Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Patent metadata

Field	Value
Publication number	US-2018242450-A1
Application number	US-201615753017-A
Country	US
Kind code	A1
Filing date	Aug 6, 2016
Priority date	Aug 21, 2015
Publication date	Aug 23, 2018
Grant date	—

Abstract

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.

First claim

1 . A substrate for a printed circuit board, comprising a base film; and a metal layer disposed on at least one of surfaces of the base film,
wherein an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.

2 . The substrate for a printed circuit board according to claim 1 , wherein an amount of silicon present per unit area, the amount being determined on the basis of a peak area of a Si2p spectrum in XPS analysis of the exposed surface of the base film, is 1 atomic % or more and 10 atomic % or less.

3 . The substrate for a printed circuit board according to claim 1 , wherein a ratio of the amount of silicon present per unit area to the amount of nitrogen present per unit area of the exposed surface of the base film is 4 or less.

4 . The substrate for a printed circuit board according to claim 1 , wherein a coupling agent containing nitrogen or a group derived from the coupling agent is present in the vicinity of an interface between the base film and the metal layer.

5 . The substrate for a printed circuit board according to claim 4 , wherein the coupling agent is a silane coupling agent.

6 . The substrate for a printed circuit board according to claim 1 , wherein a surface of the metal layer, the surface being disposed on the base film side, has a ten-point average roughness Rz of 0.01 μm or more and 5.0 μm or less.

7 . The substrate for a printed circuit board according to claim 1 , wherein the base film contains a fluororesin as a main component.

8 . A printed circuit board comprising a base film; and a metal pattern disposed on at least one of surfaces of the base film,
wherein an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal pattern by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.

9 . A method for producing a substrate for a printed circuit board, the method comprising:
a step of applying a coupling agent containing nitrogen to one of surfaces of a metal layer; a step of stacking a base film on the surface of the metal layer, the surface having the coupling agent applied thereto; and a step of hot-pressing a stacked body of the metal layer and the base film.

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Printed Circuits Inc
• Sumitomo Electric Fine Polymer Inc

Inventors

• Yamanaka Yuichiro
• Oka Yoshio
• KIYA Satoshi
• Uchita Yoshifumi
• Nakabayashi Makoto

Classifications

• H05K2201/0154

  Polyimide · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K3/389 Primary

  by the use of a coupling agent, e.g. silane · CPC title

• H05K3/381

  by special treatment of the substrate · CPC title

• B32B15/088

  comprising polyamides · CPC title