Copper foil for printed circuit

Patent metadata

Field	Value
Publication number	US-9580829-B2
Application number	US-201113635147-A
Country	US
Kind code	B2
Filing date	Feb 3, 2011
Priority date	May 7, 2010
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

Disclosed is a copper foil for printed circuits prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer; in which the average particle size of the primary particle layer is 0.25 to 0.45 μm, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

First claim

The invention claimed is:

1. A copper foil for printed circuits prepared by forming a roughening primary particle layer of copper on a surface of a copper foil, and then forming a roughening secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the roughening primary particle layer; wherein the surface is to be bonded to a resin base layer, the average particle size of the roughening primary particle layer is 0.25 to 0.45 μm, the average particle size of the roughening secondary particle layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm, and 10 to 30 mg/dm 2 of copper, 100 to 3000 μg/dm 2 of cobalt, and 50 to 500 μg/dm 2 of nickel are deposited in the roughening secondary particle layer based on the ternary alloy.

2. The copper foil for printed circuits according to claim 1 , wherein the roughening primary particle layer and the roughening secondary particle layer are electroplated layers.

3. The copper foil for printed circuits according to claim 2 , wherein the roughening secondary particle layer includes one or more dendritic particles grown on the roughening primary particle layer.

4. The copper foil for printed circuits according to claim 3 , wherein a bonding strength of the roughening primary particle layer and the roughening secondary particle layer is 0.80 kg/cm or more.

5. The copper foil for printed circuits according to claim 4 , wherein the bonding strength of the roughening primary particle layer and the roughening secondary particle layer is 0.90 kg/cm or more.

6. The copper foil for printed circuits according to claim 5 , wherein a roughness, Rz, of a surface formed by the roughening primary particle layer and the roughening secondary particle layer is 1.5 μm or less.

7. The copper foil for printed circuits according to claim 5 , wherein a roughness, Rz, of a surface formed by the roughening primary particle layer and the roughening secondary particle layer is 1.0 μm or less.

8. The copper foil according to claim 1 , wherein the roughening secondary particle layer includes one or more dendritic particles grown on the roughening primary particle layer.

9. The copper foil according to claim 1 , wherein a bonding strength of the roughening primary particle layer and the roughening secondary particle layer is 0.80 kg/cm or more.

10. The copper foil according to claim 9 , wherein the bonding strength of the roughening primary particle layer and the roughening secondary particle layer is 0.90 kg/cm or more.

11. The copper foil according to claim 1 , wherein a roughness, Rz, of a surface formed by the roughening primary particle layer and the roughening secondary particle layer is 1.5 μm or less.

12. The copper foil according to claim 1 , wherein a roughness, Rz, of a surface formed by the roughening primary particle layer and the roughening secondary particle layer is 1.0 μm or less.

13. The copper foil for printed circuits according to claim 1 , wherein the average particle size of the roughening primary particle layer is 0.35 to 0.45 μm.

14. The copper foil for printed circuits according to claim 1 , wherein the average particle size of the roughening secondary particle layer is 0.15 to 0.25 μm.

15. The copper foil for printed circuits according to claim 1 , wherein a cobalt-nickel alloy plated layer is formed as a heatproof layer on the roughening secondary particle layer.

16. The copper foil for printed circuits according to claim 1 , wherein a zinc-nickel alloy plated layer is formed as a heatproof layer on the roughening secondary particle layer.

17. The copper foil for printed circuits according to claim 1 , wherein a cobalt-nickel alloy plated layer is formed as a heatproof layer on the roughening secondary particle layer and a zinc-nickel alloy plated layer is further formed as a heatproof layer on the cobalt-nickel alloy plated layer.

18. A copper-clad laminate manufactured from the copper foil for printed circuits according to claim 1 , wherein the surface of the copper foil having the roughening primary particle layer and roughening secondary particle layer formed thereon is bonded to a resin base layer.

19. A printed circuit board manufactured from the copper foil for printed circuits according to claim 1 .

20. An electronic equipment comprising the printed circuit board according to claim 19 .

Assignees

• Arai Hideta
• Miki Atsushi
• Jx Nippon Mining & Metals Corp

Inventors

• Arai Hideta
• Miki Atsushi

Classifications

• H05K2203/0307

  Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · CPC title

• C25D3/58

  containing more than 50% by weight of copper · CPC title

• H05K3/384

  by plating · CPC title

• H05K3/20

  by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} · CPC title

• C25D3/562

  containing more than 50% by weight of iron or nickel or cobalt · CPC title