Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring Board, Electronic Apparatus and Method for Manufacturing Printed Wiring Board

Patent metadata

Field	Value
Publication number	US-2016303829-A1
Application number	US-201415103318-A
Country	US
Kind code	A1
Filing date	Dec 10, 2014
Priority date	Dec 10, 2013
Publication date	Oct 20, 2016
Grant date	—

Abstract

A surface treated copper foil which allows the resin to have excellent transparency after removal of the copper foil by etching is provided. The surface treated copper foil has one surface and other surface each surface treated. An Sv defined by the following expression (1) is 3.5 or more:
Sv =(Δ B ×0.1)/( t 1− t 2)  (1)

which is determined, after laminating one surface to each of both surfaces of a polyimide resin substrate, removing the copper foil on each of both surfaces by etching, and photographing a printed matter with a linear mark, from the resulting observation spot versus brightness graph; and the surface treated other surface of the copper foil has a TD ten-spot average roughness Rz measured with a laser microscope using laser light having a wavelength of 405 nm, of 0.35 μm or more.

First claim

1 . A surface treated copper foil having one surface and other surface each surface treated,
wherein an Sv defined by the following expression (1) is 3.5 or more based on a brightness curve:
Sv =(Δ B× 0.1)/( t 1− t 2)  (1)

wherein the brightness curve is obtained, after laminating one surface of the copper foil to each of both surfaces of a polyimide resin substrate, removing the copper foil on each of both surfaces by etching, placing a printed matter with a linear mark under the exposed polyimide resin substrate, and photographing the printed matter through the polyimide resin substrate with a CCD camera, from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the printed matter for the respective observation spots along the direction perpendicular to the extending direction of the observed linear mark, the difference between the top average Bt and the bottom average Bb in the brightness curve extending from an end of the mark to a portion without the mark is represented by ΔB (ΔB=Bt−Bb), and wherein t1 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and Bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and 0.1ΔB in the range from the intersections of the brightness curve and Bt to a depth of 0.1ΔB with Bt as reference; and
wherein the surface treated other surface of the copper foil has a TD ten-spot average roughness Rz measured with a laser microscope using laser light having a wavelength of 405 nm, of 0.35 μm or more.

2 . The surface treated copper foil according to claim 1 , wherein the surface treated other surface of the copper foil has a TD arithmetic average roughness Ra measured with a laser microscope using laser light having a wavelength of 405 nm, of 0.05 μm or more.

3 . A surface treated copper foil having one surface and other surface each surface treated,
wherein an Sv defined by the following expression (1) is 3.5 or more based on a brightness curve:
Sv =(Δ B× 0.1)/( t 1− t 2)  (1)

wherein the brightness curve is obtained, after laminating one surface of the copper foil to each of both surfaces of a polyimide resin substrate, removing the copper foil on each of both surfaces by etching, placing a printed matter with a linear mark under the exposed polyimide resin substrate, and photographing the printed matter through the polyimide resin substrate with a CCD camera, from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the printed matter for the respective observation spots along the direction perpendicular to the extending direction of the observed linear mark, the difference between the top average Bt and the bottom average Bb in the brightness curve extending from an end of the mark to a portion without the mark is represented by ΔB (ΔB=Bt−Bb), and wherein t1 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and Bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and 0.1ΔB in the range from the intersections of the brightness curve and Bt to a depth of 0.1ΔB with Bt as reference; and
wherein the surface treated other surface of the copper foil has a TD arithmetic average roughness Ra measured with a laser microscope using laser light having a wavelength of 405 nm, of 0.05 μm or more.

4 . The surface treated copper foil according to claim 1 , wherein the surface treated other surface of the copper foil has a TD root mean square height Rq measured with a laser microscope using laser light having a wavelength of 405 nm, of 0.08 μm or more.

5 . A surface treated copper foil having one surface and other surface each surface treated,
wherein an Sv defined by the following expression (1) is 3.5 or more based on a brightness curve:
Sv =(Δ B× 0.1)/( t 1− t 2)  (1)

wherein the brightness curve is obtained, after laminating one surface of the copper foil to each of both surfaces of a polyimide resin substrate, removing the copper foil on each of both surfaces by etching, placing a printed matter with a linear mark under the exposed polyimide resin substrate, and photographing the printed matter through the polyimide resin substrate with a CCD camera, from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the printed matter for the respective observation spots along the direction perpendicular to the extending direction of the observed linear mark, the difference between the top average Bt and the bottom average Bb in the brightness curve extending from an end of the mark to a portion without the mark is represented by ΔB (ΔB=Bt−Bb), and wherein t1 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and Bt in the observation spot versus brightness graph, and t2 represents a value pointing the position of the intersection closest to the linear mark among the intersections of the brightness curve and 0.1ΔB in the range from the intersections of the brightness curve and Bt to a depth of 0.1ΔB with Bt as reference; and
wherein the surface treated other surface of the copper foil has a TD root mean square height Rq measured with a laser microscope using laser light having a wavelength of 405 nm, of 0.08 μm or more.

6 . The surface treated copper foil according to claim 1 , wherein the surface treatment of the other surface is a roughening treatment.

7 . The surface treated copper foil according to claim 1 , wherein the difference ΔB (ΔB=Bt−Bb) between the top average Bt and the bottom average Bb in the brightness curve extending from the end of the mark to the portion without the mark is 40 or more.

8 . The surface treated copper foil according to claim 7 , wherein ΔB in the observation spot versus brightness graph produced from the photographed image is 50 or more.

9 . The surface treated copper foil according to claim 1 , wherein the Sv defined by the expression (1) in the brightness curve is 3.9 or more.

10 . The surface treated copper foil according to claim 9 , wherein the Sv defined by the expression (1) in the brightness curve is 5.0 or more.

11 . The surface treated copper foil according to claim 1 , wherein the surface treatment of the one surface is a roughening treatment, the roughening treated surface has a TD ten-spot average roughness Rz measured with a contact roughness measuring tester, of 0.20 to 0.80 μm, the roughening treated surface has an MD glossiness at 60 degrees of 76 to 350%, and
the ratio A/B of the surface area A of the roughening treated surface to the area B of the roughening treated surface shown in the plan view from one surface side of the copper foil is 1.90 to 2.40.

12 . The surface treated copper foil according to claim 11 , wherein the MD glossiness at 60 degrees is 90 to 250%.

13 . The surface treated copper foil according to claim 11 , wherein the one surface has a TD ten-spot average roughness Rz measured with a contact roughness measuring tester, of 0.30 to 0.60 μm.

14 . The surface treated copper foil according to claim 11 , wherein the A/B is 2.00 to 2.20.

15 . The surface treated copper foil according to claim 11 ,

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Arai Hideta
• Miki Atsushi
• Arai Kohsuke
• Nakamuro Kaichiro

Classifications

• H05K3/384

  by plating · CPC title

• H05K2203/0307

  Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · CPC title

• H05K2201/0108

  Transparent · CPC title

• H05K3/36

  Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)} · CPC title

• B32B2307/412

  Transparent · CPC title