Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device

Patent metadata

Field	Value
Publication number	US-2017042044-A1
Application number	US-201615229203-A
Country	US
Kind code	A1
Filing date	Aug 5, 2016
Priority date	Aug 6, 2015
Publication date	Feb 9, 2017
Grant date	—

Abstract

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 μm, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm 2 at 220° C. for 2 hours.

First claim

What is claimed is:

1 . A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 μm, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm 2 at 220° C. for 2 hours.

2 . The carrier-attached copper foil according to claim 1 , wherein the difference D2-D1 is 3.50 μm or less.

3 . The carrier-attached copper foil according to claim 2 , wherein the difference D2-D1 is 2.80 μm or less.

4 . The carrier-attached copper foil according to claim 3 , wherein the difference D2-D1 is 2.58 μm or less.

5 . The carrier-attached copper foil according to claim 4 , wherein the difference D2-D1 is 1.20 μm or less.

6 . The carrier-attached copper foil according to claim 1 , which comprises one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer,
said one or more layers being provided on one or both of the surfaces on the side of the ultrathin copper layer and on the side of the carrier when the carrier-attached copper foil of claim 1 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on one side of the surfaces of the carrier, said one or more layers being provided on one or both surfaces on the ultrathin copper layer side when the carrier-attached copper foil of claim 1 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on the both surfaces of the carrier.

7 . The carrier-attached copper foil according to claim 3 , which comprises one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer,
said one or more layers being provided on one or both of the surfaces on the side of the ultrathin copper layer and on the side of the carrier when the carrier-attached copper foil of claim 3 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on one side of the surfaces of the carrier, said one or more layers being provided on one or both surfaces on the ultrathin copper layer side when the carrier-attached copper foil of claim 3 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on the both surfaces of the carrier.

8 . The carrier-attached copper foil according to claim 4 , which comprises one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer,
said one or more layers being provided on one or both of the surfaces on the side of the ultrathin copper layer and on the side of the carrier when the carrier-attached copper foil of claim 4 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on one side of the surfaces of the carrier, said one or more layers being provided on one or both surfaces on the ultrathin copper layer side when the carrier-attached copper foil of claim 4 has the interlayer and the ultrathin copper layer in this order seen from the carrier, on the both surfaces of the carrier.

9 . The carrier-attached copper foil according to claim 6 , wherein the roughening treatment layer is a layer comprised of a simple substance selected from the group consisting of copper, nickel, phosphorous, tungsten, arsenic, molybdenum, chromium, iron, vanadium, cobalt, and zinc, or an alloy containing one or more simple substances selected from the group consisting of copper, nickel, phosphorous, tungsten, arsenic, molybdenum, chromium, iron, vanadium, cobalt, and zinc.

10 . The carrier-attached copper foil according to claim 1 , which comprises a resin layer on the ultrathin copper layer.

11 . The carrier-attached copper foil according to claim 6 , wherein the resin layer is provided on one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer.

12 . The carrier-attached copper foil according to claim 7 , wherein the resin layer is provided on one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer.

13 . The carrier-attached copper foil according to claim 8 , wherein the resin layer is provided on one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer.

14 . A laminate produced by using the carrier-attached copper foil of claim 1 .

15 . A laminate comprising the carrier-attached copper foil of claim 1 , and a resin, wherein the resin covers end surfaces of the carrier-attached copper foil either in part or as a whole.

16 . A laminate comprising a first carrier-attached copper foil laminated from the carrier side or the ultrathin copper layer side to the carrier side or the ultrathin copper layer side of a second carrier-attached copper foil, the first and the second carrier-attached copper foils being the carrier-attached copper foil of claim 1 .

17 . A method for producing a printed wiring board using the laminate of claim 14 .

18 . A method for producing a printed wiring board,
the method comprising: providing a dual layer of resin layer and circuit at least once one side or both sides of the laminate of claim 14 ; and detaching the ultrathin copper layer or the carrier from the carrier-attached copper foil included in the laminate after the dual layer of resin layer and circuit is formed at least once.

19 . A method for producing a printed wiring board by using the carrier-attached copper foil of claim 1 .

20 . A method for producing an electronic device by using a printed wiring board produced by using the method of claim 19 .

21 . A method for producing a printed wiring board,
the method comprising: preparing the carrier-attached copper foil of claim 1 , and an insulating substrate; laminating the carrier-attached copper foil and the insulating substrate to each other; forming a copper-clad laminated board by detaching the carrier of the carrier-attached copper foil after the carrier-attached copper foil and the insulating substrate are laminated to each other; and forming a circuit by using any of a semi-additive process, a subtractive process, a partly additive process, and a modified semi-additive process.

22 . A method for producing a printed wiring board,
the method comprising: forming a circuit on the surface of the carrier-attached copper foil of claim 1 on the side of the ultrathin copper layer or on the side of the carrier; forming a resin layer on the ultrathin copper layer- or carrier-side surface of the carrier-attached copper foil so as to make the circuit embedded in the resin layer; detaching the c

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Miyamoto Nobuaki

Classifications

• H05K2203/06

  Lamination · CPC title

• H05K3/4611

  by laminating two or more circuit boards (H05K3/4652 takes precedence) · CPC title

• H05K3/4661

  Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387) · CPC title

• H05K3/4682 Primary

  Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil · CPC title

• H05K3/025 Primary

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title