Surface-treated copper foil

Patent metadata

Field	Value
Publication number	US-10070521-B2
Application number	US-201314388838-A
Country	US
Kind code	B2
Filing date	Mar 29, 2013
Priority date	Mar 29, 2012
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 μg/dm2, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 μg/dm2. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications.

First claim

The invention claimed is:

1. A surface-treated copper foil, comprising:
a copper surface, and
an outermost layer including Si and N disposed over the copper surface, wherein:
the outermost layer is a dry plated layer or an aminosilane coupling treatment layer,
an amount of adhesion of Si in the outermost layer is in a range of 5.8 μg/dm 2 to 115.0 μg/dm 2 ,
an amount of adhesion of N in the outermost layer is in a range of 13.0 μg/dm 2 to 187.2 μg/dm 2 , and
a surface roughness Rz of the outermost layer is 0.30 μm to 0.92 μm, inclusive.

2. The surface-treated copper foil according to claim 1 , wherein the amount of adhesion of Si in the outermost layer is from 5.8 μg/dm 2 to 90.6 μg/dm 2 , the amount of adhesion of N in the outermost layer is from 13.0 μg/dm 2 to 89.0 μg/dm 2 , and the surface roughness Rz of the outermost layer is 0.85 μm or less.

3. The surface-treated copper foil according to claim 1 , wherein the amount of adhesion of Si in the outermost layer is from 20.5 μg/dm 2 to 90.6 μg/dm 2 , the amount of adhesion of N in the outermost layer is from 16.4 μg/dm 2 to 89.0 μg/dm 2 , and the surface roughness Rz of the outermost layer is 0.85 μm or less.

4. The surface-treated copper foil according to claim 1 , wherein the copper foil is a rolled copper foil or an electrolytic copper foil.

5. The surface-treated copper foil according to claim 1 , wherein the copper foil is joined to a flexible printed circuit board which can be used under a high frequency exceeding 1 GHz.

6. The surface-treated copper foil according to claim 1 , wherein:
the outermost layer is an aminosilane coupling treatment layer, and
the copper foil comprises at least one layer selected from the group consisting of a roughening treatment layer, a heat-resistant treatment layer, a rust-proofing treatment layer, and a chromate treatment layer disposed between the copper surface and the aminosilane coupling treatment layer.

7. The surface-treated copper foil according to claim 6 , wherein the copper foil has a chromate treatment layer on the copper surface, and the aminosilane coupling treatment layer on the chromate treatment layer.

8. The surface-treated copper foil according to claim 6 , wherein the copper foil has a roughening treatment layer on the copper surface, a chromate treatment layer on the roughening treatment layer, and the aminosilane coupling treatment layer on the chromate treatment layer.

9. The surface-treated copper foil according to claim 6 , wherein the copper foil has a roughening treatment layer on the copper surface, a rust-proofing treatment layer on the roughening treatment layer, a chromate treatment layer on the rust-proofing treatment layer, and the aminosilane coupling treatment layer on the chromate treatment layer.

10. The surface-treated copper foil according to claim 6 , wherein the copper foil has a roughening treatment layer on the copper surface, wherein the roughening treatment layer has a primary particle layer and a secondary particle layer on the primary particle layer.

11. The surface-treated copper foil according to claim 10 , wherein the roughening treatment layer has a primary particle layer of copper, and has a secondary particle layer made of a ternary alloy comprising copper, cobalt, and nickel on the primary particle layer.

12. The surface-treated copper foil according to claim 10 , wherein the roughening treatment layer has a primary particle layer of copper, and has a secondary particle layer made of a ternary alloy comprising copper, cobalt, and nickel on the primary particle layer, wherein the primary particle layer has an average particle size of 0.25 μm to 0.45 μm, and the secondary particle layer has an average particle size of 0.05 μm to 0.25 μm.

13. The surface-treated copper foil according to claim 10 , wherein the copper foil has a chromate treatment layer on the roughening treatment layer, and the aminosilane coupling treatment layer on the chromate treatment layer.

14. The surface-treated copper foil according to claim 10 , wherein the copper foil has a rust-proofing treatment layer on the roughening treatment layer, a chromate treatment layer on the rust-proofing treatment layer, and the aminosilane coupling treatment layer on the chromate treatment layer.

15. A printed circuit structure comprising:
a flexible printed circuit substrate comprising a liquid crystal polymer having a surface that is laminated to an outermost layer of a surface-treated copper foil, comprising:
a copper surface, and
an outermost layer including Si and N disposed over the copper surface, wherein:
the outermost layer is a dry plated layer or an aminosilane coupling treatment layer,
an amount of adhesion of Si in the outermost layer is in a range of 5.8 μg/dm 2 to 115.0 μg/dm 2 ,
an amount of adhesion of N in the outermost layer is in a range of 13.0 μg/dm 2 to 187.2 μg/dm 2 , and
a surface roughness Rz of the outermost layer is 0.30 μm to 0.92 μm, inclusive.

16. The printed circuit structure according to claim 15 , wherein:
the surface-treated copper foil has an ordinary peel strength at 90 degrees of 0.48 kg/cm or greater.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Fukuchi Ryo

Classifications

• Y10T428/12882

  Cu-base component alternative to Ag-, Au-, or Ni-base component · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• C23C22/24

  containing hexavalent chromium compounds · CPC title

• Y10T428/12937

  Co- or Ni-base component next to Fe-base component · CPC title

• C23C30/005

  on hard metal substrates · CPC title