Film forming method for forming metal film and film forming apparatus for forming metal film

Patent metadata

Field	Value
Publication number	US-2022380923-A1
Application number	US-202217804717-A
Country	US
Kind code	A1
Filing date	May 31, 2022
Priority date	Jun 1, 2021
Publication date	Dec 1, 2022
Grant date	—

Abstract

Provided is a method for forming a metal film capable of forming a homogeneous metal film having a uniform film thickness by stably ensuring a fluid pressure of an electrolytic solution during film formation. The method places a substrate on a mount base. While sucking a gas between the substrate and a porous film through which the electrolytic solution can pass from a suction port of a suction passage formed on the mount base, the method brings the porous film into contact with the surface of the substrate. The method interrupts the suction passage while the porous film contacts the surface of the substrate. While interrupting the suction passage, the method allows the electrolytic solution to pass through the porous film while pressing the porous film against the surface of the substrate with a fluid pressure of the electrolytic solution and deposits metal from metal ions in the passed electrolytic solution on the surface of the substrate, thereby forming the metal film.

First claim

What is claimed is:

1 . A film forming method for forming a metal film from metal ions contained in an electrolytic solution on a surface of a substrate by depositing metal on the surface of the substrate by electroplating or electroless plating, the film forming method comprising at least:
placing the substrate on a mount base; while sucking a gas between the substrate and a porous film from a suction port of a suction passage formed on the mount base, moving the porous film toward the substrate and bringing the porous film into contact with the surface of the substrate; interrupting the suction passage in a state where the porous film is in contact with the surface of the substrate; and in a state where the suction passage is interrupted, allowing the electrolytic solution to pass through the porous film while the porous film is pressed against the substrate with a fluid pressure of the electrolytic solution and depositing the metal from the metal ions contained in the passed electrolytic solution on the surface of the substrate, thereby forming the metal film on the surface of the substrate.

2 . The film forming method for forming a metal film according to claim 1 ,
wherein: allowing the interrupted suction passage to be communicated to atmosphere after the forming the metal film; and separating the porous film from the substrate after the suction passage is communicated to the atmosphere.

3 . The film forming method for forming a metal film according to claim 1 , wherein in the bringing the porous film into contact with the surface of the substrate, separating, from the gas, the electrolytic solution having been sucked into the suction passage together with the gas during suction of the gas.

4 . A film forming apparatus for forming a metal film from metal ions contained in an electrolytic solution on a surface of a substrate by depositing metal on the surface of the substrate by electroplating or electroless plating, the film forming apparatus comprising at least:
a housing configured to store the electrolytic solution; a porous film attached to the housing so as to seal the electrolytic solution stored in the housing and to be opposed to the substrate; a fluid pressure adjusting device configured to adjust a fluid pressure of the electrolytic solution stored in the housing; a mount base configured to have the substrate placed thereon, the mount base including a suction passage with a suction port for sucking a gas between the substrate and the porous film; an elevating device configured to move the housing upward and downward with respect to the mount base; a suction device coupled to the suction passage via an on-off valve and configured to suck a fluid in the suction passage; and a control device configured to control at least adjustment of a fluid pressure by the fluid pressure adjusting device, upward and downward movement of the elevating device, suction by the suction device, and opening and closing of the on-off valve, wherein the control device comprises at least: a suction execution unit configured to execute suction by the suction device in a state where the on-off valve is open; a lowering control unit configured to control lowering of the housing by the elevating device to a position where the porous film comes into contact with the substrate during suction by the suction device; a valve-closing control unit configured to control the on-off valve to be closed after the porous film comes into contact with the substrate; a fluid pressure increasing unit configured to make the fluid pressure adjusting device increase the fluid pressure of the electrolytic solution after the on-off valve is closed; and a film-formation execution unit configured to form the metal film on the surface of the substrate while maintaining the increased fluid pressure.

5 . The film forming apparatus for forming a metal film according to claim 4 ,
wherein:
the suction passage is coupled to a communication passage for allowing the suction passage to be communicated to atmosphere;
the communication passage is provided with an atmosphere release valve for allowing the suction passage to be communicated to atmosphere and for interrupting the suction passage communicated to atmosphere; and
the control device further comprises:
a communication interrupting unit configured to control the atmosphere release valve to be closed to interrupt the suction passage communicated to atmosphere before the suction execution unit starts suction and until the lowering control unit brings the porous film into contact with the substrate;
a communication control unit configured to control the atmosphere release valve to be open to allow the suction passage to be communicated to atmosphere after the film-formation execution unit forms the metal film; and
a lifting control unit configured to control lifting of the housing by the elevating device after the suction passage is communicated to atmosphere by the communication control unit.

6 . The film forming apparatus for forming a metal film according to claim 4 , further comprising:
a gas-liquid separator provided downstream of the on-off valve and configured to separate the electrolytic solution from the gas; and a collection tank configured to collect the separated electrolytic solution.

Assignees

• Toyota Motor Co Ltd

Inventors

• Sato Yuki

Classifications

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D5/003 Primary

  Electroplating using gases, e.g. pressure influence · CPC title

• C25D5/605

  Surface topography of the layers, e.g. rough, dendritic or nodular layers · CPC title

• C25D17/00

  Constructional parts, or assemblies thereof, of cells for electrolytic coating · CPC title