Paddle, plating apparatus equipped with the paddle, and plating method

Patent metadata

Field	Value
Publication number	US-11717796-B2
Application number	US-202117169130-A
Country	US
Kind code	B2
Filing date	Feb 5, 2021
Priority date	Feb 6, 2017
Publication date	Aug 8, 2023
Grant date	Aug 8, 2023

Abstract

A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate is disclosed. The paddle includes a plurality of vertically-extending agitation rods. Each agitation rod includes: a planar portion perpendicular to a reciprocating direction of the paddle; two slope surfaces extending from side ends of the planar portion in directions closer to each other, the two slope surfaces being symmetric with respect to a center line of the agitation rod, the center line being perpendicular to the planar portion; and a tip portion connected with the two slope surfaces.

First claim

What is claimed is:

1. A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate, comprising:
a plurality of agitation rods being parallel to the surface of the substrate,
wherein each of the agitation rods includes:
a planar portion perpendicular to a reciprocating direction of the paddle, the planar portion forming a swirling flow of the plating solution that pulls the plating solution that has come into contact with the substrate back toward the paddle;
two slope surfaces extending from side ends of the planar portion in directions closer to each other, the two slope surfaces being symmetric with respect to a center line of the agitation rod, the center line being perpendicular to the planar portion, the two slope surfaces forming a flow that pushes the plating solution toward the surface of the substrate; and
a tip portion connected with the two slope surfaces, the tip portion facing in the reciprocating direction of the paddle,
wherein the agitation rods comprise first agitation rods facing in the same one direction and second agitation rods facing in the opposite direction, and
wherein the first agitation rods and the second agitation rods are arranged alternately.

2. The paddle according to claim 1 , wherein:
the first agitation rods are disposed at one side of a center line of the paddle;
the second agitation rods are disposed at the opposite side of the center line of the paddle; and
the first agitation rods and the second agitation rods face toward an outer side of the paddle.

3. The paddle according to claim 1 , wherein:
the first agitation rods are disposed at one side of a center line of the paddle;
the second agitation rods are disposed at the opposite side of the center line of the paddle; and
the first agitation rods and the second agitation rods face toward the center line of the paddle.

4. A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate, comprising:
a plurality of agitation rods being parallel to the surface of the substrate,
wherein each of the agitation rods includes:
a planar portion perpendicular to a reciprocating direction of the paddle, the planar portion forming a swirling flow of the plating solution that pulls the plating solution that has come into contact with the substrate back toward the paddle;
two slope surfaces extending from side ends of the planar portion in directions closer to each other, the two slope surfaces forming a flow that pushes the plating solution toward the surface of the substrate; and
a tip portion connected with the two slope surfaces, the tip portion facing in the reciprocating direction of the paddle,
wherein the agitation rods comprise first agitation rods and second agitation rods which face in opposite directions and are arranged alternately, and
wherein a distance between planar portions of a first agitation rod and an adjacent second agitation rod, facing away from each other, of the agitation rods is larger than a distance between tip portions of a first agitation rod and an adjacent second agitation rod, facing each other, of the agitation rods.

5. A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate, comprising:
a plurality of agitation rods being parallel to the surface of the substrate,
wherein each of the agitation rods includes:
a planar portion perpendicular to a reciprocating direction of the paddle;
two slope surfaces extending from side ends of the planar portion in directions closer to each other; and
a tip portion connected with the two slope surfaces,
wherein the agitation rods comprise first agitation rods and second agitation rods which face in opposite directions and are arranged alternately, and
wherein a distance between planar portions of a first agitation rod and an adjacent second agitation rod, facing away from each other, of the agitation rods is larger than a distance between tip portions of a first agitation rod and an adjacent second agitation rod, facing each other, of the agitation rods, and
wherein a volume of a first flow passage formed between the first agitation rod and the adjacent second agitation rod facing away from each other is equal to a volume of a second flow passage formed between the first agitation rod and the adjacent second agitation rod facing each other.

6. A plating apparatus comprising:
a plating tank for holding a plating solution;
an anode disposed in the plating tank;
a substrate holder for holding a substrate and disposing the substrate in the plating tank; and
the paddle according to claim 1 disposed between the anode and the substrate for agitating the plating solution by reciprocating parallel to a surface of the substrate.

7. A plating method comprising:
disposing an anode and a substrate opposite each other in a plating solution held in a plating tank; and
reciprocating the paddle according to claim 1 , disposed between the anode and the substrate, parallel to the substrate while applying a voltage between the anode and the substrate.

Assignees

• Ebara Corp

Inventors

• Masuda Yasuyuki
• Shimoyama Masashi
• Fujikata Jumpei
• Wakuda Yohei
• Chang Shao Hua

Classifications

• B01F31/441 Primary

  performing a rectilinear reciprocating movement · CPC title

• B01F31/70

  Drives therefor, e.g. crank mechanisms · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D17/02 Primary

  Tanks; Installations therefor · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title