Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US-9839124-B2 · Dec 5, 2017 · US
Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2203/0307 |
| Official title | Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites |
| Display label | Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites |
| Total patents | 189 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 20 |
| 2016 | 26 |
| 2017 | 16 |
| 2018 | 22 |
| 2019 | 21 |
| 2020 | 21 |
| 2021 | 14 |
| 2022 | 17 |
| 2023 | 8 |
| 2024 | 11 |
| 2025 | 11 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of attaching an electronic part to a copper plate having a surface roughness
US-9831157-B2 · Nov 28, 2017 · US
Production method and device of surface roughened copper plate, and surface roughened copper plate
US-9758890-B2 · Sep 12, 2017 · US
Copper foil and methods of use
US-2017203544-A1 · Jul 20, 2017 · US
Copper foil and methods of use
US-9707738-B1 · Jul 18, 2017 · US
Method of manufacturing wiring substrate, and wiring substrate
US-9699916-B2 · Jul 4, 2017 · US
Security mesh and method of making
US-2017171964-A1 · Jun 15, 2017 · US
Lithium-ion secondary battery, electrode for the secondary battery, and electrolytic copper foil for electrode for the secondary battery
US-9603245-B2 · Mar 21, 2017 · US
Resin-coated copper foil for manufacturing a printed circuit board and method of manufacturing a printed circuit board using the same
US-2017064841-A1 · Mar 2, 2017 · US
Copper foil for printed circuit
US-9580829-B2 · Feb 28, 2017 · US
Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device
US-2017042044-A1 · Feb 9, 2017 · US
Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device
US-2017042036-A1 · Feb 9, 2017 · US
Security mesh and method of making
US-9565777-B1 · Feb 7, 2017 · US
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
US-2017032978-A1 · Feb 2, 2017 · US
Resin composite electrolytic copper foil, copper clad laminate and printed wiring board
US-2016360615-A1 · Dec 8, 2016 · US
Printed wiring board and method for manufacturing the same
US-2016316558-A1 · Oct 27, 2016 · US
Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring Board, Electronic Apparatus and Method for Manufacturing Printed Wiring Board
US-2016303829-A1 · Oct 20, 2016 · US
Methods of forming articles including metal structures having maximized bond adhesion and bond reliability
US-9468986-B2 · Oct 18, 2016 · US
Multi-layer circuit member with reference circuit
US-9462676-B2 · Oct 4, 2016 · US
Copper foil for printed circuit
US-2016286665-A1 · Sep 29, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2203/0307?
- CPC H05K2203/0307 is the Cooperative Patent Classification code for “Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites.”
- How many patents are filed under CPC H05K2203/0307 (Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites)?
- Our database includes 189 publications tagged with this CPC code.
- Is patent activity under CPC H05K2203/0307 growing?
- Publication counts under this code: 11 in 2024 vs 11 in 2025 (latest complete years).