Method for producing printed circuit board, and resin composition

Patent metadata

Field	Value
Publication number	US-2018163048-A1
Application number	US-201615736533-A
Country	US
Kind code	A1
Filing date	Jul 4, 2016
Priority date	Jul 6, 2015
Publication date	Jun 14, 2018
Grant date	—

Abstract

It is intended to provide a method for producing a printed circuit board capable of enhancing the adhesion between the inorganic filler-containing insulating layer and the conductor layer of a printed circuit board. The method for producing a printed circuit board of the present invention is a method for producing a printed circuit board, having an alkali treatment step of bringing a surface of an insulating layer for a printed circuit board into contact with an aqueous alkali solution, and a conductor layer forming step of forming a conductor layer on at least a part of the surface of the insulating layer that has undergone the alkali treatment step, wherein the insulating layer contains a resin composition containing a thermosetting resin, a silane compound having a (meth)acrylic skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

First claim

1 . A method for producing a printed circuit board, comprising:
an alkali treatment step of bringing a surface of an insulating layer for a printed circuit board into contact with an aqueous alkali solution, and a conductor layer forming step of forming a conductor layer on at least a part of the surface of the insulating layer that has undergone the alkali treatment step, wherein the insulating layer comprises a resin composition comprising a thermosetting resin, a silane compound having a (meth)acrylic skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

2 . The production method according to claim 1 , wherein the resin composition comprises a maleimide compound as the thermosetting resin.

3 . The production method according to claim 2 , wherein the resin composition comprises, as the maleimide compound, at least one compound selected from the group consisting of bis(4-maleimidophenyl)methane, 2,2-bis{4-(4-maleimidophenoxy)-phenyl}propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, and a maleimide compound represented by the following formula (6):

wherein each R 5 independently represents a hydrogen atom or a methyl group, and n 1 represents an integer of 1 or larger.

4 . The production method according to claim 1 , wherein the resin composition comprises an alkenyl-substituted nadimide as the thermosetting resin.

5 . The production method according to claim 4 , wherein the resin composition comprises, as the alkenyl-substituted nadimide, a compound represented by the following formula (1):

wherein each R 1 independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R 2 represents an alkylene group having 1 to 6 carbon atoms, a phenylene group, a biphenylene group, a naphthylene group, or a group represented by the following formula (2) or (3):

wherein R 3 represents a methylene group, an isopropylidene group, or a substituent represented by CO, O, S, or SO 2 , and

wherein each R 4 independently represents an alkylene group having 1 to 4 carbon atoms, or a cycloalkylene group having 5 to 8 carbon atoms.

6 . The production method according to claim 4 , wherein the resin composition comprises, as the alkenyl-substituted nadimide, a compound represented by the following formula (4) and/or (5):

7 . The production method according to claim 1 , wherein the resin composition comprises, as the silane compound having a (meth)acrylic skeleton and a hydrolyzable group or a hydroxy group, a compound represented by the following formula (C):

wherein R 13 represents a hydrolyzable group or a hydroxy group; R 14 represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; when a plurality of R 13 or R 14 are present, the plurality of R 13 or R 14 are the same as or different from each other; R 15 represents a hydrogen atom or a methyl group; R 16 represents an alkylene group having 2 to 10 carbon atoms; and j represents an integer of 1 to 3.

8 . The production method according to claim 1 , wherein the resin composition further comprises one or more compounds selected from the group consisting of a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, an aminosilane compound having an amino group and a hydrolyzable group or a hydroxy group, and a vinylsilane compound having a vinyl group and a hydrolyzable group or a hydroxy group.

9 . The production method according to claim 1 , wherein the resin composition further comprises a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group.

10 . The production method according to claim 8 , wherein the resin composition comprises, as the silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, a compound represented by the following formula (D):

wherein R 10 represents a hydrolyzable group or a hydroxy group; R 11 represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; when a plurality of R 10 or R 11 are present, the plurality of R 10 or R 11 are the same as or different from each other; R 12 represents an alkylene group having 1 to 10 carbon atoms; and m represents an integer of 1 to 3.

11 . The production method according to claim 1 , wherein the resin composition further comprises a cyanate ester compound.

12 . The production method according to claim 11 , wherein the resin composition comprises, as the cyanate ester compound, a compound represented by the following formula (7) and/or (8):

wherein each R 6 independently represents a hydrogen atom or a methyl group, and n 2 represents an integer of 1 or larger, and

wherein each R 7 independently represents a hydrogen atom or a methyl group, and n 3 represents an integer of 1 or larger.

13 . The production method according to claim 1 , wherein the inorganic filler is one or more selected from the group consisting of silica, alumina, and boehmite.

14 . The production method according to claim 1 , wherein the insulating layer is obtained from a prepreg in which a base material is impregnated or coated with the resin composition.

15 . The production method according to claim 14 , wherein the base material is at least one material selected from the group consisting of E glass cloth, T glass cloth, S glass cloth, Q glass cloth, and an organic fiber cloth.

16 . The production method according to claim 1 , wherein the insulating layer is obtained from a resin sheet in which a support is coated with the resin composition.

17 . The production method according to claim 1 , wherein the insulating layer is obtained from a laminate obtained in such a way that one or more layers of at least one selected from the group consisting of a prepreg in which a base material is impregnated or coated with the resin composition and a resin sheet in which a support is coated with the resin composition are laminated and cured.

18 . The production method according to claim 1 , wherein the insulating layer is obtained from a metal-clad laminate obtained in such a way that at least one selected from the group consisting of a prepreg in which a base material is impregnated or coated with the resin composition and a resin sheet in which a support is coated with the resin composition and a metal foil are laminated and cured.

19 . The production method according to claim 1 , wherein the conductor layer is a layer formed by plating treatment.

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Tomizawa Katsuya
• Takahashi Hiroshi
• Shiga Eisuke

Classifications

• H05K3/188

  by direct electroplating · CPC title

• C09D179/085

  Unsaturated polyimide precursors · CPC title

• H05K2203/0723

  Electroplating, e.g. finish plating · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title

• C08K5/541

  containing oxygen · CPC title