Device for microelectrodeposition through laser assisted flexible following tool electrode and deposition method using the device thereof

Patent metadata

Field	Value
Publication number	US-11306408-B2
Application number	US-202017296552-A
Country	US
Kind code	B2
Filing date	Jan 19, 2020
Priority date	Feb 20, 2019
Publication date	Apr 19, 2022
Grant date	Apr 19, 2022

Abstract

Disclosed are a device and a method for microelectrodeposition through a laser assisted flexible following tool electrode. Localization of electrodeposition and dimensional precision of members are enhanced by using the flexible following tool electrode to restrict a dispersion region of an electric field and a reaction region of electrodeposition, and a complex-shaped member can be deposited by controlling a motion path of the flexible following tool electrode. Since a laser has a high power density, introducing laser irradiation changes an electrode state in a radiated region, accelerates ion diffusion and electron transfer speeds, and increases a deposition rate, thus reducing defects such as pitting and cracking in a deposit, enhancing deposition quality, and achieving fabrication of a micro-part by a synergistic action of both electrochemical energy and laser energy.

First claim

What is claimed is:

1. A device for microelectrodeposition through a laser assisted flexible following tool electrode, comprising a workpiece processing system, a laser irradiation system, and a motion control system, wherein
the workpiece processing system comprises an X-Y two-coordinate workbench, a vertical lifting workbench, a direct current (DC) pulse power supply, a working tank, a flexible following tool anode, and a cathode substrate;
the flexible following tool anode is connected to a positive electrode of the DC pulse power supply and is clamped by a work arm of the X-Y two-coordinate workbench; the cathode substrate is connected to a negative electrode of the DC pulse power supply; the flexible following tool anode and the cathode substrate are both arranged in an electrolyte in the working tank, and when energized, an electrochemical loop is formed; and the working tank is arranged on the vertical lifting workbench;
the laser irradiation system comprises a pulsed laser, a reflector, and a focusing lens; a laser beam emitted by the pulsed laser is reflected by the reflector, then focused by the focusing lens, and then irradiated on a lower section of the flexible following tool anode; and
the motion control system comprises a computer and a motion control card; the computer controls the pulsed laser and the motion control card, and the motion control card controls the X-Y two-coordinate workbench and the vertical lifting workbench;
wherein the flexible following tool anode comprises an upper section, an elastic middle section, and the lower section, and the upper section and the lower section are connected by the elastic middle section; the upper section comprises an insoluble metal wire with sidewall insulation, and the lower section comprises a shielding deposition mold with a hollow structure.

2. The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 1 , wherein the shielding deposition mold is made of a light-transmitting material.

3. The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 1 , wherein an insulating glass tube is used to the insoluble metal wire for the sidewall insulation.

4. The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 1 , further comprising a working fluid circulation system, the working fluid circulation system comprises a reservoir, a micropump, a filter, and a throttle valve; the micropump has a port connected to the reservoir and an outlet connected to the working tank, and the filter and the throttle valve are connected in series in the loop.

5. The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 1 , wherein the workpiece processing system further comprises an oscilloscope; and the oscilloscope is connected to the DC pulse power supply.

6. The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 1 , wherein the elastic middle section is a flexible spring.

Assignees

• Univ Jiangsu

Inventors

• Zhang Zhaoyang
• Wu Yucheng
• Xu Kun
• Dai Xueren
• Wang Anbin
• Gu Qinming
• Wang Hong

Classifications

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D21/06

  Filtering {particles other than ions (filtering ions C25D21/22)} · CPC title

• C25D5/04

  Electroplating with moving electrodes · CPC title

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title