so as to cover the primer layer and the second wiring layer where the tin-plated layer and the silane coupling layer have been formed.

10 . A method of manufacturing a multilayer printed wiring board including a plurality of layers formed on a laminate that is a lamination of an insulating substrate and a first wiring layer formed on the insulating substrate, comprising:
a first step of forming a first insulating layer on the laminate so as to cover the first wiring layer; a second step of forming a primer layer and a copper layer in this order on the first insulating layer, the primer layer increasing adhesion between the first insulating layer and the copper layer; a third step of forming via holes penetrating the copper layer, the primer layer, and the first insulating layer to expose a surface of the first wiring layer; a fourth step of performing desmear treatment for removing smears generated in the via holes; a fifth step of removing the copper layer and exposing a surface of the primer layer, following the fourth step; a sixth step of forming a copper electroless-plated layer on the surface of the primer layer and bottom surfaces and sidewall surfaces of the via holes, following the fifth step; a seventh step of forming a resist pattern on a surface of the copper electroless-plated layer in regions where a second wiring layer is not to be formed, the resist pattern serving as a plating mask; an eighth step of forming a copper electroplated layer on a surface of the copper electroless-plated layer in regions where the resist pattern has not been formed; a ninth step of peeling the resist pattern, following the eighth step; a tenth step of removing the copper electroless-plated layer in regions empty of the resist pattern, following the ninth step, to form a second wiring layer and expose the surface of the primer layer, the second wiring layer including the copper electroless-plated layer and the copper electroplated layer; an eleventh step of forming a silane coupling layer on a surface of the second wiring layer; and a twelfth step of forming a second insulating layer so as to cover the primer layer and the second wiring layer where the silane coupling layer has been formed.

11 . A method of manufacturing a multilayer printed wiring board including a plurality of layers formed on a laminate that is a lamination of an

Assignees

• Toppan Printing Co Ltd

Inventors

• Matsumoto Hiroshi

Classifications

• H05K3/38 Primary

  Improvement of the adhesion between the insulating substrate and the metal · CPC title

• B23K26/36

  Removing material (B23K26/55, B23K26/57 take precedence) · CPC title

• H05K3/4602

  characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated · CPC title

• H05K1/03

  Use of materials for the substrate · CPC title

• H05K3/4626

  characterised by the insulating layers or materials (H05K3/4688 takes precedence) · CPC title