Methods of forming articles including metal structures having maximized bond adhesion and bond reliability

Patent metadata

Field	Value
Publication number	US-9468986-B2
Application number	US-201313954444-A
Country	US
Kind code	B2
Filing date	Jul 30, 2013
Priority date	Jul 30, 2013
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.

First claim

What is claimed is:

1. A method of effecting bond adhesion between metal structures, the method comprising:
forming a first metal structure on a substrate, wherein the first metal structure comprises grains having a {111} crystallographic orientation at an exposed contact surface of the first metal structure;
inducing formation of an uneven surface topology in the exposed contact surface of the first metal structure after forming the first metal structure to give rise to surface defects in the exposed contact surface of the first metal structure; and
bonding a second metal structure to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.

2. The method of claim 1 , wherein the first metal structure comprises aluminum and wherein forming the first metal structure comprises forming the first metal structure comprising aluminum on the substrate.

3. The method of claim 2 , wherein the first metal structure further comprises copper and wherein forming the first metal structure comprises forming the first metal structure comprising an alloy of aluminum and copper on the substrate.

4. The method of claim 1 , wherein the first metal structure comprises copper and wherein forming the first metal structure comprises forming the first metal structure comprising copper on the substrate.

5. The method of claim 1 , wherein forming the first metal structure comprises depositing metal of the first metal structure and managing deposition conditions to yield the grains having the {111} crystallographic orientation in an amount of from about 5 to about 20%, based on a total number of all grains in the exposed contact surface of the first metal structure.

6. The method of claim 1 , wherein the exposed contact surface of the first metal structure has a peripheral region and a body region enclosed by the peripheral region, and wherein forming the first metal structure comprises forming the first metal structure with a greater density of grains having the {111} crystallographic orientation in the body region than in the peripheral region as determined through optical analysis of a scanning electron micrograph of the first metal structure.

7. The method of claim 1 , wherein forming the first metal structure comprises controlling a thermal budget during formation of the first metal structure to promote formation and distribution of the grains having the {111} crystallographic orientation via thermal and/or stress-induced material transport within the first metal structure.

8. The method of claim 1 , wherein forming the first metal structure comprises forming the first metal structure so as to have a thickness of from about 0.5 to about 4 μm.

9. The method of claim 1 , wherein the first metal structure comprises a bond pad having the exposed contact surface and the second metal structure comprises a wire, and wherein bonding the second metal structure to the exposed contact surface of the first metal structure comprises bonding the wire to the exposed contact surface.

10. The method of claim 1 , wherein the first metal structure comprises a first interconnect disposed on the substrate and the second metal structure comprises a second interconnect overlying the first interconnect, and wherein bonding the second metal structure to the exposed contact surface of the first metal structure comprises forming the second interconnect overlying the first interconnect.

11. The method of claim 1 , wherein inducing formation of the uneven surface topology in the exposed contact surface of the first metal structure comprises heat treating the first metal structure.

12. The method of claim 11 , wherein heat treating the first metal structure comprises heat treating the first metal structure under conditions that generate compressive stress within the first metal structure, and wherein inducing formation of the uneven surface topology further comprises relaxing the compressive stress through hillock formation in the exposed contact surface.

13. The method of claim 11 , wherein heat treating the first metal structure comprises heat treating the first metal structure under conditions that generate tensive stress within the first metal structure, and wherein inducing formation of the uneven surface topology further comprises relaxing the tensive stress through grain collapse in the exposed contact surface.

14. The method of claim 11 , wherein heat treating the first metal structure comprises annealing and quenching the first metal structure.

15. The method of claim 1 , further comprising etching the exposed contact surface of the first metal structure prior to bonding the second metal structure thereto.

16. A method of preparing an article including bonded metal structures, the method comprising:
providing a substrate;
forming an electronic device on the substrate;
forming a first metal structure on the substrate, wherein the first metal structure is in electrical communication with the electronic device, wherein the first metal structure comprises grains having a {111} crystallographic orientation at an exposed contact surface of the first metal structure;
inducing formation of an uneven surface topology in the exposed contact surface of the first metal structure after forming the first metal structure to give rise to surface defects in the exposed contact surface of the first metal structure; and
bonding a second metal structure to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.

Assignees

• Globalfoundries Inc

Inventors

• De La Garza Ernesto Gene
• O'Toole Martin

Classifications

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/01953

  by etching · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/931

  Shapes of bond pads · CPC title