Security mesh and method of making

Patent metadata

Field	Value
Publication number	US-2017171964-A1
Application number	US-201615271800-A
Country	US
Kind code	A1
Filing date	Sep 21, 2016
Priority date	Dec 15, 2015
Publication date	Jun 15, 2017
Grant date	—

Abstract

A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

First claim

1 . A method of making a security mesh comprising:
indenting an aluminum film having a first surface and an opposite second surface to form a pattern of indentations in the first surface; anodizing the resulting indented aluminum film to convert the aluminum film to an alumina film having a first surface and an opposite second surface and to form from the indentations through-holes extending through the resulting alumina film; depositing a conductive metal onto the first surface of the alumina film to form a plurality of through-wires in the through-holes and a first metal film on the first surface of the alumina film, the through-wires having respective first ends at or adjacent to the first surface of the alumina film and respective second ends at or adjacent to the second surface of the alumina film; etching the first metal film to form on the first surface of the alumina film a plurality of first metal surface wires connecting the first ends of selected through-wires to each other to thereby form a partially wired alumina film; applying a second metal film to the second surface of the alumina film; and etching the second metal film to form on the second surface of the alumina film a plurality of second metal surface wires connecting the second ends of selected through-wires to each other, the first and second surface wires being connected to the through-wires so as to form a continuous undulating wire circuit extending through the alumina film.

2 . The method of claim 1 wherein the conductive metal comprises copper.

3 . (canceled)

4 . The method of claim 1 wherein the conductive metal comprises copper and the aluminum film has a thickness of from about 10 to about 100 nanometers.

5 . The method of claim 1 further comprising forming the plurality of metal through-wires by electroplating the conductive metal onto the first surface of the alumina film, and forming the first metal film in a separate metal sputtering step.

6 . The method of claim 2 wherein the conductive substrate is selected from the group consisting of graphite and copper.

7 . The method of claim 6 wherein the conductive metal comprises copper.

8 . The method of claim 2 further comprising applying a first protective layer to the first metal film after stripping of the first photoresist layer and then curing the first protective layer, applying a second protective layer to the second metal film after stripping the second photoresist layer, and then curing the second protective layer.

9 . The method of claim 8 wherein the first protective layer comprises a first epoxy layer and the second protective layer comprises a second epoxy layer.

10 . The method of claim 2 further comprising applying an adhesion layer onto the conductive substrate and then depositing the aluminum film onto the adhesion layer, and then removing the adhesion layer prior to releasing the partially wired alumina film from the substrate.

11 . The method of claim 10 wherein the adhesion layer comprises a titanium-tungsten alloy layer.

12 - 17 . (canceled)

18 . A security mesh comprising:
an alumina film having a first surface and an opposite second surface; a plurality of metal through-wires extending from the first surface to the second surface, the through-wires terminating in respective opposite first and second ends with the first ends exposed to the first surface and the second ends exposed to the second surface; first metal surface wires disposed on the first surface and connecting selected ones of the first ends in electric conducting communication with each other, and second surface wires disposed on the second surface and connecting selected ones of the second ends in electric conducting communication with each other, to provide a continuous undulating metal wire circuit extending through the alumina film.

19 . The security mesh of claim 18 wherein the metal comprises copper and further comprising a first protective layer disposed over the first metal surface wires and the first surface of the alumina film and coextensive with the first surface, and a second protective layer disposed over the second metal surface wires and the second surface of the alumina film and coextensive with the second surface.

20 . A stacked security mesh comprising two or more of the security mesh of claim 18 superimposed over each other.

21 . The security mesh of claim 18 wherein the aluminum film has a thickness of form about 10 to about 100 nanometers.

22 . The security mesh of claim 19 wherein the first protective layer comprises a first epoxy layer and the second protective layer comprises a second epoxy layer.

23 . The security mesh of claim 18 made by indenting an aluminum film having a first surface and an opposite second surface to form a pattern of indentations in the first surface, and anodizing the resulting indented aluminum film to convert the aluminum film to the alumina film having a first surface and an opposite second surface, and to form from the indentations through-holes extending through the resulting alumina film;
depositing a conductive metal onto the first surface of the alumina film to form a plurality of the through-wires in the through-holes and a first metal film on the first surface of the alumina film, the through-wires having respective first ends at or adjacent to the first surface of the alumina film and respective second ends at or adjacent to the second surface of the alumina film;
etching the first metal film to form on the first surface of the alumina film a plurality of the first metal surface wires connecting the first ends of selected through-wires to each other to thereby form a partially wired alumina film;
applying a second metal film to the second surface of the alumina film; and
etching the second metal film to form on the second surface of the alumina film a plurality of the second metal surface wires connecting the second ends of selected through-wires to each other, the first and second surface wires being connected to the through-wires so as to form the continuous undulating wire circuit extending through the alumina film.

24 . The security mesh of claim 23 made by depositing the aluminum film on a conductive substrate with the first surface of the aluminum film exposed and the second surface facing the substrate, prior to anodizing the aluminum film;
applying a first photoresist layer to the first metal film and removing a patterned portion of the first photoresist layer to expose portions of the first metal film, etching the exposed portions of the first metal film to form the first metal surface wires, and then stripping the first photoresist layer from the first metal film;
releasing the resulting partially wired alumina film from the conductive substrate to expose the second surface of the alumina film prior to applying the second metal film to the second surface of the alumina film;
applying a second photoresist layer to the second metal film and removing a patterned portion of the second photoresist layer to expose portions of the second metal film; and
etching the exposed portions of the second metal film to form the second metal surface wires and then stripping the second photoresist layer from the second metal film.

Assignees

• IBM

Inventors

• Arvin Charles L
• Erwin Brian M

Classifications

• H10W42/40

  protecting against tampering, e.g. unauthorised inspection or reverse engineering · CPC title

• H05K1/0275 Primary

  Security details, e.g. tampering prevention or detection · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title