Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device

Patent metadata

Field	Value
Publication number	US-2017032978-A1
Application number	US-201615218466-A
Country	US
Kind code	A1
Filing date	Jul 25, 2016
Priority date	Jul 27, 2015
Publication date	Feb 2, 2017
Grant date	—

Abstract

A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 μm, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.

First claim

1 . A carrier-attached copper foil having a carrier, an intermediate layer and an ultra-thin copper layer in this order,
wherein an average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 μm in a cross section taken in a direction parallel to a through-thickness direction of the ultra-thin copper layer, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.

2 . The carrier-attached copper foil according to claim 1 , wherein the ten point average roughness Rz of the surface on the side of the ultra-thin copper layer is 0.11 to 1.9 μm.

3 . The carrier-attached copper foil according to claim 2 , wherein the ten point average roughness Rz of the surface on the side of the ultra-thin copper layer is 0.12 to 1.8 μm.

4 . The carrier-attached copper foil according to claim 1 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 5.8 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

5 . The carrier-attached copper foil according to claim 4 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 5.6 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

6 . The carrier-attached copper foil according to claim 5 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 2.2 to 5.6 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

7 . The carrier-attached copper foil according to claim 1 , wherein the carrier-attached copper foil is used for manufacturing a coreless printed wiring board.

8 . The carrier-attached copper foil according to claim 1 , wherein the carrier-attached copper foil has at least one layer selected from a group of a roughened layer, a heat-resistant layer, a rustproofing layer, a chromate treated layer, and a silane coupling-treated layer, and
when the carrier-attached copper foil according to claim 1 has the ultra-thin copper layer on one face of the carrier, the at least one layer is on at least one or both of a surface on a side of the ultra-thin copper layer and a surface on a side of the carrier, or when the carrier-attached copper foil according to claim 1 has the ultra-thin copper layer on each of both faces of the carrier, the at least one layer is on one or both of surfaces on sides of the ultra-thin copper layer.

9 . The carrier-attached copper foil according to claim 8 , wherein the roughened layer is a layer of an alloy including any one or at least one selected from a group consisting of copper, nickel, phosphorus, tungsten, arsenic, molybdenum, chromium, titanium, iron, vanadium, cobalt, and zinc.

10 . The carrier-attached copper foil according to claim 8 , wherein the carrier-attached copper foil has a resin layer on the at least one layer selected from the group of the roughened layer, the heat-resistant layer, the rustproofing layer, the chromate treated layer, and the silane coupling-treated layer.

11 . The carrier-attached copper foil according to claim 1 , wherein a resin layer is provided on the ultra-thin copper layer.

12 . A laminate comprising the carrier-attached copper foil according to claim 1 .

13 . A laminate comprising the carrier-attached copper foil according to claim 1 and a resin,
wherein a portion or all of edge faces of the carrier-attached copper foil is covered with the resin.

14 . A laminate comprising two carrier-attached copper foils according to claim 1 and a resin,
wherein the two carrier-attached copper foils are provided on the resin so that a surface on a side of the ultra-thin copper layer of one carrier-attached copper foil of the two carrier-attached copper foils and a surface on a side of the ultra-thin copper layer of another carrier-attached copper foil are exposed.

15 . A laminate wherein the carrier-attached copper foil according to claim 1 is laminated from a side of the carrier or a side of the ultra-thin copper layer on a side of the carrier or a side of the ultra-thin copper layer of another carrier-attached copper foil according to claim 1 .

16 . A printed wiring board manufacturing method of manufacturing a printed wiring board by using the carrier-attached copper foil according to claim 1 .

17 . A method of manufacturing a printed wiring board comprising:
preparing the carrier-attached copper foil according to claim 1 and an insulating substrate; laminating the carrier-attached copper foil and the insulating substrate; detaching the carrier from the carrier-attached copper foil after the carrier-attached copper foil and the insulating substrate are laminated to form a copper-clad laminate; and forming a circuit by any one of a semi-additive method, a subtractive method, a partly additive method, and a modified semi-additive method.

18 . A method of manufacturing a printed wiring board comprising:
forming a circuit on a surface on a side of the ultra-thin copper layer or a surface on a side of the carrier of the carrier-attached copper foil according to claim 1 ; forming a resin layer on the surface on the side of the ultra-thin copper layer or the surface on the side of the carrier of the carrier-attached copper foil so that the circuit is buried; detaching the carrier or the ultra-thin copper layer after forming the resin layer; and exposing, after detaching the carrier or the ultra-thin copper layer, the circuit that is formed on the surface on the side of the ultra-thin copper layer or the surface on the side of the carrier and is buried in the resin layer by removing the carrier or the ultra-thin copper layer.

19 . A method of manufacturing a printed wiring board comprising:
laminating the carrier-attached copper foil according to claim 1 on a resin substrate so as to attach a side of the carrier to the resin substrate; forming a circuit on the surface on the side of the ultra-thin copper layer of the carrier-attached copper foil; forming a resin layer on the surface on the side of the ultra-thin copper layer of the carrier-attached copper foil so that the circuit is buried; detaching the carrier after forming the resin layer; and exposing, after detaching the carrier, the circuit that is formed on the surface on the side of the ultra-thin copper layer and is buried in the resin layer by removing the ultra-thin copper layer.

20 . A method of manufacturing a printed wiring board, comprising:
laminating the carrier-attached copper foil according to claim 1 on a resin substrate so as to attach a surface on a side of the ultra-thin copper layer or a surface on a side of the carrier to the resin substrate; providing two layers including a resin layer and a circuit at least once on the surface on the side of the ultra-thin copper layer or the surface on the side of the carrier of the carrier-attached copper foil, the surface on the side of the ultra-thin copper layer or the surface on the side of the carrier being an opposite side of a side to which the resin substrate is laminated; and detaching the carrier or the ultra-thin copper layer from the carrier-attached copper foil after forming the two layers including the resin layer and the circuit.

21 . A method of manufacturing a printed wiring board comprising:
providing two layers including a resin layer a

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Moriyama Terumasa
• Nagaura Tomota

Classifications

• H10W70/095

  of vias therein · CPC title

• H10W70/66

  Conductive materials thereof · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H01L21/4857 Primary

  Electricity · mapped topic

• H05K3/4682

  Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil · CPC title