Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

Patent metadata

Field	Value
Publication number	US-9955583-B2
Application number	US-201414907478-A
Country	US
Kind code	B2
Filing date	Jul 23, 2014
Priority date	Jul 23, 2013
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm.

First claim

The invention claimed is:

1. A surface-treated copper foil, wherein a surface treated layer is formed on a copper foil, wherein the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm.

2. The surface-treated copper foil according to claim 1 , wherein at least one of the following (1) to (4) is satisfied:
(1) the surface-treated layer is a roughening-treated layer,
(2) the surface-treated layer is a roughening-treated layer, and the surface-treated copper foil has, on the surface of the roughening-treated layer, one or more layers selected from the group consisting of a heat resistant layer, a rust-preventing layer, a chromate-treated layer and a silane coupling treated layer,
(3) the surface-treated layer is one or more layers selected from the group consisting of a roughening-treated layer, a heat resistant layer, a rust-preventing layer, a chromate-treated layer and a silane coupling treated layer, or
(4) the surface-treated layer is provided with a resin layer on the surface-treated layer.

3. A copper foil with carrier, comprising on one side or both sides of the carrier, an intermediate layer and an ultra-thin copper layer in this order, wherein the ultra-thin copper layer is the surface-treated copper foil according to claim 1 , and optionally the surface-treated copper foil comprises a resin layer on the surface treated layer.

4. The surface-treated copper foil according to claim 1 , wherein at least one of the following (1) or (2) is satisfied:
(1) the surface roughness Sz of the surface of the surface-treated layer is 2 to 3.23 μm,
(2) the ratio B/A of the three-dimensional surface area B to the two-dimensional surface area A of the surface of the surface-treated layer is 1.01 to 1.2401.

5. The surface-treated copper foil according to claim 1 , wherein the ratio B/A of the three-dimensional surface area B to the two-dimensional surface area A of the surface of the surface-treated layer is 1.05 to 1.8.

6. A method for producing a copper clad laminate comprising:
a step of preparing the surface-treated copper foil according to claim 1 , or a copper foil with carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, the ultra-thin copper layer being the surface-treated copper foil of claim 1 , and
a step of laminating the surface-treated copper foil or the copper foil with carrier on an insulating substrate.

7. A method for producing a printed wiring board comprising:
a step of preparing the surface-treated copper foil according to claim 1 , or a copper foil with carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, the ultra-thin copper layer being the surface-treated copper foil of claim 1 , and
a step of producing a printed wiring board with the surface-treated copper foil or the copper foil with carrier.

8. A method for producing an electronic device comprising:
a step of producing the printed wiring board by the method according to claim 7 , and
a step of producing an electronic device with the printed wiring board.

9. A method for producing a printed wiring board, comprising:
a step of preparing the following (a) or (b), and (c) or (d),
(a) the surface-treated copper foil according to claim 1 , the surface-treated copper foil optionally having a resin layer on the surface-treated layer thereof,
(b) a copper foil with carrier comprising a carrier, an intermediate layer, an ultra-thin copper layer and optionally a resin layer in this order, the ultra-thin copper layer being the surface-treated copper foil of claim 1 ,
(c) an insulating substrate,
(d) a resin layer formed with a metal foil or a copper foil with carrier;
a step of laminating the surface-treated copper foil, via the surface-treated layer side thereof, on the insulating substrate or the resin layer, or a step of laminating the copper foil with carrier, via the ultra-thin copper layer side thereof, on the insulating substrate or the resin layer, and then, peeling the carrier of the copper foil with carrier;
a step of removing the surface-treated copper foil on the insulating substrate or the resin layer, or a step of removing the ultra-thin copper layer on the insulating substrate or the resin layer after the peeling of the carrier; and
a step of forming a circuit on the surface of the insulating substrate or the resin layer with the surface-treated copper foil or the ultra-thin copper layer removed therefrom.

10. A method for producing a printed wiring board, comprising:
a step of preparing the following (e) or (f), and (g) or (h),
(e) the surface-treated copper foil according to claim 1 ,
(f) a copper foil with carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, the ultra-thin copper layer being the surface-treated copper foil of claim 1 ,
(g) an insulating substrate,
(h) a resin layer formed with a metal foil or a copper foil with carrier;
a step of forming a copper clad laminate by laminating the surface-treated copper foil, via the surface-treated layer side thereof, on the insulating substrate or on the resin layer, or by laminating the copper foil with carrier, via the ultra-thin copper layer side thereof, on the insulating substrate or on the resin layer, and then, peeling the carrier of the copper foil with carrier; and
a step of subsequently forming a circuit by a semi-additive method, a subtractive method, a partly additive method or a modified semi-additive method.

11. A method for producing a printed wiring board, comprising:
a step of preparing the surface-treated copper foil according to claim 1 , with a circuit formed on the surface-treated layer formed side, or a copper foil with carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, the ultra-thin copper layer being the surface-treated copper foil of claim 1 , with a circuit formed on the surface thereof on the ultra-thin copper layer side;
a step of forming a resin layer on the surface of the surface-treated copper foil or the surface of the copper foil with carrier so as for the circuit to be embedded;
a step of forming a circuit on the surface of the resin layer; and
a step of exposing the circuit embedded in the resin layer by removing the surface-treated copper foil or the copper foil with carrier.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Ishii Masafumi
• Honda Misato
• Miyamoto Nobuaki

Classifications

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title

• H05K3/384

  by plating · CPC title

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

• C25D7/0614

  Strips or foils · CPC title

• C25D3/38

  of copper · CPC title