Printed wiring board and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016316558-A1
Application number	US-201615084992-A
Country	US
Kind code	A1
Filing date	Mar 30, 2016
Priority date	Apr 24, 2015
Publication date	Oct 27, 2016
Grant date	—

Abstract

A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R 1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R 2, and the first and second roughnesses R 1, R 2 satisfy R 1> R 2.

First claim

What is claimed is:

1 . A printed wiring board, comprising:
a resin insulating layer; a wiring conductor layer embedded in the resin insulating layer such that the wiring conductor layer has a first surface exposed from the resin insulating layer; and a conductor post formed in the resin insulating layer and on a second surface of the wiring conductor layer on an opposite side with respect to the first surface of the wiring conductor layer such that the conductor post has a side surface covered by the resin insulating layer and an end surface exposed from the resin insulating layer on an opposite side with respect to the wiring conductor layer, wherein the conductor post is formed such that the side surface of the conductor post is a roughened side surface having a surface roughness of a first roughness R 1 , the end surface of the conductor post is a roughened end surface having a surface roughness of a second roughness R 2 , and the first roughness R 1 and the second roughness R 2 satisfy R 1 >R 2 .

2 . A printed wiring board according to claim 1 , wherein the side surface of the conductor post is formed such that the first roughness R 1 is an arithmetic average roughness Ra 1 in a range of from 0.4 μm to 1.5 μm.

3 . A printed wiring board according to claim 1 , wherein the end surface of the conductor post is formed such that the second roughness R 2 is an arithmetic average roughness Ra 2 in a range of from 0.1 μm to 0.6 μm.

4 . A printed wiring board according to claim 1 , wherein the conductor post is formed such that the conductor post has one of a circular form, an elliptical form, a square form, a rectangular form and diamond form on a planar surface.

5 . A printed wiring board according to claim 1 , wherein the resin insulating layer comprises a mold resin material which has a thermal expansion coefficient in a range of 6 ppm/° C. to 25 ppm/° C. and an elastic modulus in a range of 5 GPa to 30 GPa or less.

6 . A printed wiring board according to claim 1 , wherein the mold resin material comprises an epoxy resin and an inorganic filler in an amount of 70% by weight to 95% by weight in the epoxy resin.

7 . A printed wiring board according to claim 1 , wherein the end surface of the conductor post is recessed relative to a surface of the resin insulating layer in a recess amount of 3 μm to 15 μm, and the first surface of the wiring conductor layer is recessed relative to a surface of the resin insulating layer in a recess amount of 0.1 μm to 6 μm.

8 . A printed wiring board according to claim 1 , wherein the wiring conductor layer has a roughed surface including a side surface and a portion of the second surface exposed from the conductor post such that the roughened surface of the wiring conductor has a surface roughness which is equal to the surface roughness of the first roughness R 1 .

9 . A printed wiring board according to claim 1 , further comprising:
a surface protection film formed on the end surface of the conductor post.

10 . A printed wiring board according to claim 9 , further comprising:
a surface protection film formed on the first surface of the wiring conductor layer such that the surface protection film on the wiring conductor layer comprises a material which is different from a material of the surface protection film on the conductor post.

11 . A printed wiring board according to claim 9 , further comprising:
a solder layer coated on the end surface of the conductor post.

12 . A printed wiring board according to claim 2 , wherein the end surface of the conductor post is formed such that the second roughness R 2 is an arithmetic average roughness Ra 2 in a range of 0.1 μm to 0.6 μm.

13 . A printed wiring board according to claim 12 , wherein the end surface of the conductor post is recessed relative to a surface of the resin insulating layer in a recess amount of 3 μm to 15 μm, and the first surface of the wiring conductor layer is recessed relative to a surface of the resin insulating layer in a recess amount of 0.1 μm to 6 μm.

14 . A method for manufacturing a printed wiring board, comprising:
forming a wiring conductor layer on a base metal foil such that the wiring conductor layer has a pattern; forming a conductor post on the wiring conductor layer; applying a roughening treatment to at least a side surface of the conductor post such that the side surface of the conductor post has a surface roughness of a first roughness R 1 ; forming a resin insulating layer such that the resin insulating layer covers at least the side surface of the conductor post and an end surface of the conductor post on an opposite side with respect to the wiring conductor layer; polishing the resin insulating layer such that the end surface of the conductor post is exposed from the resin insulating layer and has a surface roughness which is smaller than the surface roughness of the first roughness R 1 ; and applying an etching solution to the wiring conductor layer and the conductor post such that the base metal foil is removed from the wiring conductor layer to expose a first surface of the wiring conductor layer and that the end surface of the conductor post has a surface roughness of a second roughness R 2 which satisfies R 1 >R 2 .

15 . A method for manufacturing a printed wiring board according to claim 14 , wherein the roughening treatment comprises one of a CZ treatment, a blacking treatment and a sandblasting.

16 . A method for manufacturing a printed wiring board according to claim 14 , wherein the etching solution is a hydrogen peroxide based etching solution.

17 . A method for manufacturing a printed wiring board according to claim 14 , wherein the forming of the wiring conductor layer comprises applying electrolytic plating such that the wiring conductor layer comprising electrolytic plating material is formed, and the forming of the conductor post comprises applying electrolytic plating such that the conductor post comprising electrolytic plating material is formed.

18 . A method for manufacturing a printed wiring board according to claim 14 , wherein the forming of the resin insulating layer comprises positioning a film comprising a mold resin material on the end surface of the conductor post and heat-pressing the film such that the resin insulating layer is formed to cover at least the side surface of the conductor post and the end surface of the conductor post on the opposite side with respect to the wiring conductor layer.

19 . A method for manufacturing a printed wiring board according to claim 14 , wherein the forming of the resin insulating layer comprises forming a dam enclosing a panel having a plurality of printed wiring boards each comprising the wiring conductor layer and the conductor post, pouring a mold resin material onto the panel, and curing the mold resin material such that the resin insulating layer is formed to cover at least the side surface of the conductor post and the end surface of the conductor post on the opposite side with respect to the wiring conductor layer.

20 . A method for manufacturing a printed wiring board according to claim 14 , wherein the polishing of the resin insulating layer comprises at least one of buff polishing and CMP polishing.

Assignees

• Ibiden Co Ltd

Inventors

• Sakai Shunsuke
• Furutani Toshiki
• Ikeda Kosuke
• Adachi Takema
• Katsuno Takayuki

Classifications

• H10W70/695

  Organic materials · CPC title

• H10W70/479

  on or in insulating or insulated package substrates, interposers, or redistribution layers · CPC title

• H10W70/095

  of vias therein · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title