Method of attaching an electronic part to a copper plate having a surface roughness

Patent metadata

Field	Value
Publication number	US-9831157-B2
Application number	US-201414917095-A
Country	US
Kind code	B2
Filing date	Sep 2, 2014
Priority date	Sep 9, 2013
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

In a method for producing an electronic part mounting substrate wherein an electronic part 14 is mounted on one major surface (a surface to which the electronic part 14 is to be bonded) of the metal plate 10 of copper, or aluminum or the aluminum alloy (when a plating film 20 of copper is formed on the surface), the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) is surface-machined to be coarsened so as to have a surface roughness of not less than 0.4 μm, and then, a silver paste is applied on the surface-machined major surface (or the surface-machined surface of the plating film 20 of copper) to arrange the electronic part 14 thereon to sinter silver in the silver paste to form a silver bonding layer 12 to bond the electronic part 14 to the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) with the silver bonding layer 12.

First claim

The invention claimed is:

1. A method for producing an electronic part mounting substrate wherein an electronic part is mounted on one side of a copper plate or copper-plated plate, the method comprising the steps of:
surface-machining the one side of the copper plate or copper-plated plate to cause the surface roughness thereof to be 0.4 μm or more;
applying a silver paste on the surface-machined side of the copper plate or copper-plated plate;
arranging the electronic part on the silver paste applied on the surface-machined side of the copper plate or copper-plated plate; and
sintering silver in the silver paste to form a silver bonding layer to bond the electronic part to the surface-machined side of the copper plate or copper-plated plate with the silver bonding layer,
wherein said copper plate or copper-plated plate is annealed before said silver paste is applied after said surface machining is carried out.

2. A method for producing an electronic part mounting substrate as set forth in claim 1 , wherein said surface machining is a wet blasting.

3. A method for producing an electronic part mounting substrate as set forth in claim 1 , wherein said annealing causes said copper plate or copper-plated plate to have a Vickers hardness Hv of not greater than 40.

4. A method for producing an electronic part mounting substrate as set forth in claim 1 , wherein said sintering is carried out by heating while pressing said electronic part against said copper plate or copper-plated plate.

5. A method for producing an electronic part mounting substrate as set forth in claim 1 , wherein a surface of said electronic part to be bonded to said surface-machined side of the copper plate or copper-plated plate is plated with at least one metal, which is selected from the group consisting of gold, silver and palladium, or an alloy thereof.

6. A method for producing an electronic part mounting substrate as set forth in claim 1 , wherein one side of a ceramic substrate is bonded to the other side of said copper plate or copper-plated plate.

7. A method for producing an electronic part mounting substrate as set forth in claim 6 , wherein a metal base plate is bonded to the other side of said ceramic substrate.

Assignees

• Dowa Metaltech Co Ltd

Inventors

• Sunachi Naoya
• Osanai Hideyo
• Kurita Satoru

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07311

  Treating the bonding area before connecting, e.g. by applying flux or cleaning · CPC title