Device for microelectrodeposition through laser assisted flexible following tool electrode and deposition method using the device thereof

Patent metadata

Field	Value
Publication number	US-2022010448-A1
Application number	US-202017296552-A
Country	US
Kind code	A1
Filing date	Jan 19, 2020
Priority date	Feb 20, 2019
Publication date	Jan 13, 2022
Grant date	—

Abstract

Disclosed are a device and a method for microelectrodeposition through a laser assisted flexible following tool electrode. Localization of electrodeposition and dimensional precision of members are enhanced by using the flexible following tool electrode to restrict a dispersion region of an electric field and a reaction region of electrodeposition, and a complex-shaped member can be deposited by controlling a motion path of the flexible following tool electrode. Since a laser has a high power density, introducing laser irradiation changes an electrode state in a radiated region, accelerates ion diffusion and electron transfer speeds, and increases a deposition rate, thus reducing defects such as pitting and cracking in a deposit, enhancing deposition quality, and achieving fabrication of a micro-part by a synergistic action of both electrochemical energy and laser energy.

First claim

1 . A device for microelectrodeposition through a laser assisted flexible following tool electrode, comprising a workpiece processing system, a laser irradiation system, and a motion control system, wherein
the workpiece processing system comprises an X-Y two-coordinate workbench, a vertical lifting workbench, a direct current (DC) pulse power supply, a working tank, a flexible following tool anode, and a cathode substrate; the flexible following tool anode is connected to a positive electrode of the DC pulse power supply and is clamped by a work arm of the X-Y two-coordinate workbench; the cathode substrate is connected to a negative electrode of the DC pulse power supply; the flexible following tool anode and the cathode substrate are both arranged in an electrolyte in the working tank, and when energized, an electrochemical loop is formed; and the working tank is arranged on the vertical lifting workbench; the laser irradiation system comprises a pulsed laser, a reflector, and a focusing lens; a laser beam emitted by the pulsed laser is reflected by the reflector, then focused by the focusing lens, and then irradiated on a lower section of the flexible following tool anode; and the motion control system comprises a computer and a motion control card; the computer controls the pulsed laser and the motion control card, and the motion control card controls the X-Y two-coordinate workbench and the vertical lifting workbench.

2 . The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 1 , wherein the flexible following tool anode comprises an upper section, an elastic middle section, and the lower section, and the upper section and the lower section are connected by the elastic middle section; the upper section comprises an insoluble metal wire with sidewall insulation, and the lower section comprises a shielding deposition mold with a hollow structure.

3 . The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 2 , wherein the shielding deposition mold is made of a light-transmitting material.

4 . The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 2 , an insulating glass tube is used to the insoluble metal wire for the sidewall insulation.

5 . The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 1 , further comprising a working fluid circulation system, the working fluid circulation system comprises a reservoir, a micropump, a filter, and a throttle valve; the micropump has a port connected to the reservoir and an outlet connected to the working tank, and the filter and the throttle valve are connected in series in the loop.

6 . The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 1 , wherein the workpiece processing system further comprises an oscilloscope; and the oscilloscope is connected to the DC pulse power supply.

7 . The device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 2 , wherein the elastic middle section is a flexible spring.

8 . A deposition method using the device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 1 , comprising the following steps:
performing a surface pretreatment on the cathode substrate; writing a program and inputting it into control software of the computer; connecting the cathode substrate to the negative electrode of the DC pulse power supply and fixing it in the working tank, and placing the working tank on the vertical lifting workbench; connecting the flexible following tool anode to the positive electrode of the DC pulse power supply, clamping it by the work arm of the X-Y two-coordinate workbench, and placing it in the working tank, the lower section of the flexible following tool anode being in close contact with the cathode substrate through the action of a flexible spring; adjusting a position of a laser spot so that the laser spot is focused above the cathode substrate in a region of a shielding deposition mold; adding a deposition solution, so that the cathode substrate and a part of the upper section of the flexible following tool anode are immersed in the deposition solution; turning on a micropump to circulate the deposition solution to ensure a uniform concentration of the deposition solution in the working tank; and turning on the pulsed laser, and at the same time, controlling the motion path of the X-Y two-coordinate workbench according to written code, so that a desired shape is deposited in the shielding deposition mold.

9 . The deposition method using the device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 8 , wherein the cathode substrate is subjected to polishing, degreasing, water washing, weak erosion, water washing, and drying pretreatment in sequence, and the DC pulse power supply has a voltage adjustable in a range of 0 to 20 V, and a duty cycle of 0 to 100%.

10 . The deposition method using the device for microelectrodeposition through the laser assisted flexible following tool electrode according to claim 8 , wherein the pulsed laser is one selected from a group consisting of an excimer laser, a fiber laser, and a yttrium aluminium garnet (YAG) laser, and a laser focus is focused at a position 0.1 mm to 1 mm above the cathode substrate; a liquid level of the deposition solution immerses the upper section of the flexible following tool anode by 2 mm to 10 mm, and the deposition solution is maintained at a temperature of 20° C. to 70° C.

Assignees

• Univ Jiangsu

Inventors

• Zhang Zhaoyang
• Wu Yucheng
• Xu Kun
• Dai Xueren
• Wang Anbin
• Gu Qinming
• Wang Hong

Classifications

• C25D21/06

  Filtering {particles other than ions (filtering ions C25D21/22)} · CPC title

• C25D5/04

  Electroplating with moving electrodes · CPC title

• C25D21/18

  of electrolytes (C25D21/22 takes precedence) · CPC title

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title

• C25D17/14

  for pad-plating · CPC title