Rapid PCB prototyping by selective adhesion

Patent metadata

Field	Value
Publication number	US-9955571-B2
Application number	US-201715700433-A
Country	US
Kind code	B2
Filing date	Sep 11, 2017
Priority date	Dec 2, 2015
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

First claim

Having thus described various embodiments of the invention, what is claimed as new and desired to be protected by Letters Patent includes the following:

1. A PCB comprising:
a substrate having a first side and a second side opposite the first side;
a curable adhesive adjacent the first side of the substrate;
a circuit pattern positioned on the second side of the substrate such that the circuit pattern obscures portions of the curable adhesive and does not obscure other portions of the curable adhesive, the unobscured portions of the curable adhesive being configured to cure when exposed to a curing process;
a conductive layer adjacent the curable adhesive opposite the substrate, portions of the conductive layer being configured to be bonded to the cured portions of the curable adhesive such that the bonded portions of the conductive layer are retained by the substrate so that the substrate, curable adhesive, and bonded portions of the conductive layer form a circuit.

2. The PCB of claim 1 , further including a conductive layer support adjacent the conductive layer opposite the curable adhesive, the conductive layer support being configured to be separated from the substrate such that portions of the conductive layer other than the bonded portions are retained by the conductive layer support.

3. The PCB of claim 2 , wherein the substrate is a flexible substrate and the flexible substrate and the conductive layer support are configured to be peeled apart.

4. The PCB of claim 1 , wherein the circuit pattern is a positive or negative of the circuit.

5. The PCB of claim 4 , wherein the circuit pattern is pre-printed and includes common connections or components.

6. The PCB of claim 1 , wherein the circuit includes circuit components that are circuit traces configured to be soldered to electrical components.

7. The PCB of claim 1 , wherein the PCB is configured to contain pre-formed conductive vias between layers.

8. A PCB comprising:
a substrate having a first side and a second side opposite the first side;
a curable adhesive adjacent the first side of the substrate;
a circuit pattern comprised of an opaque ink positioned on the second side of the substrate such that the circuit pattern obscures portions of the curable adhesive and leaves other portions of the curable adhesive unobscured, the unobscured portions of the curable adhesive being configured to cure when exposed to light traversing through the circuit pattern; and
a conductive layer adjacent the curable adhesive opposite the substrate, portions of the conductive layer being configured to be bonded to the cured portions of the curable adhesive such that the bonded portions of the conductive layer are retained by the substrate so that the substrate, curable adhesive, and bonded portions of the conductive layer form a circuit with the bonded portions of the conductive layer forming one or more circuit traces, the circuit traces being configured to be soldered to circuit components.

9. A method for producing a circuit, the method comprising:
providing a substrate having a curable adhesive adjacent a first side of the substrate;
providing a conductive layer adjacent the curable adhesive opposite the substrate;
forming a circuit pattern on a second side of the substrate opposite the first side such that the circuit pattern obscures portions of the curable adhesive and other portions of the curable adhesive are unobscured;
exposing the substrate and the circuit pattern to a curing process so that portions of the curable adhesive not obscured by the circuit pattern cure and thereby bond to corresponding portions of the conductive layer and the circuit pattern prevents portions of the curable adhesive obscured by the circuit pattern from curing and thereby do not bond to other portions of the conductive layer; and
separating the substrate and non-bonded portions of the conductive layer such that the portions of the conductive layer bonded to the curable adhesive are retained by the curable adhesive, the substrate, curable adhesive, bonded portions of the conductive layer forming a circuit.

10. The method of claim 9 , further including the step of providing a conductive layer support adjacent the conductive layer opposite the curable adhesive that is configured to retain the non-bonded portions of the conductive layer.

11. The method of claim 10 , wherein the substrate is a flexible substrate, and wherein the step of forming the circuit pattern includes printing an opaque circuit pattern onto the flexible substrate.

12. The method of claim 11 , wherein the step of forming the opaque circuit pattern includes printing the opaque circuit pattern via an ink printer.

13. The method of claim 11 , wherein the flexible substrate, curable adhesive, conductive layer, and conductive layer support cooperatively form a laminate page.

14. The method of claim 11 , wherein the opaque circuit pattern is a positive or negative circuit pattern.

15. The method of claim 11 , wherein the step of forming the opaque circuit pattern includes manually drawing the opaque circuit pattern onto the flexible substrate.

16. The method of claim 11 , further comprising the step of bonding the circuit to a surface having a three-dimensional contour.

17. The method of claim 11 , wherein the conductive layer includes pre-cut regions.

18. The method of claim 11 , wherein the second side of the flexible substrate includes pre-printed circuit design components.

19. The method of claim 11 , wherein the circuit is configured to be laminated so as to provide a protective layer or non-conductive barrier.

20. The method of claim 9 , further comprising the steps of designing a circuit pattern and generating the circuit pattern according to the circuit pattern via computer-aided design software.

Assignees

• Honeywell Federal Mfg & Tech Llc

Inventors

• Hatch Jonathan Douglas
• Hatch Stephen Mcgarry

Classifications

• H05K2201/05

  Flexible printed circuits [FPCs] · CPC title

• H05K3/125

  by ink-jet printing · CPC title

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H05K1/0306 Primary

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title