Production method and device of surface roughened copper plate, and surface roughened copper plate

Patent metadata

Field	Value
Publication number	US-9758890-B2
Application number	US-201414337264-A
Country	US
Kind code	B2
Filing date	Jul 22, 2014
Priority date	Mar 2, 2007
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein.
MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes ( 3, 3 ) as a similar pole for therebetween to be opposed to each other in an electroplating copper solution 2 , and then to be arranged a copper plate 4 at therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate 4 , by performing an electrolytic process with the copper plate 4 as a positive electrode and the electrodes 3 as negative electrodes. And then thereafter there becomes to be performed a cathodic treatment, by performing an electroplating of copper with the copper plate 4 as a negative electrode and the electrodes 3 as positive electrodes, for the copper fine particles to be fixed onto the surfaces of the copper plate 4 . Furthermore, there becomes to be formed the above mentioned protrusion with the fine bump shape thereon, by performing the anodic treatment and then the cathodic treatment as not less than one cycle thereof.

First claim

What is claimed is:

1. A rolled copper plate with a roughened surface having a predetermined hole formed at a predetermined position thereof, a thickness of the rolled copper plate being between 100 μm and 500 μm, a surface of the rolled copper plate having a grain size between 0.5 μm and 3.0 μm and a surface roughness Rz between 7 μm and 16 μm,
wherein said predetermined hole includes a roughened inner surface having a protrusion with a fine bump shape thereon, and
said protrusion with the fine bump shape has a height not higher than 20 μm.

2. The rolled copper plate according to claim 1 , said roller copper plate being produced through the steps of:
arranging electrodes with a same polarity to face each other in an electroplating copper solution;
arranging the rolled copper plate between the electrodes;
performing an anodic treatment to form a copper fine particle on both surfaces of the rolled copper plate through an electrolytic process with the copper plate as a positive electrode and the electrodes as a negative electrode; and
performing a cathodic treatment to fix the copper fine particle to the surfaces of the rolled copper plate to form the roughened surface through a copper electroplating with the copper plate as a negative electrode and the electrodes as a positive electrode.

Assignees

• Furukawa Electric Co Ltd

Inventors

• Watanabe Hajime
• Ishihama Sadao
• Yamamoto Kiyoteru
• Imai Takahiro
• Oyoshi Toshihiro

Classifications

• H05K2203/1572

  Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides · CPC title

• H05K2203/0723

  Electroplating, e.g. finish plating · CPC title

• H05K1/056

  the metal substrate being covered by an organic insulating layer · CPC title

• H05K3/384

  by plating · CPC title

• Y10S205/92

  Electrolytic coating of circuit board or printed circuit, other than selected area coating · CPC title