Film forming method for forming metal film and film forming apparatus for forming metal film

Patent metadata

Field	Value
Publication number	US-11718923-B2
Application number	US-202217804717-A
Country	US
Kind code	B2
Filing date	May 31, 2022
Priority date	Jun 1, 2021
Publication date	Aug 8, 2023
Grant date	Aug 8, 2023

Abstract

Provided is a method for forming a metal film capable of forming a homogeneous metal film having a uniform film thickness by stably ensuring a fluid pressure of an electrolytic solution during film formation. The method places a substrate on a mount base. While sucking a gas between the substrate and a porous film through which the electrolytic solution can pass from a suction port of a suction passage formed on the mount base, the method brings the porous film into contact with the surface of the substrate. The method interrupts the suction passage while the porous film contacts the surface of the substrate. While interrupting the suction passage, the method allows the electrolytic solution to pass through the porous film while pressing the porous film against the surface of the substrate with a fluid pressure of the electrolytic solution and deposits metal from metal ions in the passed electrolytic solution on the surface of the substrate, thereby forming the metal film.

First claim

What is claimed is:

1. A film forming method for forming a metal film from metal ions contained in an electrolytic solution on a surface of a substrate by depositing metal on the surface of the substrate by electroplating or electroless plating, the film forming method comprising at least:
placing the substrate on a mount base;
while sucking a gas between the substrate and a porous film from a suction port of a suction passage formed on the mount base, the suction passage connecting a suction pump to the suction port, moving the porous film toward the substrate and bringing the porous film into contact with the surface of the substrate;
stopping suction from the suction pump in the suction passage in a state where the porous film is in contact with the surface of the substrate; and
in a state where suction in the suction passage is stopped, allowing the electrolytic solution to pass through the porous film while the porous film is pressed against the substrate with a fluid pressure of the electrolytic solution and depositing the metal from the metal ions contained in the passed electrolytic solution on the surface of the substrate, thereby forming the metal film on the surface of the substrate.

2. The film forming method for forming a metal film according to claim 1 , wherein:
allowing the suction passage to be communicated to atmosphere after the forming the metal film; and
separating the porous film from the substrate after the suction passage is communicated to the atmosphere.

3. The film forming method for forming a metal film according to claim 1 , wherein in the bringing the porous film into contact with the surface of the substrate, separating, from the gas, the electrolytic solution having been sucked into the suction passage together with the gas during suction of the gas.

Assignees

• Toyota Motor Co Ltd

Inventors

• Sato Yuki

Classifications

• C25D5/003 Primary

  Electroplating using gases, e.g. pressure influence · CPC title

• C25D5/06

  Brush or pad plating · CPC title

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25D17/14

  for pad-plating · CPC title

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title