Method of manufacturing printed circuit board
US-2024414849-A1 · Dec 12, 2024 · US
Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device
US2017042036A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017042036-A1 |
| Application number | US-201615229194-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 5, 2016 |
| Priority date | Aug 6, 2015 |
| Publication date | Feb 9, 2017 |
| Grant date | — |
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- Title
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Abstract
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Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.181 to 2.922 μm.
First claim
Opening claim text (preview).
What is claimed is: 1 . A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order, wherein the maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.181 to 2.922 μm. 2 . The carrier-attached copper foil according to claim 1 , wherein the level difference Sk of a core portion as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.095 to 0.936 μm. 3 . The carrier-attached copper foil according to claim 1 , wherein the projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.051 to 0.478 μm. 4 . The carrier-attached copper foil according to claim 2 , wherein the projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.051 to 0.478 μm. 5 . The carrier-attached copper foil according to claim 1 , wherein the trough space volume Vvv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.003 to 0.020 μm 3 /μm 2 . 6 . The carrier-attached copper foil according to claim 2 , wherein the trough space volume Vvv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.003 to 0.020 μm 3 /μm 2 . 7 . The carrier-attached copper foil according to claim 3 , wherein the trough space volume Vvv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.003 to 0.020 μm 3 /μm 2 . 8 . The carrier-attached copper foil according to claim 4 , wherein the trough space volume Vvv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.003 to 0.020 μm 3 /μm 2 . 9 . The carrier-attached copper foil according to claim 1 , wherein the ratio Sv/Svk of maximum trough depth Sv and projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 3.549 to 10.777. 10 . The carrier-attached copper foil according to claim 2 , wherein the ratio Sv/Svk of maximum trough depth Sv and projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 3.549 to 10.777. 11 . The carrier-attached copper foil according to claim 3 , wherein the ratio Sv/Svk of maximum trough depth Sv and projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 3.549 to 10.777. 12 . The carrier-attached copper foil according to claim 4 , wherein the ratio Sv/Svk of maximum trough depth Sv and projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 3.549 to 10.777. 13 . The carrier-attached copper foil according to claim 5 , wherein the ratio Sv/Svk of maximum trough depth Sv and projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 3.549 to 10.777. 14 . The carrier-attached copper foil according to claim 6 , wherein the ratio Sv/Svk of maximum trough depth Sv and projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 3.549 to 10.777. 15 . The carrier-attached copper foil according to claim 7 , wherein the ratio Sv/Svk of maximum trough depth Sv and projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and et
Assignees
Inventors
Classifications
PCBs, i.e. printed circuit boards · CPC title
Wires; Strips; Foils · CPC title
comprising polyimides · CPC title
of copper · CPC title
- H05K1/09Primary
Use of materials for the {conductive, e.g. } metallic pattern · CPC title
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- What does patent US2017042036A1 cover?
- Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and…
- Who is the assignee on this patent?
- Jx Nippon Mining & Metals Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K1/09. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Feb 09 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).