Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device

Patent metadata

Field	Value
Publication number	US-2018288884-A1
Application number	US-201815936600-A
Country	US
Kind code	A1
Filing date	Mar 27, 2018
Priority date	Mar 31, 2017
Publication date	Oct 4, 2018
Grant date	—

Abstract

The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed. The surface treated copper foil, comprising a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein a surface of the side of the roughening treatment layer of the surface treated copper foil satisfies one or more selected from the following items (1-1) to (1-8), and
(1-1) a roughness Ra is 0.08 to 0.20 μm, (1-2) a roughness Rz is 1.00 to 2.00 μm, (1-3) a roughness Sq is 0.16 to 0.30 μm, (1-4) a roughness Ssk is −0.6 to −0.35, (1-5) a roughness Sa is 0.12 to 0.23 μm, (1-6) a roughness Sz is 2.20 to 3.50 μm, (1-7) a roughness Sku is 3.75 to 4.50, (1-8) a roughness Spk is 0.13 to 0.27 μm,

a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

First claim

1 . A surface treated copper foil, comprising
a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein a surface of the side of the roughening treatment layer of the surface treated copper foil satisfies one or more selected from the following items (1-1) to (1-8), and (1-1) a roughness Ra is 0.08 to 0.20 μm, (1-2) a roughness Rz is 1.00 to 2.00 μm, (1-3) a roughness Sq is 0.16 to 0.30 μm, (1-4) a roughness Ssk is −0.6 to −0.35, (1-5) a roughness Sa is 0.12 to 0.23 μm, (1-6) a roughness Sz is 2.20 to 3.50 μm, (1-7) a roughness Sku is 3.75 to 4.50, (1-8) a roughness Spk is 0.13 to 0.27 μm, a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

2 . A surface treated copper foil, comprising
a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein a surface of the side of the roughening treatment layer of the surface treated copper foil satisfies one or more selected from the following items (2-1) to (2-8), (2-1) a roughness Ra is 0.08 to 0.20 μm, (2-2) a roughness Rz is 1.00 to 2.00 μm, (2-3) a roughness Sq is 0.16 to 0.30 μm, (2-4) a roughness Ssk is −0.6 to −0.35, (2-5) a roughness Sa is 0.12 to 0.23 μm, (2-6) a roughness Sz is 2.20 to 3.50 μm, (2-7) a roughness Sku is 3.75 to 4.50, (2-8) a roughness Spk is 0.13 to 0.27 μm, a color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer of the surface treated copper foil is 65 or less, and a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

3 . The surface treated copper foil according to claim 1 ,
wherein a color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer of the surface treated copper foil is 45 to 65.

4 . The surface treated copper foil according to claim 2 ,
wherein a color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer of the surface treated copper foil is 45 to 65.

5 . The surface treated copper foil according to claim 1 comprising,
on a surface of the roughening treated layer, one or more layers selected from the group consisting of a heat resistant layer, a rust preventive layer, a chromate treatment layer and a silane coupling treatment layer.

6 . A heat dissipation substrate comprising the surface treated copper foil according to claim 1 .

7 . A surface treated copper foil with resin layer, comprising
the surface treated copper foil according to claim 1 , and a resin layer on the surface of the side of the roughening treatment layer of the surface treated copper foil.

8 . The surface treated copper foil with resin layer according to claim 7 , wherein the resin layer is an adhesive resin and/or a semi-cured resin.

9 . A copper foil with carrier, comprising
a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 .

10 . A laminate, comprising the surface treated copper foil according to claim 1 .

11 . A laminate, comprising the copper foil with carrier according to claim 9 .

12 . A method for manufacturing a printed wiring board, using the surface treated copper foil according to claim 1 .

13 . A method for manufacturing a printed wiring board, using the copper foil with carrier according to claim 9 .

14 . A method for manufacturing a printed wiring board, comprising
a step of preparing
the surface treated copper foil according to claim 1 , or
a copper foil with carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 , and
an insulating substrate,
a step of forming a copper clad laminate comprising the following steps (14-1) or (14-2): (14-1) a step of laminating the surface treated copper foil and the insulating substrate, (14-2) a step of laminating the copper foil with carrier and the insulating substrate, and then peeling off the carrier of the copper foil with carrier; and a step of forming a circuit by a semi-additive method, a subtractive method, a partly additive method or a modified semi-additive method using the copper clad laminate.

15 . A method for manufacturing a printed wiring board, comprising
a step of forming a circuit on the surface of the side of the roughening treatment layer of the surface treated copper foil according to claim 1 , or on a surface of the side of a ultra-thin copper layer or a surface of the side of a carrier of a copper foil with carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 ; a step of forming a resin layer on the surface of the side of the roughening treatment layer of the surface treated copper foil, or on a surface of the side of the ultra-thin copper layer or a surface of the side of the carrier of the copper foil with carrier, so that the circuit is embedded in the resin layer; a step of forming a circuit on the resin layer; and after forming the circuit on the resin layer, a step of exposing the circuit embedded in the resin layer by removing the surface treated copper foil, or by peeling off the carrier or the ultra-thin copper layer and then removing the ultra-thin copper layer or the carrier.

16 . A method for manufacturing a printed wiring board, comprising
a step of laminating
the surface treated copper foil according to claim 1 , or
a copper foil with carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 , and
a resin substrate;
a step of forming, at least once, a resin layer and a circuit on a surface of the surface treated copper foil, a surface of the surface treated copper foil with resin layer, or a surface of the copper foil with carrier, the surface being on the side opposite to the side on which the resin substrate is laminated; and after forming the resin layer and the circuit, a step of removing the resin substrate and the surface treated copper foil, or removing the resin substrate and the surface treated copper foil of the surface treated copper foil with resin layer, or peeling off the carrier or the ultra-thin copper layer from the copper foil with carrier.

17 . A method for manufacturing a printed wiring board, comprising
a step of forming, at least once, a resin layer and a circuit on the laminate according to claim 11 : and after forming the resin layer and the circuit, a step of peeling off the carrier or the ultra-thin copper layer from the copper foil with carrier constituting the laminate.

18 . A method for manufacturing an electronic device, using a printed wiring board manufactured by the method according to claim 12 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Ori Yuki
• Arai Hideta
• Miki Atsushi
• Fukuchi Ryo

Classifications

• B32B2307/306

  Resistant to heat · CPC title

• B32B15/18

  comprising iron or steel {(B32B15/011, B32B15/012 and B32B15/013 take precedence)} · CPC title

• B32B2255/205

  Metallic coating · CPC title

• B32B2307/538

  Roughness · CPC title

• B32B2307/752

  Corrosion inhibitor · CPC title