Film forming method for forming metal film and film forming apparatus for forming metal film
US-11718923-B2 · Aug 8, 2023 · US
for pad-plating
for pad-plating · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D17/14 |
| Official title | for pad-plating |
| Display label | for pad-plating |
| Total patents | 74 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 10 |
| 2017 | 6 |
| 2018 | 6 |
| 2019 | 8 |
| 2020 | 7 |
| 2021 | 8 |
| 2022 | 9 |
| 2023 | 9 |
| 2024 | 6 |
| 2025 | 2 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Paddle, plating apparatus equipped with the paddle, and plating method
US-11717796-B2 · Aug 8, 2023 · US
Method for manufacturing wiring board
US-11700686-B2 · Jul 11, 2023 · US
Film forming apparatus for forming metal film and film forming method for forming metal film
US-2023122871-A1 · Apr 20, 2023 · US
Film forming method for forming metal film and film forming apparatus for forming metal film
US-2022380923-A1 · Dec 1, 2022 · US
Film forming apparatus for forming metal film
US-11459667-B2 · Oct 4, 2022 · US
Method for manufacturing wiring board
US-2022272847-A1 · Aug 25, 2022 · US
Device for microelectrodeposition through laser assisted flexible following tool electrode and deposition method using the device thereof
US-11306408-B2 · Apr 19, 2022 · US
Film formation method for metallic coating and film formation device for metallic coating
US-2022098753-A1 · Mar 31, 2022 · US
Electroplating repair machine for tack expansion and seal welding region, electroplating repair system, and operating method
US-11268205-B2 · Mar 8, 2022 · US
Method for manufacturing wiring board
US-2022061165-A1 · Feb 24, 2022 · US
Device for microelectrodeposition through laser assisted flexible following tool electrode and deposition method using the device thereof
US-2022010448-A1 · Jan 13, 2022 · US
Method for manufacturing wiring board, and wiring board
US-2022007506-A1 · Jan 6, 2022 · US
Method for producing wiring substrate
US-2021378103-A1 · Dec 2, 2021 · US
Plate, plating apparatus, and method of manufacturing plate
US-2021355596-A1 · Nov 18, 2021 · US
Method for manufacturing wiring board, and wiring board
US-2021204409-A1 · Jul 1, 2021 · US
Film forming method for metal film and film forming apparatus for metal film
US-11035049-B2 · Jun 15, 2021 · US
Paddle, plating apparatus equipped with the paddle, and plating method
US-2021154629-A1 · May 27, 2021 · US
Color Controlled Metal Finishing Pen
US-2021130972-A1 · May 6, 2021 · US
Paddle, plating apparatus equipped with the paddle, and plating method
US-10946351-B2 · Mar 16, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D17/14?
- CPC C25D17/14 is the Cooperative Patent Classification code for “for pad-plating.”
- How many patents are filed under CPC C25D17/14 (for pad-plating)?
- Our database includes 74 publications tagged with this CPC code.
- Is patent activity under CPC C25D17/14 growing?
- Publication counts under this code: 6 in 2024 vs 2 in 2025 (latest complete years).