Method for plating on surface of non-conductive substrate

Patent metadata

Field	Value
Publication number	US-2018030600-A1
Application number	US-201715649712-A
Country	US
Kind code	A1
Filing date	Jul 14, 2017
Priority date	Jul 29, 2016
Publication date	Feb 1, 2018
Grant date	—

Abstract

A method for forming a metal layer with selectively high adhesion on a desired section(s) on a non-conductive substrate without etching a surface of the non-conductive substrate is disclosed. The method involves applying a specific photosensitive resin composition onto a non-conductive substrate to form a resin layer in a desired section(s) of the non-conductive substrate by exposure and development, and then, to perform pre-treatment with an alkaline solution.

First claim

What is claimed is:

1 . A method for forming a metal layer on a non-conductive substrate, comprising steps of:
(a) applying a photosensitive composition on a non-conductive substrate, and forming a photosensitive film; (b) exposing at least a portion of the photosensitive film, and solidifying an exposed portion of the photosensitive film; (c) having the substrate make contact with an alkaline developing fluid, and removing a unexposed portion of the photosensitive film; (d) thermally heating the substrate; (e) having the substrate make contact with an alkaline developing fluid, and pre-treating the exposed portion of the photosensitive film with the alkali pre-treatment fluid; (f) having the substrate make contact with a catalyst solution, and providing the catalyst to the pre-treated exposed portion; and then, (g) performing electroless metal plating on the exposed portion of the solidified photosensitive film on the substrate.

2 . The method according to claim 1 , wherein the photosensitive composition comprises a reactive polymer comprising an ethylene saturated bond group and at least one type to be selected from a carboxyl group and a sulfo group.

3 . The method according to claim 1 , wherein the alkaline pre-treatment liquid comprises hydroxide of alkali metal or an organic amine.

4 . The method according to claim 1 , wherein the catalyst solution comprises metal to be selected from palladium, copper, silver, gold, nickel, platinum, ruthenium, rhodium, osmium and iridium.

5 . The method according to claim 1 , wherein the metal of the electroless metal plating is selected from copper, nickel, gold, palladium, silver, cobalt, zinc and alloys thereof.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Okada Hiroki
• Li Shenghua
• Haga Mitsuru

Classifications

• H05K3/389

  by the use of a coupling agent, e.g. silane · CPC title

• G03F7/0035 Primary

  Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• C23C18/1605

  by masking · CPC title

• C23C18/1893

  with use of organic or inorganic compounds other than metals, first · CPC title