Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board

Patent metadata

Field	Value
Publication number	US-9839124-B2
Application number	US-201615015551-A
Country	US
Kind code	B2
Filing date	Feb 4, 2016
Priority date	Feb 6, 2015
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.

First claim

The invention claimed is:

1. A copper foil provided with a carrier comprising, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein at least one of the following (a) and (b) is satisfied:
(a) a specular gloss at 60° in a machine direction (MD) of the intermediate layer side surface of the ultrathin copper layer is 140 or less;
(b) a specular gloss at 60° in a transverse direction (TD) of the intermediate layer side surface of the ultrathin copper layer is 65 or less, wherein a ten point average roughness Rz in the MD direction of the intermediate layer side surface of the ultrathin copper layer measured using a contact roughness meter is 1.5 μm or less.

2. The copper foil provided with a carrier according to claim 1 , wherein a ten point average roughness Rz in the MD direction of the intermediate layer side surface of the ultrathin copper layer measured using a contact roughness meter is 0.80 μm or more.

3. The copper foil provided with a carrier according to claim 1 , wherein a ten point average roughness Rz in the TD direction of the intermediate layer side surface of the ultrathin copper layer measured using a contact roughness meter is 1.7 μm or less.

4. The copper foil provided with a carrier according to claim 1 , wherein a ten point average roughness Rz in the MD direction of the intermediate layer side surface of the ultrathin copper layer measured using a contact roughness meter/a ten point average roughness Rz in the TD direction of the intermediate layer side surface of the ultrathin copper layer measured using a contact roughness meter is 0.55 or more.

5. The copper foil provided with a carrier according to claim 1 , comprising a resin layer provided above the ultrathin copper layer.

6. A laminate fabricated using a copper foil provided with a carrier according to claim 1 .

7. A laminate comprising a copper foil provided with a carrier according to claim 1 and a resin, wherein a part or all of an edge face of the copper foil provided with a carrier is covered with the resin.

8. A laminate, wherein one copper foil provided with a carrier according to claim 1 is laminated from the carrier side or the ultrathin copper layer side on the carrier side or the ultrathin copper layer side of another copper foil provided with a carrier according to claim 1 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Kohiki Michiya

Classifications

• H05K3/421

  Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence) · CPC title

• C25D3/38

  of copper · CPC title

• C25D3/562

  containing more than 50% by weight of iron or nickel or cobalt · CPC title

• H05K2203/0307

  Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · CPC title

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title