Method for manufacturing wiring board

Patent metadata

Field	Value
Publication number	US-2022272847-A1
Application number	US-202217672067-A
Country	US
Kind code	A1
Filing date	Feb 15, 2022
Priority date	Feb 19, 2021
Publication date	Aug 25, 2022
Grant date	—

Abstract

First, a patterned substrate including an insulating substrate, a conductive seed layer, and an insulating layer is prepared. The seed layer is disposed on the insulating substrate, and consists of a first part having a predetermined pattern corresponding to the wiring pattern and a second part as a part other than the first part. The insulating layer is disposed on the second part of the seed layer. Subsequently, a metal layer having a thickness larger than a thickness of the insulating layer is formed on the first part of the seed layer. Here, a voltage is applied between an anode and the seed layer while a resin film containing a metal ion-containing solution is disposed between the patterned substrate and the anode and the resin film and the seed layer are brought into pressure contact. Subsequently, the insulating layer and the second part of the seed layer are removed.

First claim

What is claimed is:

1 . A method for manufacturing a wiring board including an insulating substrate and a wiring layer, the wiring layer being disposed on the insulating substrate and having a predetermined wiring pattern, the method comprising:
preparing a patterned substrate;
wherein the patterned substrate includes:
the insulating substrate,
a conductive seed layer disposed on the insulating substrate, the seed layer consisting of a first part having a predetermined pattern corresponding to the wiring pattern and a second part as a part other than the first part, and
an insulating layer disposed on the second part of the seed layer;

forming a metal layer on the first part of the seed layer, the metal layer having a thickness larger than a thickness of the insulating layer,
wherein a voltage is applied between an anode and the seed layer while a resin film containing a metal ion-containing solution is disposed between the patterned substrate and the anode and the resin film and the seed layer are brought into pressure contact with each other; and
removing the insulating layer and the second part of the seed layer.

2 . The method according to claim 1 ,
wherein the preparing the patterned substrate includes:
forming the insulating layer on the first part and the second part of the seed layer; and
irradiating the insulating layer on the first part with a laser beam to remove the insulating layer on the first part.

3 . The method according to claim 2 ,
wherein the seed layer has a thickness of 80 nm or more.

4 . The method according to claim 2 ,
wherein the laser beam has a wavelength of 580 nm or less and a pulse width of 15 ps or less.

5 . The method according to claim 4 ,
wherein the laser beam has the pulse width of 1 ps or less.

6 . The method according to claim 4 ,
wherein the laser beam has the wavelength of 400 nm or less.

7 . The method according to claim 1 ,
wherein the insulating layer has the thickness of less than 12.5 μm.

8 . The method according to claim 1 ,
wherein the preparing the patterned substrate includes:
forming the insulating layer on the first part and the second part of the seed layer;
irradiating the insulating layer on any of the first part or the second part with a laser beam; and
dissolving the insulating layer on the first part with a developer to remove the insulating layer on the first part.

9 . The method according to claim 1 ,
wherein the insulating layer includes a main insulating layer disposed on the second part of the seed layer and a water-repellent layer disposed on the main insulating layer.

10 . The method according to claim 9 ,
wherein a surface of the water-repellent layer has a water contact angle of more than 90 degrees.

11 . The method according to claim 1 ,
wherein the resin film is a solid-state electrolyte membrane.

Assignees

• Toyota Motor Co Ltd

Inventors

• Kondoh Haruki
• Mori Rentaro
• Kuroda Keiji
• Okamoto Kazuaki
• Kato Akira
• Murai Jyunya
• Yanagimoto Hiroshi
• Nakamura Kenji
• Okazaki Tomoya

Classifications

• H05K3/20

  by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} · CPC title

• H05K3/101 Primary

  by casting or moulding of conductive material · CPC title

• H05K3/108 Primary

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• H05K3/0026

  by laser ablation · CPC title

• H05K3/381

  by special treatment of the substrate · CPC title