Conductive pattern, electric circuit, electromagnetic wave shield, and method for producing conductive pattern

Patent metadata

Field	Value
Publication number	US-2018206368-A1
Application number	US-201815918237-A
Country	US
Kind code	A1
Filing date	Mar 12, 2018
Priority date	Mar 28, 2012
Publication date	Jul 19, 2018
Grant date	—

Abstract

An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).

First claim

1 . A process for preparing a conductive pattern, the process comprising
applying a composition (b1-1) containing a compound (b1) having the functional group [X] onto a part of a surface or an entire surface of a substrate to form a coating film (b); applying a fluid (A1) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2) onto a part of a surface or an entire surface of the coating film (b); and heating the coating film; wherein a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) with the functional group [X] of the compound (b1).

2 . The process for preparing a conductive pattern according to claim 1 , wherein the compound (a1) having the basic nitrogen atom-containing group is a polyalkyleneimine, or a polyalkyleneimine having a polyoxyalkylene structure containing an oxyethylene unit.

3 . The process for preparing a conductive pattern according to claim 1 , wherein the functional group [X] is at least one selected from the group consisting of a keto group, an epoxy group, an acid group, an N-alkylol group, and an isocyanate group.

4 . The process for preparing a conductive pattern according to claim 1 , wherein the compound (b1) having the functional group [X] contains at least one selected from the group consisting of a urethane resin (x1) having the functional group [X], a vinyl resin (x2) having the functional group [X], and a urethane-vinyl composite resin (x3) having the functional group [X].

Assignees

• Dainippon Ink & Chemicals

Inventors

• Murakawa Akira
• Shirakami Jun
• Fujikawa Wataru
• Saitou Yukie

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P14/46

  using a liquid · CPC title

• H10W20/4473

  Conductive organic materials, e.g. conductive adhesives or conductive inks · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• H05K9/0081

  Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence) · CPC title