Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device

Patent metadata

Field	Value
Publication number	US-2018288881-A1
Application number	US-201815923024-A
Country	US
Kind code	A1
Filing date	Mar 16, 2018
Priority date	Mar 31, 2017
Publication date	Oct 4, 2018
Grant date	—

Abstract

The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed.
The surface treated copper foil comprises a copper foil, and
a roughening treatment layer on at least one surface of the copper foil, wherein an aspect ratio of roughening particles of the roughening treatment layer satisfies one or more of the following items (1) and (2), the aspect ratio being a height of the roughening particles/a thickness of the roughening particles: (1) the aspect ratio of the roughening particles is 3 or less, (2) the aspect ratio of the roughening particles satisfies any one of the following items (2-1) or (2-2): (2-1) the aspect ratio of the roughening particles is 10 or less in the case that the height of the roughening particles is more than 500 nm and 1000 nm or less, (2-2) the aspect ratio of the roughening particles is 15 or less in the case that the height of the roughening particles is 500 nm or less; and a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

First claim

1 . A surface treated copper foil, comprising
a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein an aspect ratio of roughening particles of the roughening treatment layer satisfies one or more of the following items (1) and (2), the aspect ratio being a height of the roughening particles/a thickness of the roughening particles: (1) the aspect ratio of the roughening particles is 3 or less, (2) the aspect ratio of the roughening particles satisfies any one of the following items (2-1) or (2-2): (2-1) the aspect ratio of the roughening particles is 10 or less in the case that the height of the roughening particles is more than 500 nm and 1000 nm or less, (2-2) the aspect ratio of the roughening particles is 15 or less in the case that the height of the roughening particles is 500 nm or less; and a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

2 . The surface treated copper foil according to claim 1 ,
wherein a color difference ΔE*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer of the surface treated copper foil is 65 or less.

3 . The surface treated copper foil according to claim 1 ,
wherein the height of the roughening particles is 1000 nm or more and the aspect ratio of the roughening particles is 3.0 or less.

4 . The surface treated copper foil according to claim 1 ,
wherein the height of the roughening particles is 500 nm or more and the aspect ratio of the roughening particles is 10.0 or less.

5 . The surface treated copper foil according to claim 1 ,
wherein the height of the roughening particles is 500 nm or less and the aspect ratio of the roughening particles is 1.9 or less.

6 . The surface treated copper foil according to claim 1 ,
wherein the aspect ratio of the roughening particles satisfies one or more of the items (1) and (2-2), and the height of the roughening particles is 400 nm or less.

7 . The surface treated copper foil according to claim 1 ,
wherein the height of the roughening particles is 1200 nm or less.

8 . The surface treated copper foil according to claim 1 ,
wherein the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 45 or more and 65 or less.

9 . The surface treated copper foil according to claim 1 ,
wherein the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 50.0 or less.

10 . The surface treated copper foil according to claim 1 ,
wherein the glossiness of the TD of the surface of the side of the roughening treatment layer is 21% or more.

11 . The surface treated copper foil according to claim 1 comprising,
on the surface of the roughening treated layer, one or more layers selected from the group consisting of a heat resistant layer, a rust preventive layer, a chromate treatment layer and a silane coupling treatment layer.

12 . The surface treated copper foil according to claim 1 ,
wherein the surface treated copper foil is for heat dissipation.

13 . A surface treated copper foil with resin layer, comprising
the surface treated copper foil according to claim 1 , and a resin layer on the surface of the side of the roughening treatment layer.

14 . The surface treated copper foil with resin layer according to claim 13 ,
wherein the resin layer is an adhesive resin and/or a semi-cured resin.

15 . A copper foil with carrier, comprising
a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 or a surface treated copper foil with resin layer, comprising the surface treated copper foil according to claim 1 , and a resin layer on the surface of the side of the roughening treatment layer.

16 . A laminate, comprising the surface treated copper foil according to claim 1 .

17 . A laminate, comprising the copper foil with carrier according to claim 15 .

18 . A laminate, comprising the copper foil with carrier according to claim 15 and a resin,
wherein a part or the whole of an end face of the copper foil with carrier is covered with the resin.

19 . A laminate, comprising two of the copper foils with carrier according to claim 15 .

20 . A method for manufacturing a printed wiring board, using the surface treated copper foil according to claim 1 .

21 . A method for manufacturing a printed wiring board, comprising
a step of forming a copper clad laminate comprising any one of the following steps (21-1) to (21-4): (21-1) a step of laminating the surface treated copper foil according to claim 1 and an insulating substrate, (21-2) a step of laminating a surface treated copper foil with resin layer, comprising the surface treated copper foil according to claim 1 , and a resin layer on the surface of the side of the roughening treatment layer and an insulating substrate, (21-3) a step of laminating a copper foil with carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 , and an insulating substrate, and then peeling off the carrier of the copper foil with carrier, (21-4) a step of laminating a copper foil with carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is a surface treated copper foil with resin layer, comprising the surface treated copper foil according to claim 1 , and a resin layer on the surface of the side of the roughening treatment layer, and an insulating substrate, and then peeling off the carrier of the copper foil with carrier; and a step of forming a circuit by a semi-additive method, a subtractive method, a partly additive method or a modified semi-additive method using the copper clad laminate.

22 . A method for manufacturing a printed wiring board, comprising
a step of forming a circuit on the surface of the side of the roughening treatment layer of the surface treated copper foil according to claim 1 , or on a surface of a copper foil with carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 ; a step of forming a resin layer on the surface of the surfaced treated copper foil, or on the surface of the copper foil with the carrier, so that the circuit is embedded in the resin layer; a step of forming a circuit on the resin layer; and after forming the circuit on the resin layer, a step of exposing the circuit embedded in the resin layer by removing the surface treated copper foil, or by peeling off the carrier or the ultra-thin copper layer and then removing the ultra-thin copper layer or the carrier.

23 . A method for manufacturing a printed wiring board, comprising
a step of laminating the copper foil with carrier according to claim 15 and a resin substrate; a step of forming, at least once, a resin layer and a circuit on a surface of the copper foil with carrier, the surface being on the side opposite to the side on which the resin substrate is laminated; and after forming the resin layer and the circuit, a step of peeling off the carrier or the ultra-thin copper layer from the copper foil with carrier.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Ori Yuki
• Arai Hideta
• Miki Atsushi
• Fukuchi Ryo

Classifications

• C25D11/38

  Chromatising · CPC title

• H05K2203/0307

  Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · CPC title

• H05K3/389

  by the use of a coupling agent, e.g. silane · CPC title

• H05K2203/0156

  Temporary polymeric carrier or foil, e.g. for processing or transferring · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title