Flexible printed circuit board

Patent metadata

Field	Value
Publication number	US-9942979-B2
Application number	US-201514930866-A
Country	US
Kind code	B2
Filing date	Nov 3, 2015
Priority date	Nov 3, 2014
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

A flexible printed circuit board (PCB) has stretchability and durability. The flexible PCB includes: a first polymer substrate having flexibility, stretchability, or elasticity; a second polymer substrate having flexibility, stretchability, or elasticity; a conductive track disposed between the first and second polymer substrates and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates.

First claim

What is claimed is:

1. A flexible printed circuit board (PCB) comprising:
a first polymer substrate having at least one of flexibility, stretchability, and elasticity;
a second polymer substrate having at least one of flexibility, stretchability, and elasticity;
a conductive track comprising metal nanowires disposed between the first polymer substrate and the second polymer substrate; and
a cured silane coupling agent configured to bond the conductive track to at least one of the first polymer substrate and the second polymer substrate,
wherein the metal nanowires comprise at least one of silver (Ag), gold (Au), copper (Cu), platinum (Pt), palladium (Pd), nickel (Ni), cobalt (Co), and an alloy thereof, and
wherein the metal nanowires are in contact with each other, thereby maintaining an electrically conductive network along an entirety of the conductive track, and
wherein the first polymer substrate and the second polymer substrate each comprise at least one of a polyamide-based resin, polyester-based resin, a polyethylene-based resin, a polypropylene-based resin, and a polycarbonate-based resin.

2. The flexible PCB of claim 1 , wherein the first polymer substrate and the second polymer substrate each have a thickness in a range of about 10 μm to about 3,000 μm.

3. The flexible PCB of claim 1 , wherein the metal nanowires have an average aspect ratio in a range of about 20 to about 300.

4. The flexible PCB of claim 1 , wherein the metal nanowires have an average diameter in a range of about 1 nm to about 500 nm.

5. The flexible PCB of claim 1 , wherein the metal nanowires have an average length in a range of about 5 μm to about 30 μm.

6. The flexible PCB of claim 1 , wherein the metal nanowires disposed in the conductive track have an average population density in a range of about 100 per square centimeter to about 200,000 per square centimeter.

7. The flexible PCB of claim 1 , wherein the metal nanowires comprise Ag.

8. The flexible PCB of claim 1 , wherein the cured silane coupling agent is produced from a silane coupling agent represented by a chemical formula of R n SiX (4-n) , wherein X indicates a hydrolytic group and R is a non-hydrolytic organic radical.

9. The flexible PCB of claim 8 , wherein R comprises at least one of an epoxy group, a (meth)acrylate group, an isocyanate group, a vinyl group, a styryl group, an amino group, an isocyanurate group, an ureide group, a mercapto group, and a sulfide group.

10. The flexible PCB of claim 8 , wherein the silane coupling agent comprises at least one of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane), 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl) ethyltriethoxysilane, 5,6-epoxyhexyltriethoxysilane, (3-gly cidoxypropyl)methyldiethoxysilane, (3-glycidoxypropyl)methyldimethoxy silane, and (3-glycidoxypropyl)dimethylethoxysilane.

11. The flexible PCB of claim 8 , wherein the silane coupling agent comprises at least one of 3-methacryloxypropyltrimethoxysilane, methacryloxypropyltrimethoxysilane, N-(3-acryloxy-2-hydroxypropyl)-3-amino propyltriethoxysilane, O-(methacryloxyethyl)-N-(triethoxy-silylpropyl)urethane, N-(3-methacryloxy-2-hydroxypropyl)-3-aminopropyltriethoxysilane, methacryloxy methyltriethoxysilane, methacryloxymethyltrimethoxy-silane, methacryloxypropyl triethoxysilane, (3-acryloxypropyl)methyldimethoxysilane, (methacryloxymethyl) methyl-diethoxysilane, (methacryloxymethyl)methyl-dimethoxysilane, (meth)acryloxypropylmethyldi-ethoxysilane), methacryloxypropylmethyldi-methoxysilane, and methacryloxypropyldimethylethoxy-silane, methacryloxypropyldimethylmethoxy silane.

12. The flexible PCB of claim 8 , wherein the silane coupling agent comprises at least one of isocyanotopropyltriethoxysilane, (isocyanatomethyl)methyldimethoxysilane, 3-isocyanatopropyltrimethoxysilane, tris[3-(trimethoxysilyl)propyl] isocyanurate, (3-triethoxysilylpropyl)-t-butylcarbamate, triethoxysilylpropylethylcarbamate, and 3-thiocyanatopropyl triethoxysilane.

13. The flexible PCB of claim 8 , wherein the silane coupling agent comprises at least one of allyltrimethoxysilane, 3-(N-styryl methyl-2-aminoethylamino)-propyltrimethoxysilane, vinyltriacetoxy silane, vinyltriethoxysilane, vinyltriisopropenoxysilane, vinyltriisopropoxy silane, vinyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyl trimethoxysilane, 4-aminobutyltriethoxysilane, m-aminophenyltrimethoxysilane, p-aminophenyltrimethoxysilane, aminophenyltrimethoxysilane, 3-aminopropyl tris(methoxyethoxy- ethoxy)silane, acetoxymethyltriethoxysilane, acetoxymethyl trimethoxysilane, acetoxypropyltrimethoxysilane, and benzoyloxypropyltrimethoxy silane.

14. The flexible PCB of claim 8 , further comprising a conductive pad configured to be electrically in contact with the conductive track.

Assignees

• Samsung Electronics Co Ltd
• Research & Business Found Sungkyunkwan Univ

Inventors

• Park Kyung-Wan
• Cho Shi-Yun
• Lee Hyo-Young
• Kim Hyun-Jung
• Kim Mee-Ree
• Kim Ik-Joon

Classifications

• B32B7/05

  the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14) · CPC title

• H05K2201/0133

  Elastomeric or compliant polymer · CPC title

• B32B2307/546

  Flexural strength; Flexion stiffness · CPC title

• H05K2201/026

  Nanotubes or nanowires · CPC title

• B32B3/08

  characterised by added members at particular parts {(layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18)} · CPC title